AMD Ryzen AI Max PRO 485 vs AMD Ryzen Embedded 8845HS Comparison

Where Each One Wins

The recorded data places both processors in the same performance percentile overall, at the 50th percentile versus all CPUs in the database. Neither part has a decisive aggregate benchmark advantage based on the available measurements. The differentiation is therefore functional rather than raw throughput.

The AMD Ryzen AI Max PRO 485 uses the Gorgon Halo design with Zen 5 cores, while the AMD Ryzen Embedded 8845HS uses Hawk Point with Zen 4 architecture. Both are 8-core, 16-thread parts. The key splits emerge in memory bandwidth, graphics, and platform capabilities.

The Ryzen AI Max PRO 485 delivers 273.1 GB/s of memory bandwidth through a quad-channel LPDDR5X interface. That is roughly three times the bandwidth of the Embedded 8845HS, which manages 89.6 GB/s over dual-channel DDR5. Applications sensitive to memory throughput, such as integrated-graphics workloads, large in-memory datasets, and certain compute kernels, would favor the AI Max PRO 485 on paper.

The Ryzen Embedded 8845HS counters with a higher base clock, 3.80 GHz versus 3.60 GHz, and a higher boost clock, 5.10 GHz versus 5.00 GHz. It also supports more PCIe lanes from the CPU: 20 lanes of Gen 4 versus 16 lanes of Gen 4 on the AI Max PRO 485. For embedded platforms that need additional expansion or peripheral connectivity, the 8845HS is structurally positioned better.

The integrated graphics differ substantially. The AI Max PRO 485 carries the Radeon 8050S, while the 8845HS uses the Radeon 780M. The 8050S, paired with quad-channel LPDDR5X memory, has a much wider memory path to feed its shader array. The 780M, while a capable integrated part, is constrained by the dual-channel DDR5 interface.

The AI Max PRO 485 was released on 2026-05-19, while the 8845HS was released on 2024-04-01. The later release date for the AI Max PRO 485 aligns with its newer Zen 5 core design. The 8845HS is an active production part in the embedded market segment, and the AI Max PRO 485 is also active, targeting mobile.

Neither processor has a locked multiplier, so overclocking is not officially supported on either. Both support ECC memory, which matters for reliability-sensitive embedded and workstation scenarios.

Architecture Differences

The two CPUs share the same foundry and process node: TSMC at 4 nm. That is where the architectural similarities end.

The Ryzen AI Max PRO 485 uses Zen 5 cores on the Gorgon Halo codename. The Ryzen Embedded 8845HS uses Zen 4 cores on Hawk Point. Zen 5 represents a newer microarchitecture generation, and the database lists the AI Max PRO 485 generation as "Ryzen AI Max PRO (Zen 5)" while the 8845HS is "Ryzen Embedded (Zen 4 (Hawk Point))".

Cache hierarchies differ meaningfully. The AI Max PRO 485 has 80 KB of L1 per core, 1 MB of L2 per core, and 32 MB of shared L3. The 8845HS has 64 KB of L1 per core, 1 MB of L2 per core, and 16 MB of shared L3. The AI Max PRO 485 thus has double the L3 capacity, 32 MB versus 16 MB, and a larger per-core L1.

The die size difference is striking. The AI Max PRO 485 has a die size of 70.6 mm². The 8845HS has a die size of 178 mm² and contains 25,000 million transistors. The AI Max PRO 485 die size is listed without a transistor count in the database. The smaller die for the AI Max PRO 485, combined with a newer process generation, suggests a denser design despite the larger cache per core.

Memory architecture is a major divergence. The AI Max PRO 485 uses LPDDR5X with a quad-channel memory bus. The 8845HS uses DDR5 with a dual-channel bus. This drives the bandwidth gap: 273.1 GB/s versus 89.6 GB/s. Both support ECC, which is notable for an LPDDR5X part, since ECC on low-power memory is less common.

The sockets differ: AMD Socket FP11 for the AI Max PRO 485, AMD Socket FP8 for the 8845HS. These are not interchangeable platforms. The PCIe configuration also differs: the AI Max PRO 485 exposes Gen 4 with 16 lanes from the CPU, while the 8845HS exposes Gen 4 with 20 lanes.

The integrated graphics are different silicon. The AI Max PRO 485 pairs with Radeon 8050S, the 8845HS with Radeon 780M. The database does not list shader counts or clock speeds for either, so the comparison rests on the memory bandwidth available to each and the generational design.

The release dates confirm the generational gap: the 8845HS launched in 2024, the AI Max PRO 485 in 2026. The part numbers also differ, with the AI Max PRO 485 listed as 100-000002144 and the 8845HS part number unknown in the database.

FAQ

Q: Which processor has more memory bandwidth?

A: The AMD Ryzen AI Max PRO 485, at 273.1 GB/s over a quad-channel LPDDR5X bus. The AMD Ryzen Embedded 8845HS delivers 89.6 GB/s over a dual-channel DDR5 bus.

Q: Do both processors support ECC memory?

A: Yes. Both the AI Max PRO 485 and the 8845HS support ECC memory.

Q: Which processor has a larger L3 cache?

A: The AI Max PRO 485, with 32 MB of shared L3. The 8845HS has 16 MB of shared L3.

Q: Are the sockets the same?

A: No. The AI Max PRO 485 uses AMD Socket FP11, while the 8845HS uses AMD Socket FP8.

Q: Which processor has a higher boost clock?

A: The 8845HS, at 5.10 GHz. The AI Max PRO 485 boosts to 5.00 GHz.

Q: What process node do both use?

A: Both use TSMC's 4 nm process node.

Q: How many PCIe lanes does each expose from the CPU?

A: The 8845HS exposes 20 lanes of Gen 4, while the AI Max PRO 485 exposes 16 lanes of Gen 4.

Specification Differences

The two processors differ in the following recorded specifications:

• Base clock: 3.60 GHz on the AI Max PRO 485, 3.80 GHz on the 8845HS.
• Boost clock: 5.00 GHz on the AI Max PRO 485, 5.10 GHz on the 8845HS.
• TDP: 55 W on the AI Max PRO 485, 45 W on the 8845HS.
• Socket: AMD Socket FP11 on the AI Max PRO 485, AMD Socket FP8 on the 8845HS.
• Architecture: Zen 5 on the AI Max PRO 485, Zen 4 on the 8845HS.
• Codename: Gorgon Halo on the AI Max PRO 485, Hawk Point on the 8845HS.
• Generation: Ryzen AI Max PRO (Zen 5) on the AI Max PRO 485, Ryzen Embedded (Zen 4 (Hawk Point)) on the 8845HS.
• Transistors: Not listed for the AI Max PRO 485, 25,000 million for the 8845HS.
• Die size: 70.6 mm² for the AI Max PRO 485, 178 mm² for the 8845HS.
• L1 cache: 80 KB per core for the AI Max PRO 485, 64 KB per core for the 8845HS.
• L2 cache: 1 MB per core for both.
• L3 cache: 32 MB shared for the AI Max PRO 485, 16 MB shared for the 8845HS.
• Memory support: LPDDR5X for the AI Max PRO 485, DDR5 for the 8845HS.
• Memory bus: Quad-channel for the AI Max PRO 485, dual-channel for the 8845HS.
• Memory bandwidth: 273.1 GB/s for the AI Max PRO 485, 89.6 GB/s for the 8845HS.
• PCIe: Gen 4 with 16 lanes for the AI Max PRO 485, Gen 4 with 20 lanes for the 8845HS.
• Integrated graphics: Radeon 8050S for the AI Max PRO 485, Radeon 780M for the 8845HS.
• Release date: 2026-05-19 for the AI Max PRO 485, 2024-04-01 for the 8845HS.
• Part number: 100-000002144 for the AI Max PRO 485, unknown for the 8845HS.

Both share 8 cores, 16 threads, 4 nm TSMC process, ECC support, locked multipliers, mobile market segment, and active production status. There is no launch MSRP listed for either part in the database.

Head-to-Head Benchmarks

The database records no direct head-to-head benchmark entries between these two processors, and neither has a separate benchmark score or rival list populated. The comparison must therefore draw on the specification-level data, which still reveals clear directional advantages.

The largest measured gap in the database is memory bandwidth. The AI Max PRO 485 delivers 273.1 GB/s, which is 183.5 GB/s more than the 8845HS at 89.6 GB/s. That is roughly a 3x advantage in raw memory throughput. For any workload that streams data, such as integrated graphics rendering, encryption, compression, or large matrix operations, this bandwidth differential is the most consequential number in the entire comparison.

The cache capacity also favors the AI Max PRO 485. It has 32 MB of shared L3 versus 16 MB on the 8845HS. The per-core L1 is larger as well, 80 KB versus 64 KB. Doubling the L3 can reduce memory traffic in workloads with moderate working sets, which compounds the already large bandwidth advantage.

The 8845HS wins on clocks. Its base clock is 0.20 GHz higher, and its boost clock is 0.10 GHz higher. On a per-core basis, single-threaded workloads may see a small advantage on the 8845HS, though the newer Zen 5 microarchitecture on the AI Max PRO 485 could offset that clock deficit. The database does not include IPC measurements, so the net single-thread outcome is uncertain from the recorded data alone.

The 8845HS also offers more PCIe connectivity: 20 lanes versus 16 lanes, both Gen 4. That is a 4-lane difference, enough for an additional Gen 4 NVMe drive or a low-bandwidth expansion card on embedded platforms.

The TDP figures are informative. The AI Max PRO 485 is rated at 55 W, the 8845HS at 45 W. The AI Max PRO 485 draws 10 W more at the rated TDP, which explains its ability to feed the quad-channel memory controller and the larger L3 cache. The 8845HS achieves its higher clocks within a 45 W envelope, indicating a tighter power design.

The integrated graphics comparison is qualitative but informed by the memory system. The Radeon 8050S on the AI Max PRO 485 has access to quad-channel LPDDR5X at 273.1 GB/s. The Radeon 780M on the 8845HS is limited to dual-channel DDR5 at 89.6 GB/s. Integrated GPUs rely heavily on system memory bandwidth, so the 8050S has a structural advantage that the database numbers support.

The die size difference is notable: 70.6 mm² for the AI Max PRO 485 versus 178 mm² for the 8845HS. The 8845HS is physically much larger, and the database lists 25,000 million transistors for it. The AI Max PRO 485 achieves a larger cache and newer cores on a smaller die, which suggests a more advanced integration density on the 4 nm process.

The Verdict

The AMD Ryzen AI Max PRO 485 is the choice for workloads that depend on memory bandwidth and cache capacity. Its 273.1 GB/s quad-channel LPDDR5X interface, 32 MB L3, and 80 KB per-core L1 give it a clear structural edge for integrated graphics, data-intensive compute, and multitasking with large working sets. The newer Zen 5 architecture and the Radeon 8050S graphics reinforce that positioning. The trade-off is a 55 W TDP and a lower clock ceiling of 5.00 GHz.

The AMD Ryzen Embedded 8845HS is the choice for embedded platforms that need more PCIe connectivity and higher clocks within a lower power envelope. Its 20 Gen 4 lanes allow more expansion, its 5.10 GHz boost clock is the highest in this comparison, and its 45 W TDP is 10 W lower. The 16 MB L3 and 89.6 GB/s bandwidth are modest by comparison, but the 8845HS has a proven embedded pedigree with an earlier release date and a larger die that reflects a different design trade-off.

Both processors sit at the 50th percentile in the database, so neither dominates the other in aggregate performance. The decision rests on platform requirements. A mobile or AI-oriented design with heavy graphics and memory pressure points to the AI Max PRO 485. An embedded system with expansion needs, tighter power limits, and a preference for higher clocks points to the 8845HS. The data does not support a universal winner; it supports two different targets.