AMD Ryzen Embedded 8845HS vs Intel Core i5-14501TE Comparison

Head-to-Head Benchmarks

The recorded database contains no benchmark scores for either processor. The AMD Ryzen Embedded 8845HS and the Intel Core i5-14501TE both return an average benchmark score of zero, and the head-to-head benchmark table is empty. Consequently, there are no measured wins for either part, no performance deltas, and no percentile shifts to report. Both CPUs sit at the 50th percentile against all CPUs in the database, which indicates that neither part has a tested performance profile recorded at this time.

Without benchmark data, the analysis must rely entirely on architectural and specification differences. The AMD part fields eight cores and sixteen threads, while the Intel part fields six cores and twelve threads. The AMD base clock of 3.80 GHz is substantially higher than the Intel base clock of 2.20 GHz, but both parts share an identical boost clock of 5.10 GHz. These figures suggest that the AMD processor can sustain higher minimum throughput in lightly threaded workloads, while both processors can reach the same maximum single-thread ceiling when boosting.

The cache configurations diverge meaningfully. The AMD Ryzen Embedded 8845HS uses 64 KB of L1 cache per core, 1 MB of L2 per core, and 16 MB of shared L3. The Intel Core i5-14501TE uses 80 KB of L1 per core, 1.25 MB of L2 per core, and 24 MB of shared L3. The larger Intel L3 pool could improve performance in workloads that repeatedly access a working set larger than 16 MB, but the AMD part has more physical cores to distribute work across. The data does not show how these tradeoffs resolve in actual application benchmarks.

The Intel processor supports both DDR4 and DDR5 memory, while the AMD processor supports only DDR5. The AMD memory bandwidth is recorded at 89.6 GB/s, while the Intel memory bandwidth field is empty. The Intel part also offers PCIe Gen 5 with 16 CPU lanes, whereas the AMD part offers PCIe Gen 4 with 20 CPU lanes. The AMD part has more total lanes, but the Intel part has a newer generation of connectivity for devices that can use it.

Architecture Differences

The AMD Ryzen Embedded 8845HS uses the Zen 4 architecture under the Hawk Point codename, part of the Ryzen Embedded 8000 series. It is built on a 4 nm process at TSMC, with 25,000 million transistors on a 178 mm² die. The Intel Core i5-14501TE uses the Raptor Lake architecture under the Raptor Lake-R codename, part of the Core 14th Gen series. It is built on a 10 nm process at Intel, with a die size of 215 mm²; the transistor count is not recorded in the database.

The process node difference is stark. The AMD part uses a 4 nm process, while the Intel part uses a 10 nm process. This smaller node allows the AMD processor to pack 8 cores and 16 threads into a smaller die (178 mm² versus 215 mm²) while also integrating a Radeon 780M graphics unit. The Intel die is larger but contains fewer cores, which suggests the Raptor Lake design uses more area per core or includes additional uncore logic that the database does not enumerate.

The integrated graphics differ as well. The AMD processor carries a Radeon 780M, while the Intel processor carries UHD Graphics 770. No graphics benchmark scores are recorded for either part, but the naming and generation gap indicate different graphics capabilities. The AMD part is classified as mobile, using AMD Socket FP8, while the Intel part is classified as desktop, using Intel Socket 1700. This socket difference means the two processors are not drop-in interchangeable and target different platform designs.

The AMD processor supports DDR5 memory only, in a dual-channel configuration, with an 89.6 GB/s memory bandwidth figure. The Intel processor supports both DDR4 and DDR5, also in dual-channel, but its memory bandwidth figure is not recorded. Both parts support ECC memory, which is a relevant feature for embedded and workstation use cases. The PCIe implementations differ: AMD uses Gen 4 with 20 lanes (CPU only), while Intel uses Gen 5 with 16 lanes (CPU only). The Intel part has a newer PCIe generation, which could benefit high-throughput storage or accelerators that can saturate Gen 5 links, while the AMD part offers four additional lanes for parallel device connectivity.

The AMD processor was released on 2024-04-01, while the Intel processor was released on 2024-06-30. Both parts are currently listed as Active in production status. Neither part has a recorded launch MSRP, and neither has an unlocked multiplier. The Intel part has a recorded part number of Q49KSRNJN, while the AMD part number is listed as unknown.

FAQ

Q: Which processor has more cores and threads?

A: The AMD Ryzen Embedded 8845HS has 8 cores and 16 threads, while the Intel Core i5-14501TE has 6 cores and 12 threads.

Q: Do both processors reach the same maximum boost clock?

A: Yes, both the AMD Ryzen Embedded 8845HS and the Intel Core i5-14501TE have a boost clock of 5.10 GHz. Their base clocks differ, with AMD at 3.80 GHz and Intel at 2.20 GHz.

Q: Which processor supports DDR4 memory?

A: Only the Intel Core i5-14501TE supports DDR4 in addition to DDR5. The AMD Ryzen Embedded 8845HS supports DDR5 only.

Q: Do both processors support ECC memory?

A: Yes, both the AMD Ryzen Embedded 8845HS and the Intel Core i5-14501TE have ECC memory support enabled.

Q: Which processor has the larger L3 cache?

A: The Intel Core i5-14501TE has 24 MB of shared L3 cache, while the AMD Ryzen Embedded 8845HS has 16 MB of shared L3 cache.

Q: What PCIe generations do the two processors use?

A: The AMD Ryzen Embedded 8845HS uses PCIe Gen 4 with 20 CPU lanes, while the Intel Core i5-14501TE uses PCIe Gen 5 with 16 CPU lanes.

Specification Differences

| Specification | AMD Ryzen Embedded 8845HS | Intel Core i5-14501TE |

|---|---|---|

| Cores | 8 | 6 |

| Threads | 16 | 12 |

| Base clock | 3.80 GHz | 2.20 GHz |

| Boost clock | 5.10 GHz | 5.10 GHz |

| TDP | 45 W | 45 W |

| Socket | AMD Socket FP8 | Intel Socket 1700 |

| Architecture | Zen 4 | Raptor Lake |

| Codename | Hawk Point | Raptor Lake-R |

| Process node | 4 nm | 10 nm |

| Foundry | TSMC | Intel |

| Die size | 178 mm² | 215 mm² |

| Transistors | 25,000 million | not recorded |

| L1 cache | 64 KB per core | 80 KB per core |

| L2 cache | 1 MB per core | 1.25 MB per core |

| L3 cache | 16 MB shared | 24 MB shared |

| Memory support | DDR5 only | DDR4 and DDR5 |

| Memory bandwidth | 89.6 GB/s | not recorded |

| PCIe | Gen 4, 20 lanes | Gen 5, 16 lanes |

| Integrated graphics | Radeon 780M | UHD Graphics 770 |

| Market segment | Mobile | Desktop |

| Release date | 2024-04-01 | 2024-06-30 |

The TDP is identical at 45 W for both parts, which matters for cooling and platform power delivery. The base clock gap of 1.60 GHz in favor of AMD is the largest clock difference between the two. The Intel part has a larger L1 per core, a larger L2 per core, and a larger L3 cache. The AMD part has a smaller process node, a smaller die, and a higher transistor count. The Intel part offers memory flexibility with DDR4 support, while the AMD part records a specific memory bandwidth figure of 89.6 GB/s.

The Verdict

The data does not support a performance verdict because no benchmark scores are recorded for either processor. Both parts have an average benchmark score of zero and sit at the 50th percentile, with no head-to-head results and no nearest rivals listed. The selection between these two processors must therefore be based on platform and feature fit rather than measured performance.

The AMD Ryzen Embedded 8845HS suits a platform that needs more cores, a higher base clock, a smaller process node, and a higher memory bandwidth figure. It uses a 4 nm process with 8 cores and 16 threads, a base clock of 3.80 GHz, and an 89.6 GB/s memory bandwidth. It is a mobile-class part on AMD Socket FP8 with PCIe Gen 4 and 20 CPU lanes. The Radeon 780M integrated graphics and the 25,000 million transistor count on a 178 mm² die indicate a dense, modern design.

The Intel Core i5-14501TE suits a platform that needs memory flexibility, a larger L3 cache, and newer PCIe generation. It supports both DDR4 and DDR5, has 24 MB of shared L3 cache, and uses PCIe Gen 5 with 16 CPU lanes. It is a desktop-class part on Intel Socket 1700 with a 10 nm process and a 215 mm² die. Its base clock of 2.20 GHz is lower, but its boost clock matches the AMD part at 5.10 GHz. The UHD Graphics 770 integrated graphics differ from the Radeon 780M, though no graphics benchmark data exists in the database.

Both processors share a 45 W TDP, ECC memory support, dual-channel memory buses, and locked multipliers. Neither has a recorded launch MSRP. The release dates are close, with AMD at 2024-04-01 and Intel at 2024-06-30. The lack of benchmark data means any claim of superiority in compute performance would be unsupported. The verdict rests on specifications: choose AMD for more cores and a higher base clock, choose Intel for DDR4 compatibility, a larger L3 cache, and PCIe Gen 5.

Where Each One Wins

The AMD Ryzen Embedded 8845HS wins on core count, thread count, base clock, process node, transistor count, memory bandwidth, and PCIe lane count. The 8-core, 16-thread configuration provides more parallel execution resources than the Intel part's 6 cores and 12 threads. The 3.80 GHz base clock is 1.60 GHz higher than the Intel base clock, which could improve sustained throughput in workloads that do not trigger boost behavior. The 4 nm TSMC process versus the 10 nm Intel process suggests better power efficiency per transistor, though no efficiency benchmark is recorded. The 89.6 GB/s memory bandwidth figure gives the AMD part a quantifiable memory throughput advantage, and the 20 PCIe Gen 4 lanes allow more simultaneous devices than the Intel part's 16 Gen 5 lanes.

The Intel Core i5-14501TE wins on cache capacity, memory compatibility, and PCIe generation. The 24 MB shared L3 cache is 8 MB larger than the AMD part's 16 MB, which can benefit workloads with larger working sets. The 80 KB L1 per core and 1.25 MB L2 per core are both larger than the AMD per-core values of 64 KB and 1 MB, respectively. DDR4 support gives the Intel part access to an older, widely available memory ecosystem, while the AMD part is restricted to DDR5. The PCIe Gen 5 interface, despite having only 16 lanes, offers double the per-lane bandwidth of Gen 4 for compatible devices. The Intel part also has a larger die at 215 mm², which may reflect a more expansive uncore design, although the database does not specify what that extra area contains.

Neither part shows a win in any recorded benchmark, as the benchmark tables are empty. The wins described here are structural advantages derived from the specification sheet, not measured performance results. For threaded workloads and high-base-clock responsiveness, the AMD part has the evident edge. For cache-sensitive workloads, DDR4 compatibility, and Gen 5 storage or accelerators, the Intel part has the evident edge. The equal 45 W TDP means both parts fit similar thermal envelopes, but the platform sockets prevent direct comparison in the same system.