Intel Xeon W-3175X
Intel processor specifications and benchmark scores
At a Glance
IntelIntel Xeon W-3175X Specifications
Xeon W-3175X Core Configuration
Processing cores and threading
The Intel Xeon W-3175X features 28 physical cores and 56 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.
W-3175X Clock Speeds
Base and boost frequencies
Clock speed is a critical factor in Xeon W-3175X benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Xeon W-3175X by Intel can dynamically adjust its frequency based on workload and thermal headroom.
Intel's Xeon W-3175X Cache Hierarchy
L1, L2, L3 cache sizes
Cache memory is ultra-fast storage built directly into the W-3175X processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Xeon W-3175X's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.
Skylake Architecture & Process
Manufacturing and design details
The Intel Xeon W-3175X is built on Intel's 14 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in W-3175X incorporate advanced branch prediction and out-of-order execution for optimal performance.
Skylake Instruction Set Features
Supported CPU instructions and extensions
The Xeon W-3175X by Intel supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.
W-3175X Power & Thermal
TDP and power specifications
The Intel Xeon W-3175X has a TDP (Thermal Design Power) of 255W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.
Intel Socket 3647 Platform & Socket
Compatibility information
The Xeon W-3175X uses the Intel Socket 3647 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.
Intel Socket 3647 Memory Support
RAM compatibility and speeds
Memory support specifications for the W-3175X define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Xeon W-3175X determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.
Xeon W-3175X Product Information
Release and pricing details
The Intel Xeon W-3175X is manufactured by Intel and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Xeon W-3175X by Intel offers a specific balance of performance, features, and cost within Intel's product lineup.
Xeon W-3175X Benchmark Scores
cinebench_cinebench_r15_multicoreSource
Cinebench R15 multi-core renders a complex 3D scene using all CPU threads simultaneously. This test reveals how Intel Xeon W-3175X performs in parallel rendering workloads like video production and 3D animation. The R15 version remains useful for comparing against older hardware benchmarks. Higher scores directly correlate with faster render times in Cinema 4D and similar 3D applications.
cinebench_cinebench_r15_singlecoreSource
Cinebench R15 single-core measures the speed of one CPU thread rendering 3D geometry. This score indicates how Intel Xeon W-3175X handles tasks that can't be parallelized across multiple cores. Games and many desktop applications still rely heavily on single-thread performance. A higher single-core score means snappier system responsiveness in everyday use.
cinebench_cinebench_r20_multicoreSource
Cinebench R20 multi-core uses a scene requiring 4x more computational power than R15. This test better reflects modern CPU capabilities for professional rendering on Intel Xeon W-3175X. The more demanding workload provides better differentiation between current-generation processors.
cinebench_cinebench_r20_singlecoreSource
Cinebench R20 single-core tests one thread against a more demanding scene than R15. This reveals the true single-thread rendering capability of Intel Xeon W-3175X. The increased complexity provides more accurate performance differentiation between modern CPUs.
cinebench_cinebench_r23_multicoreSource
Cinebench R23 multi-core is the current standard for CPU rendering benchmarks with a 10-minute minimum runtime. This extended test reveals sustained performance of Intel Xeon W-3175X after thermal limits kick in. The longer duration exposes cooling limitations that shorter benchmarks miss.
cinebench_cinebench_r23_singlecoreSource
Cinebench R23 single-core measures sustained single-thread performance over 10 minutes. This reveals how Intel Xeon W-3175X maintains boost clocks under continuous load. The extended runtime shows whether thermal throttling affects single-core performance.
geekbench_multicoreSource
Geekbench multi-core tests Intel Xeon W-3175X across real-world workloads including image processing, machine learning, and data compression. All available threads are utilized to measure parallel performance. Higher scores indicate better capability in multitasking and content creation.
geekbench_singlecoreSource
Geekbench single-core measures how fast one thread of Intel Xeon W-3175X can process tasks like web browsing and document editing. This score correlates with how snappy the system feels during normal use. Many applications still depend primarily on single-thread performance.
About Intel Xeon W-3175X
The Intel Xeon W-3175X is a 28-core, 56-thread Skylake-W processor built for the workstation segment, and its benchmark data reveals a clear split between exceptional multi-threaded throughput and merely adequate single-thread performance. The processor holds a 70th percentile ranking among all CPUs, with an average benchmark score of 10480. This places it in a competitive dead heat with its nearest rivals, all of which sit within a single percentage point of its average score. The data indicates a platform designed for parallel workloads, where the sheer core count drives results, rather than for tasks that depend on high-frequency single-core responsiveness.
Single-Thread vs Multi-Thread Behavior
The benchmark results show a dramatic divergence between the processor's single-core and multi-core capabilities. In Cinebench R23, the multi-core score reaches 39206, while the single-core score is 5535, a ratio of roughly 7:1 that reflects the scaling efficiency of its 28 cores. This pattern repeats across Cinebench R15, where multi-core scores 3951 against a single-core score of 557, and in Geekbench, where the multi-core total is 14331 versus a single-core 1472. The data suggests that the Skylake architecture, with a base clock of 3.10 GHz and a boost clock of 4.30 GHz, prioritizes sustained multi-threaded execution over peak single-thread speed.
For real-world workloads, this means the processor excels in rendering, simulation, and batch processing tasks that can utilize all 56 threads. Video encoding, 3D scene rendering, and scientific computing will see near-linear gains from the core count. Conversely, applications that rely heavily on single-thread performance, such as legacy productivity software or lightly-threaded game engines, will not benefit from the full extent of the hardware. The single-core scores, while respectable, are not class-leading; they indicate that the processor's strength lies in parallelism, not in raw clock-for-clock speed. The 4.30 GHz boost clock helps mitigate this for shorter bursts, but the architecture's focus is clearly on throughput.
Power and Thermals
With a thermal design power (TDP) of 255 watts, the Xeon W-3175X sits in a high-power class that demands serious cooling infrastructure. This TDP figure, combined with a 14 nm process node and a die size of 688 mm², suggests substantial heat generation under sustained load. The processor is unlocked, meaning users can adjust multipliers, but doing so will push power consumption and thermal output well beyond the stated TDP. The data implies that a capable air cooler or a high-end liquid cooling solution is a necessity, not an option, for any system built around this chip.
The 255-watt TDP class is typical for server and workstation processors with this core count. It implies that the platform requires a motherboard with robust voltage regulation and a chassis with strong airflow. The processor's 48 PCIe Gen 3 lanes and six-channel memory support further indicate a workstation-class design, where power delivery and thermal management are primary engineering concerns. The end-of-life production status means that cooling solutions and motherboard compatibility are now based on existing ecosystem components, which are generally designed to handle this power envelope. For users, the practical implication is that system build cost and complexity are higher than for mainstream desktop parts, but the multi-threaded performance justifies the investment.
Benchmark Performance
The benchmark scores paint a picture of a processor that is consistently at the top of its class, albeit with narrow margins over its closest competitors. In Cinebench R23 multi-core, the score of 39206 is a strong indicator of rendering performance, while the single-core score of 5535 confirms that it is not a bottleneck for mixed workloads. The Geekbench multi-core score of 14331 is notably lower than the Cinebench R23 result, which suggests that the processor's performance varies depending on the benchmark's threading model and instruction set usage. The average benchmark score of 10480 is a useful aggregate, but it masks the differences between synthetic tests that favor pure core count and those that reward memory latency or single-thread speed.
Against the nearest rivals, the data shows a statistical tie. The AMD EPYC 7502P scores 10512, which is 0.3% higher than the Xeon's average, while the AMD EPYC 7D12 scores 10547, a 0.6% advantage. On the other side, the Intel Xeon Gold 6312U scores 10435, which is 0.4% lower, and the AMD Ryzen Threadripper 3970X scores 10387, a 0.9% deficit. These deltaPct values are within the margin of error for most benchmarking suites, indicating that the Xeon W-3175X offers essentially equivalent performance to these alternatives. The practical takeaway is that the choice between these processors will come down to platform features, price, and availability, not raw benchmark scores.
How It Compares
AMD EPYC 7502P: The EPYC 7502P has an average score of 10512, which is 0.3% higher than the Xeon W-3175X. This is a negligible difference in real-world terms, but the EPYC platform offers different memory and I/O characteristics that might be preferable for specific server workloads. The Xeon counters with a higher boost clock of 4.30 GHz, which can help in lightly-threaded tasks.
Intel Xeon Gold 6312U: The Xeon Gold 6312U scores 10435, which is 0.4% lower than the W-3175X. This places the two Intel parts in a virtual tie, with the W-3175X holding a slight edge. The Gold 6312U likely benefits from a newer architecture, but the W-3175X's unlocked multiplier provides overclocking headroom that the Gold part lacks.
AMD EPYC 7D12: The EPYC 7D12 is the strongest rival, scoring 10547, a 0.6% advantage over the Xeon. This is the only rival with a deltaPct greater than 0.5%, but it remains a marginal lead. The EPYC's advantage is likely due to its memory bandwidth and core topology, but the Xeon's 38.5 MB of shared L3 cache helps mitigate this in many workloads.
AMD Ryzen Threadripper 3970X: The Threadripper 3970X scores 10387, which is 0.9% lower than the Xeon. This is the largest gap among the rivals, but still a close result. The Threadripper is a consumer-focused part with similar core counts, but the Xeon's support for ECC memory and six-channel DDR4 gives it an edge in professional environments where data integrity is critical.
Platform and Compatibility
The Xeon W-3175X uses the Intel Socket 3647, a platform designed for high-end workstations and servers. It supports DDR4 memory across a six-channel bus, providing a memory bandwidth of 128.0 GB/s. This is a substantial amount of bandwidth, which is essential for feeding 28 cores in memory-intensive applications. The processor also supports ECC memory, which is a critical feature for professional workloads where a single-bit error can corrupt an entire simulation or render.
PCIe support is Gen 3 with 48 lanes from the CPU, allowing for multiple graphics cards, NVMe storage devices, or accelerator cards to be connected directly to the processor. This is a workstation-level feature that enables high I/O throughput. The processor is part of the Skylake-W generation, released on 2019-01-29, and is now end-of-life. This means that new systems are not being manufactured, but used and refurbished parts are available. The upgrade path is limited to other Socket 3647 processors, but the 28-core count is already near the top of the stack for this platform. The unlocked multiplier is a unique feature for this class, offering overclocking potential that is rare in server processors.
FAQ
Q: What is the maximum memory bandwidth of the Intel Xeon W-3175X?
A: The processor supports six-channel DDR4 memory with a total bandwidth of 128.0 GB/s.
Q: Does the Intel Xeon W-3175X support ECC memory?
A: Yes, the processor supports ECC memory, which is essential for professional and server workloads that require data integrity.
Q: How many PCIe lanes does the CPU provide directly?
A: The processor provides 48 PCIe Gen 3 lanes directly from the CPU, suitable for multiple GPUs or NVMe devices.
Q: What is the production status of the Intel Xeon W-3175X?
A: The processor is marked as end-of-life, meaning it is no longer in active production, though it remains available on the second-hand market.
Q: Is the Intel Xeon W-3175X multiplier unlocked?
A: Yes, the multiplier is unlocked, allowing for overclocking, which is uncommon for processors in this server/workstation class.
Q: What is the process node and die size of the Xeon W-3175X?
A: The processor is built on a 14 nm process node with a die size of 688 mm², containing 8,000 million transistors.
Who Should Consider It
The Xeon W-3175X is tailored for professionals who run heavily parallel, multi-threaded applications. The Cinebench R23 multi-core score of 39206 indicates that 3D artists, video editors, and engineers using rendering software will see exceptional performance. The 56 threads allow for complex simulations and batch processing to complete in a fraction of the time compared to mainstream desktop processors. The support for ECC memory and six-channel DDR4 makes it a fit for financial modeling, scientific research, and data analysis where large datasets are processed in memory.
For gamers, the single-core score of 5535 in Cinebench R23 is adequate, but the high TDP and platform cost are not justified by gaming performance alone. The processor is better suited to a hybrid workload, where a professional uses the same machine for content creation and occasional gaming. Office productivity tasks that are single-threaded will not leverage the hardware, but multi-tasking across many applications will benefit from the core count. The end-of-life status and launch MSRP of $2999 mean that it is now a budget option in the used market, offering high-end performance at a reduced cost, but this comes with the caveat of needing a compatible Socket 3647 motherboard and a robust cooling solution.
The AMD Equivalent of Xeon W-3175X
Looking for a similar processor from AMD? The AMD Ryzen 5 PRO 2500U offers comparable performance and features in the AMD lineup.
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