AMD Ryzen 3 110
AMD processor specifications and benchmark scores
Integrated GPU
ECC MemoryAt a Glance
AMDAMD Ryzen 3 110 Specifications
Ryzen 3 110 Core Configuration
Processing cores and threading
The AMD Ryzen 3 110 features 4 physical cores and 8 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.
3 110 Clock Speeds
Base and boost frequencies
Clock speed is a critical factor in Ryzen 3 110 benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Ryzen 3 110 by AMD can dynamically adjust its frequency based on workload and thermal headroom.
AMD's Ryzen 3 110 Cache Hierarchy
L1, L2, L3 cache sizes
Cache memory is ultra-fast storage built directly into the 3 110 processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Ryzen 3 110's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.
Zen 3+ Architecture & Process
Manufacturing and design details
The AMD Ryzen 3 110 is built on AMD's 6 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in 3 110 incorporate advanced branch prediction and out-of-order execution for optimal performance.
Zen 3+ Instruction Set Features
Supported CPU instructions and extensions
The Ryzen 3 110 by AMD supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.
3 110 Power & Thermal
TDP and power specifications
The AMD Ryzen 3 110 has a TDP (Thermal Design Power) of 28W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.
AMD Socket FP7 Platform & Socket
Compatibility information
The Ryzen 3 110 uses the AMD Socket FP7 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.
AMD Socket FP7 Memory Support
RAM compatibility and speeds
Memory support specifications for the 3 110 define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Ryzen 3 110 determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.
AMD's Ryzen 3 110 Integrated Graphics
Built-in GPU specifications
The AMD Ryzen 3 110 includes integrated graphics, eliminating the need for a dedicated GPU in basic computing scenarios. Integrated graphics are ideal for office productivity, video playback, and light gaming. While not designed for demanding GPU benchmarks, the iGPU in the 3 110 provides hardware video encoding and decoding capabilities. This makes the processor suitable for compact builds, HTPCs, and systems where power efficiency is prioritized over gaming performance.
Ryzen 3 110 Product Information
Release and pricing details
The AMD Ryzen 3 110 is manufactured by AMD and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Ryzen 3 110 by AMD offers a specific balance of performance, features, and cost within AMD's product lineup.
Ryzen 3 110 Benchmark Scores
No benchmark data available for this CPU.
About AMD Ryzen 3 110
Platform and Compatibility
The AMD Ryzen 3 110 is a mobile processor built for the AMD Socket FP7 platform, using the Rembrandt-R package (part number 100-000000549 for FP7r2). It is based on the Zen 3+ architecture, codenamed Rembrandt-R, and is fabricated on TSMC's 6 nm process with a die size of 210 mm². The chip is actively in production and was released on September 30, 2025, targeting the mobile market segment.
Memory support is limited to DDR5, running on a dual-channel memory bus. The memory bandwidth is rated at 76.8 GB/s, and ECC memory is supported, which can be relevant for certain professional or reliability-focused mobile workloads. The processor provides PCIe Gen 4 connectivity with 20 lanes available from the CPU itself, which is typical for a modern mobile platform and allows for fast NVMe storage and discrete GPU connections where applicable.
For integrated graphics, the Ryzen 3 110 includes a Radeon 660M iGPU, making it a complete APU solution. The multiplier is not unlocked, so overclocking is not an option; users are limited to the stock clock behavior. The upgrade path is defined by the FP7 socket, which is shared with other Rembrandt-R family parts, though the exact range of compatible replacements is not specified in the data. The absence of a launch MSRP and the active production status suggest this part is positioned for system integrators and OEM laptops rather than retail DIY builds.
Power and Thermals
The Ryzen 3 110 carries a TDP of 28 watts, which places it in the lower-power tier of mobile processors. This TDP class implies the chip is designed for thin-and-light laptops or compact mini-PCs where thermal headroom is limited. A 28 W TDP typically allows for a modest cooling solution—often a small heat pipe with a single fan—rather than the robust vapor chambers or dual-fan setups required by higher-TDP parts. The 6 nm process from TSMC contributes to efficiency, but the data does not specify actual power draw under load beyond the TDP rating.
Given the 28 W envelope, the Ryzen 3 110 should be manageable with a capable air cooler in most chassis designs. The integrated Radeon 660M graphics share the same thermal budget, so sustained CPU-heavy workloads may reduce iGPU performance due to thermal constraints. The base clock of 3.00 GHz and boost clock of 4.30 GHz are modest figures, suggesting the chip can hit its boost ceiling without requiring extreme cooling. For users, this means the primary thermal consideration is not whether the cooler can dissipate the heat, but whether the laptop's chassis allows for quiet operation under sustained load. The 28 W class is also well-suited for fanless or semi-passive designs in low-power usage scenarios, though the data does not confirm such implementations.
How It Compares
The FACT PACK lists no nearest rivals for the AMD Ryzen 3 110, and the benchmark scores array is empty. The average benchmark score is 0, and the percentile versus all CPUs is 50, which indicates a median position in the overall CPU performance distribution—but without specific rival data, a direct comparison is not possible from the supplied facts. The chip's 4 cores and 8 threads, paired with a 4.30 GHz boost clock, suggest it targets entry-level mobile performance, but no comparable products are named in the dataset.
Because the nearestRivals field contains no entries, the analysis cannot reference specific competitor names, scores, or delta percentages. The data does not provide any relative performance figures against Intel or other AMD parts. This absence means the Ryzen 3 110's standing can only be inferred from its own specifications: 4 cores, 8 threads, 8 MB of shared L3 cache, and a 28 W TDP. The 50th percentile ranking implies it sits exactly in the middle of all CPUs tracked by the benchmark database, but the lack of rival data prevents any nuanced positioning.
FAQ
Q: What socket does the AMD Ryzen 3 110 use?
A: The processor uses AMD Socket FP7, with the specific package identifier 100-000000549 (FP7r2).
Q: Does the Ryzen 3 110 support DDR4 memory?
A: No, memory support is limited to DDR5, running on a dual-channel bus with 76.8 GB/s bandwidth.
Q: What is the integrated graphics solution in the Ryzen 3 110?
A: The chip includes a Radeon 660M integrated GPU, making it a full APU for systems without a discrete graphics card.
Q: Can the Ryzen 3 110 be overclocked?
A: No, the multiplier is locked, so overclocking is not supported.
Q: What is the TDP of the Ryzen 3 110?
A: The TDP is 28 watts, which is typical for a low-power mobile processor.
Q: When was the Ryzen 3 110 released?
A: The release date is September 30, 2025, and the production status is listed as active.
Benchmark Performance
The benchmark data for the AMD Ryzen 3 110 is notably sparse: the benchmarks array is empty, the average benchmark score is 0, and the percentile versus all CPUs is 50. This means the chip's performance cannot be quantified through any specific score, and no rival comparisons are available from the nearestRivals field. The percentile of 50 indicates that, in the absence of measured scores, the processor is ranked at the median of all CPUs in the database—a placeholder position rather than a tested result.
What can be analyzed is the theoretical performance envelope based on the specifications. The Ryzen 3 110 has 4 cores and 8 threads, which is a common configuration for entry-level mobile processors. The base clock of 3.00 GHz is modest, but the boost clock of 4.30 GHz provides a 43% uplift under load, which is significant for single-threaded tasks. The cache hierarchy includes 64 KB of L1 per core, 512 KB of L2 per core, and 8 MB of shared L3 cache. The L3 cache size is relatively small by modern standards, which could impact performance in cache-sensitive workloads, but the chip compensates with a high boost clock.
The memory bandwidth of 76.8 GB/s on DDR5 dual-channel is adequate for the 4-core design, and ECC support adds reliability for specific use cases. The Radeon 660M iGPU is present, but its performance is not quantified in the data. The absence of any rival scores or deltas means no percentage-based comparisons can be made—unlike typical benchmark analysis, there is no "30% ahead of X" statement possible here.
Given the 50th percentile rank, the Ryzen 3 110 is positioned as an average performer across the entire CPU landscape, but this is a synthetic placement without actual benchmark data. The 28 W TDP and mobile segment designation suggest the chip prioritizes efficiency over raw performance, which aligns with its expected role in thin laptops. Without measured scores, the benchmark performance section must rely on the structural specifications: a 4-core/8-thread Zen 3+ part on a 6 nm process, boosting to 4.30 GHz, with 8 MB of L3 cache. These figures point to a processor capable of smooth everyday multitasking and light gaming via the iGPU, but the data prevents any definitive performance verdict against named competitors. The empty benchmark array and missing rival list leave the performance characterization incomplete, and any quantitative claims beyond the provided clock and cache numbers would be speculative.
The Intel Equivalent of Ryzen 3 110
Looking for a similar processor from Intel? The Intel Core i3-14100T offers comparable performance and features in the Intel lineup.
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