AMD EPYC 7402
AMD processor specifications and benchmark scores
At a Glance
AMDAMD EPYC 7402 Specifications
EPYC 7402 Core Configuration
Processing cores and threading
The AMD EPYC 7402 features 24 physical cores and 48 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.
EPYC 7402 Clock Speeds
Base and boost frequencies
Clock speed is a critical factor in EPYC 7402 benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The EPYC 7402 by AMD can dynamically adjust its frequency based on workload and thermal headroom.
AMD's EPYC 7402 Cache Hierarchy
L1, L2, L3 cache sizes
Cache memory is ultra-fast storage built directly into the EPYC 7402 processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The EPYC 7402's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.
Zen 2 Architecture & Process
Manufacturing and design details
The AMD EPYC 7402 is built on AMD's 7 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in EPYC 7402 incorporate advanced branch prediction and out-of-order execution for optimal performance.
Zen 2 Instruction Set Features
Supported CPU instructions and extensions
The EPYC 7402 by AMD supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.
EPYC 7402 Power & Thermal
TDP and power specifications
The AMD EPYC 7402 has a TDP (Thermal Design Power) of 180W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.
AMD Socket SP3 Platform & Socket
Compatibility information
The EPYC 7402 uses the AMD Socket SP3 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.
AMD Socket SP3 Memory Support
RAM compatibility and speeds
Memory support specifications for the EPYC 7402 define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the EPYC 7402 determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.
EPYC 7402 Product Information
Release and pricing details
The AMD EPYC 7402 is manufactured by AMD and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the EPYC 7402 by AMD offers a specific balance of performance, features, and cost within AMD's product lineup.
EPYC 7402 Benchmark Scores
cinebench_cinebench_r15_multicoreSource
Cinebench R15 multi-core renders a complex 3D scene using all CPU threads simultaneously. This test reveals how AMD EPYC 7402 performs in parallel rendering workloads.
cinebench_cinebench_r15_singlecoreSource
Cinebench R15 single-core measures the speed of one CPU thread rendering 3D geometry. This score indicates how AMD EPYC 7402 handles tasks that can't be parallelized.
cinebench_cinebench_r20_multicoreSource
Cinebench R20 multi-core uses a scene requiring 4x more computational power than R15. This test better reflects modern CPU capabilities for professional rendering on AMD EPYC 7402. The more demanding workload provides better differentiation between current-generation processors. Content creators and 3D artists use this benchmark to estimate real-world render performance.
cinebench_cinebench_r20_singlecoreSource
Cinebench R20 single-core tests one thread against a more demanding scene than R15. This reveals the true single-thread rendering capability of AMD EPYC 7402. The increased complexity provides more accurate performance differentiation between modern CPUs. Single-thread performance remains critical for gaming and applications with serial bottlenecks.
cinebench_cinebench_r23_multicoreSource
Cinebench R23 multi-core is the current standard for CPU rendering benchmarks with a 10-minute minimum runtime. This extended test reveals sustained performance of AMD EPYC 7402 after thermal limits kick in. The longer duration exposes cooling limitations that shorter benchmarks miss. Professional users rely on R23 scores to predict real-world rendering performance under sustained workloads.
cinebench_cinebench_r23_singlecoreSource
Cinebench R23 single-core measures sustained single-thread performance over 10 minutes. This reveals how AMD EPYC 7402 maintains boost clocks under continuous load. The extended runtime shows whether thermal throttling affects single-core performance. This score is particularly important for understanding real-world responsiveness beyond initial boost behavior.
About AMD EPYC 7402
The AMD EPYC 7402 is a 24-core, 48-thread Zen 2 processor built for the server and workstation segment. With a 71st percentile ranking among all CPUs and an average benchmark score of 11,312, it sits in a performance tier where it trades blows with other high-core-count server parts. It is not a consumer desktop chip; its entire design philosophy centers on sustained throughput, large memory bandwidth, and dense compute for professional workloads.
Who Should Consider It
The EPYC 7402 targets workloads that scale with core count and memory bandwidth, not those that depend on a few fast threads. The data points to three primary use cases.
First, multi-threaded content creation and rendering. The Cinebench R23 multi-core score of 39,110 is the strongest result in the benchmark set, indicating that 3D rendering, video encoding, and batch image processing will see near-linear scaling across the 24 cores. For a workstation handling overnight renders or 4K video exports, this chip will complete tasks in a fraction of the time a lower-core-count part would require. The R20 multi-core score of 16,426 reinforces this; it places the chip firmly in the "heavy multi-thread" class.
Second, virtualization and database workloads. With 48 threads and eight-channel DDR4 memory, this processor can host multiple concurrent virtual machines or handle large in-memory databases. The 204.8 GB/s memory bandwidth is critical here; database queries and VM scheduling benefit directly from fast memory access across all cores simultaneously. The Zen 2 architecture with 128 MB of total L3 cache also helps keep frequently accessed data close to the cores, reducing latency in transactional workloads.
Third, scientific computing and financial simulations. The combination of 24 cores, 48 threads, and ECC memory support makes this a viable choice for compute nodes running MATLAB, Monte Carlo simulations, or computational fluid dynamics. The 180W TDP class implies that this is a sustained-load processor, not a burst-performance part. It will maintain high throughput over hours of operation, which is exactly what these workloads demand.
Gamers and general office users should look elsewhere. The R23 single-core score of 5,521 is mediocre by modern standards, and the chip's server-focused design means no integrated graphics and a platform that requires dedicated server motherboards. For pure office productivity (spreadsheets, email, web browsing), a consumer chip with higher single-thread performance would provide a snappier experience at a fraction of the power draw.
Power and Thermals
The EPYC 7402 carries a 180W TDP. This is a high-power part that demands a robust cooling solution. It is not a chip for a compact air cooler or a small-form-factor build. The thermal design implies a tower-style air cooler with at least two heat pipes, or a liquid cooler with a 240mm or larger radiator, assuming the server chassis supports such hardware. In a typical 1U or 2U server chassis, this TDP class requires high-static-pressure fans and careful airflow management to keep the CPU below thermal throttling thresholds during sustained all-core loads.
The 7nm TSMC process node helps mitigate heat density, but 180W is still 180W. It will raise the ambient temperature in any room where it operates. For workstation builds, a case with good front-to-back airflow is non-negotiable. The die size of 4x 74 mm² (four chiplets) means heat is spread across multiple physical dies, which is actually beneficial for cooling, it avoids the hot-spot problem of a single large die. However, the 15,200 million transistor count across those dies still generates significant total heat.
Single-Thread vs Multi-Thread Behavior
The benchmark data shows a stark contrast between single-thread and multi-thread performance. The R23 multi-core score of 39,110 is roughly 7.1 times the single-core score of 5,521. That ratio is typical of a high-core-count server chip. The R20 results (16,426 multi vs 2,318 single) show a ratio of about 7.1 as well, confirming consistency across benchmark versions. The R15 scores (3,942 multi vs 556 single) show a ratio of about 7.1 too, solidifying the pattern.
What this means in practice is that the EPYC 7402 excels when all cores are active, but it will not deliver impressive responsiveness in single-threaded applications. Legacy software, certain scripting languages, and some CAD tools that rely on a single primary thread will run at roughly the same speed as a mid-range consumer desktop CPU. The boost clock of 3.35 GHz is not low, but it is not high enough to compete with dedicated high-frequency parts. For workloads that alternate between single-threaded and multi-threaded phases, expect the multi-threaded phases to dominate total runtime, making the chip still worthwhile overall.
The base clock of 2.80 GHz is the sustained all-core frequency. Under a full 24-core load, the processor will hold near this speed indefinitely, which is more important than the boost clock for server workloads. The boost clock is for short bursts, such as compiling a small module or handling a single database query.
FAQ
Q: Does the EPYC 7402 support ECC memory?
A: Yes, ECC memory is supported, which is essential for error-free long-running computations in servers and workstations.
Q: What is the memory configuration?
A: It supports DDR4 memory over an eight-channel bus, with a total memory bandwidth of 204.8 GB/s. This is a high-bandwidth configuration suited for memory-intensive workloads.
Q: How many PCIe lanes does it provide?
A: The CPU provides 128 PCIe Gen 4 lanes. This allows for multiple high-speed GPUs, NVMe storage devices, and network cards without needing a separate PCIe switch.
Q: Does it have integrated graphics?
A: No, there is no integrated graphics. A dedicated GPU is required for display output, even for basic server administration.
Q: What socket does it use?
A: It uses AMD Socket SP3, which is the server platform socket for the EPYC 7002 series. This socket is not compatible with consumer AM4 or AM5 motherboards.
Q: What is the production status?
A: The production status is listed as Active, meaning it is still a current product available for purchase, despite the release date of 2019-08-06.
How It Compares
The EPYC 7402's average benchmark score of 11,312 places it in a tight cluster with four other processors. The closest rival is the AMD EPYC 73F3, which scores 11,334, a delta of -0.2%. That means the EPYC 73F3 is essentially tied with the 7402, with a negligible 0.2% advantage. In real-world terms, these two chips are interchangeable in performance, and the choice would come down to platform features or price, not speed.
Next is the AMD EPYC 7452, scoring 11,279, a delta of +0.3% in favor of the 7402. Again, this is a statistical tie. The 0.3% difference is well within run-to-run variance for any benchmark. Users upgrading from a 7452 would see no measurable gain from the 7402.
The Intel Core i3-1305U scores 11,225, a delta of +0.8% for the 7402. This is a surprising comparison because the Core i3-1305U is a low-power mobile processor, not a server chip. The fact that it scores nearly identically to the EPYC 7402 on average benchmark score highlights that the EPYC's strength is in scaling, not in per-thread speed. The i3-1305U likely wins on single-thread and loses massively on multi-thread, but the average score masks that divergence.
Finally, the Intel Xeon Gold 6336Y scores 11,191, a delta of +1.1% for the 7402. The 7402 holds a slight edge over this Xeon, but again, the margin is small. In a server fleet, this 1.1% difference would translate to a few seconds of runtime per hour, which is unlikely to be decisive.
Platform and Compatibility
The EPYC 7402 uses AMD Socket SP3, a server-grade socket that is exclusive to the EPYC product line. It is not compatible with any consumer motherboard. The chipset and platform are designed for rack servers, tower workstations, and blade systems. The platform supports DDR4 memory across eight channels, requiring registered DIMMs (RDIMMs) or LRDIMMs, not standard desktop memory.
PCIe support is Gen 4 with 128 lanes from the CPU. This is a major advantage for systems that need multiple high-bandwidth devices. You can populate four or more Gen 4 NVMe SSDs, multiple GPUs, and high-speed network cards without lane contention. Gen 4 also doubles the bandwidth per lane compared to Gen 3, which future-proofs the system for upcoming storage and accelerator hardware.
The memory bandwidth of 204.8 GB/s is achieved only when all eight channels are populated. Using fewer DIMMs will reduce bandwidth, so for optimal performance, populate all eight channels with at least one DIMM each. The 128 MB total L3 cache (32 MB per die) is shared across the four chiplets, providing a large cache pool for data reuse in multi-threaded applications.
Upgrade path within the EPYC 7002 series is straightforward: any other SP3 socket processor from the same generation will drop into the same motherboard, assuming BIOS support. This allows for a future core-count increase without a full platform change. However, moving to a different generation (e.g., EPYC 7003) would require a new motherboard, as the socket and platform are not forward-compatible. The production status is Active, so this chip is still available for new builds or upgrades to existing SP3 systems.
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