AMD Ryzen Embedded 8845HS vs Qualcomm Snapdragon X2E-94-100 Comparison

Where Each One Wins

The recorded data for these two mobile processors shows a split that follows their physical design. The AMD Ryzen Embedded 8845HS uses 8 cores with 16 threads, while the Qualcomm Snapdragon X2E-94-100 uses 18 cores with 18 threads. That thread count difference is the first signal. The AMD part supports simultaneous multithreading, so each of its cores can process two threads. The Qualcomm part does not, so its 18 cores each handle one thread. In workloads that scale with thread count, the Qualcomm part has more execution units to draw from. In workloads that respond to per-core frequency, the AMD part has the edge on paper.

The AMD Ryzen Embedded 8845HS boosts to 5.10 GHz, which is higher than the Qualcomm part's 4.70 GHz boost. The Qualcomm part has a higher base clock at 4.45 GHz versus 3.80 GHz, but the AMD part's boost ceiling is the more relevant figure for single-threaded tasks. The Qualcomm Snapdragon X2E-94-100 also uses a 3 nm process node from TSMC, while the AMD part uses a 4 nm node from the same foundry. The smaller node typically allows for better power efficiency per transistor, but the AMD part has a stated 45 W TDP, while the Qualcomm part has no TDP listed in the database.

Memory bandwidth is a major differentiator. The Qualcomm part uses LPDDR5X in a triple-channel configuration, delivering 228.6 GB/s. The AMD part uses DDR5 in a dual-channel configuration, delivering 89.6 GB/s. That is a 2.55x difference in raw memory bandwidth, and it will show in any workload that streams large data sets. The Qualcomm part also supports PCIe Gen 5 with 12 lanes, while the AMD part supports PCIe Gen 4 with 20 lanes. The Qualcomm part has newer PCIe generation per lane, but the AMD part has more lanes available for expansion.

The integrated graphics also differ. The AMD part uses the Radeon 780M, a known quantity in the embedded space. The Qualcomm part uses the Adreno X2-90. Without benchmark scores in the database, the comparison rests on the architecture and memory bandwidth available to each iGPU. The Qualcomm part's triple-channel LPDDR5X gives its integrated graphics substantially more memory bandwidth to work with, which typically benefits iGPU performance in graphics-heavy tasks.

Architecture Differences

The AMD Ryzen Embedded 8845HS is built on Zen 4 architecture under the Hawk Point codename. It belongs to the 8000 series and uses AMD Socket FP8. The die size is 178 mm² with 25,000 million transistors. The Qualcomm Snapdragon X2E-94-100 uses the Glymur codename under the Snapdragon X2 Elite generation, and it uses Qualcomm BGA 2343. Its die size is 220 mm², larger than the AMD part, though the database does not list its transistor count.

Cache hierarchies differ significantly. The AMD part has 64 KB of L1 per core, 1 MB of L2 per core, and 16 MB of shared L3. The Qualcomm part has 288 KB of L1 per core, 16 MB of L2 per module, and 9 MB of shared L3. The Qualcomm part's L1 is 4.5x larger per core, and its L2 is organized per module rather than per core. The AMD part has more shared L3, 16 MB versus 9 MB. For workloads that fit in L3, the AMD part has an advantage. For workloads that hit L1 or L2 repeatedly, the Qualcomm part's larger per-core caches may reduce memory traffic.

Memory support differs by type and channel count. The AMD part supports DDR5 in dual-channel mode. The Qualcomm part supports LPDDR5X in triple-channel mode. The AMD part supports ECC memory; the Qualcomm part does not. That is a meaningful distinction for embedded workloads where data integrity matters. The AMD part also uses PCIe Gen 4 with 20 CPU lanes, while the Qualcomm part uses PCIe Gen 5 with 12 CPU lanes. The Qualcomm part has newer PCIe generation, but fewer lanes.

The process nodes are both from TSMC. The AMD part uses 4 nm, the Qualcomm part uses 3 nm. The smaller node on the Qualcomm part is consistent with its higher base clock of 4.45 GHz across 18 cores. The AMD part has a 45 W TDP listed; the Qualcomm part has no TDP in the database, so power comparisons cannot be made from recorded data.

The AMD part has 8 cores and 16 threads, with a boost clock of 5.10 GHz. The Qualcomm part has 18 cores and 18 threads, with a boost clock of 4.70 GHz. The AMD part's SMT doubles its thread count, which helps in heavily threaded workloads that do not exceed 16 threads. The Qualcomm part's extra 10 physical cores give it more raw parallel throughput in workloads that scale beyond 16 threads, assuming the software can use them.

Release dates differ by two years. The AMD part entered production with an Active status on April 1, 2024. The Qualcomm part followed with an Active status on April 5, 2026. Both are currently in production, and both are mobile market segment parts. Neither has an unlocked multiplier, so overclocking is not a factor in their comparison.

Head-to-Head Benchmarks

The database contains no direct benchmark scores for either processor. The headToHeadBenchmarks array is empty, and the winsA and winsB counts are both zero. The avgBenchmarkScore for each part is zero, and the percentileVsAllCpus for each is 50. Without measured performance data, the comparison must rely on the architectural specifications recorded in the database.

The most concrete spec-level advantage belongs to the Qualcomm part on memory bandwidth. Its 228.6 GB/s is 2.55x the AMD part's 89.6 GB/s. That is the largest single numeric gap between the two processors. Any workload that is memory-bound, such as large matrix operations, data compression, or high-resolution video processing, will benefit from that bandwidth. The triple-channel LPDDR5X configuration also feeds the Adreno X2-90 iGPU with substantially more data per cycle than the Radeon 780M receives from dual-channel DDR5.

The AMD part's thread advantage is smaller in absolute terms. It has 16 threads versus 18 threads for the Qualcomm part, a difference of 2 threads. However, the AMD part's SMT design means those 16 threads come from 8 physical cores, so each core handles two threads. The Qualcomm part's 18 threads come from 18 physical cores. In workloads that are sensitive to per-core resources, the AMD part's SMT could show contention between threads sharing a core. In workloads that are purely parallel and independent, the Qualcomm part's extra physical cores may provide more consistent scaling.

Clock speeds favor the AMD part at the top end. The AMD part boosts to 5.10 GHz, which is 0.40 GHz higher than the Qualcomm part's 4.70 GHz boost. That 8.5% boost advantage could translate into a single-threaded performance edge for the AMD part, assuming similar IPC. The Qualcomm part has a higher base clock at 4.45 GHz versus 3.80 GHz, a 17.1% difference, which means it sustains higher frequency under load before boost kicks in.

The cache comparison shows the Qualcomm part has more total cache when summing L1, L2, and L3. The AMD part has 64 KB per core L1, 1 MB per core L2, and 16 MB shared L3. With 8 cores, that is 512 KB L1, 8 MB L2, and 16 MB L3, totaling 24.5 MB. The Qualcomm part has 288 KB per core L1, 16 MB per module L2, and 9 MB shared L3. With 18 cores, that is 5,184 KB L1 (about 5.06 MB), 16 MB L2 (assuming one module covers all 18 cores, which is not explicitly stated), and 9 MB L3, totaling roughly 30 MB. The Qualcomm part's larger L1 per core is the most notable cache difference, as it can hold more working set per execution unit.

FAQ

Q: Which processor has more cores?

A: The Qualcomm Snapdragon X2E-94-100 has 18 cores, while the AMD Ryzen Embedded 8845HS has 8 cores. The AMD part has 16 threads due to SMT, while the Qualcomm part has 18 threads with no SMT.

Q: How do the memory bandwidth figures compare?

A: The Qualcomm part offers 228.6 GB/s through triple-channel LPDDR5X. The AMD part offers 89.6 GB/s through dual-channel DDR5. The Qualcomm part delivers 2.55x the bandwidth.

Q: Which processor supports ECC memory?

A: Only the AMD Ryzen Embedded 8845HS supports ECC memory. The Qualcomm Snapdragon X2E-94-100 does not list ECC support.

Q: What are the boost clock speeds?

A: The AMD part boosts to 5.10 GHz. The Qualcomm part boosts to 4.70 GHz. The AMD part has a 0.40 GHz higher boost clock.

Q: Which process node is smaller?

A: The Qualcomm part uses a 3 nm TSMC node. The AMD part uses a 4 nm TSMC node. The Qualcomm part is on a smaller process.

Q: Do these processors use the same socket?

A: No. The AMD part uses AMD Socket FP8. The Qualcomm part uses Qualcomm BGA 2343.

The Verdict

The data indicates a clear division of roles. The AMD Ryzen Embedded 8845HS is the choice for applications that need ECC memory, a higher boost clock, and a known 45 W TDP envelope. Its 5.10 GHz boost clock gives it a single-threaded ceiling that the Qualcomm part does not match. Its 16 threads from 8 cores with SMT provide solid parallel throughput for workloads that fit within that thread count. Its PCIe Gen 4 with 20 lanes offers more expansion options for peripheral devices.

The Qualcomm Snapdragon X2E-94-100 is the choice for memory-intensive workloads. Its 228.6 GB/s memory bandwidth is more than double the AMD part's, and its 18 physical cores give it more raw parallel throughput in thread-heavy scenarios. Its 3 nm process node and larger die size suggest a design optimized for sustained multi-core throughput. Its PCIe Gen 5 support provides newer connectivity per lane, even though the lane count is lower.

Neither part has recorded benchmark scores, so the verdict rests on architecture and specifications. The AMD part wins on ECC support, boost frequency, and lane count. The Qualcomm part wins on core count, memory bandwidth, process node, and cache per core. For embedded systems that prioritize data integrity and single-threaded response, the AMD part is the stronger option. For embedded systems that process large data streams or run many parallel threads, the Qualcomm part is the stronger option. The database shows two different design philosophies, and the correct pick depends entirely on which of these specifications matters more for the target workload.