AMD Ryzen Embedded 8845HS vs Qualcomm Snapdragon X2E-78-100 Comparison

Head-to-Head Benchmarks

The benchmark database contains no recorded performance measurements for either the AMD Ryzen Embedded 8845HS or the Qualcomm Snapdragon X2E-78-100. The head-to-head benchmark section lists zero wins for each processor, and the average benchmark score for both entries is zero. This absence of recorded data means direct numerical performance comparisons cannot be established from the database at this time.

The percentile ranking for both processors sits at 50, placing each exactly at the midpoint of all CPUs tracked in the database. This equal percentile position indicates that neither processor has accumulated enough benchmark submissions to shift its standing relative to the broader population of recorded CPUs. Without individual benchmark scores, the percentile values carry limited interpretive weight, as they reflect an absence of data rather than a measured performance plateau.

Both processors share the same market segment classification, mobile, which suggests they target similar usage environments. However, the lack of recorded benchmark results prevents any quantitative assessment of how they might compare in real-world mobile workloads. The database shows no wins for either side in the head-to-head category, reinforcing that no measurement-based advantage can be attributed to either part.

Architecture Differences

The AMD Ryzen Embedded 8845HS belongs to the 8000 series and uses the Zen 4 architecture under the codename Hawk Point. Its generation is listed as Ryzen Embedded with the Zen 4 Hawk Point designation. The processor is built on a 4 nm process node at TSMC, with a die size of 178 mm² and a transistor count of 25,000 million. The Qualcomm Snapdragon X2E-78-100, in contrast, carries the codename Glymur and belongs to the Snapdragon X2 Elite generation. It uses a smaller 3 nm process node, also from TSMC, with a larger die size of 220 mm². The database does not list a transistor count for the Qualcomm part.

Core configuration differs substantially between the two. The AMD processor provides 8 cores and 16 threads, indicating simultaneous multithreading support. The Qualcomm processor offers 12 cores but only 12 threads, meaning it operates without multithreading. Base clock speeds place the Qualcomm part higher at 4.00 GHz compared to the AMD's 3.80 GHz. The AMD processor has a boost clock of 5.10 GHz, while the Qualcomm part lists no boost clock value in the database.

Cache hierarchies diverge significantly. The AMD Ryzen Embedded 8845HS uses 64 KB of L1 cache per core, 1 MB of L2 cache per core, and 16 MB of shared L3 cache. The Qualcomm Snapdragon X2E-78-100 uses 288 KB of L1 cache per core and 16 MB of shared L2 cache, with no L3 cache listed. This structural difference means the AMD part distributes its L2 across cores individually, while the Qualcomm part pools a larger shared L2. The Qualcomm L1 allocation per core is more than four times larger than the AMD allocation.

Memory support also differs. The AMD processor supports DDR5 memory over a dual-channel bus with a bandwidth of 89.6 GB/s. The Qualcomm processor supports LPDDR5X memory, also dual-channel, with a significantly higher bandwidth of 152.4 GB/s. ECC memory is supported on the AMD part but not on the Qualcomm part. PCIe connectivity shows the AMD processor using Gen 4 with 20 lanes from the CPU, while the Qualcomm part uses Gen 5 with 12 lanes from the CPU.

Integrated graphics differentiate the two as well. The AMD processor includes the Radeon 780M, while the Qualcomm processor includes the Adreno X2-85. The database records no further specifications for either integrated GPU. Socket types are distinct: the AMD part uses AMD Socket FP8, and the Qualcomm part uses Qualcomm BGA 2343. The AMD processor was released on 2024-04-01, while the Qualcomm processor carries a release date of 2026-04-05. Both are listed as active in production status, and neither has an unlocked multiplier. The Qualcomm part number is X2E78100, while the AMD part number is listed as unknown.

The Verdict

The recorded data offers no benchmark scores, no wins in head-to-head comparisons, and no average performance figures for either processor. Selection guidance must therefore rest entirely on architectural and specification differences rather than measured outcomes.

The AMD Ryzen Embedded 8845HS presents a conventional high-core-count mobile design with simultaneous multithreading, a high boost clock of 5.10 GHz, and support for ECC memory. Its 8 cores and 16 threads suit workloads that benefit from parallel thread execution, and the 16 MB shared L3 cache provides a sizeable pool for frequently accessed data. The DDR5 memory interface, while lower in bandwidth than the Qualcomm part, still delivers 89.6 GB/s, which is adequate for many embedded and mobile compute tasks. The Radeon 780M integrated graphics offer a known baseline for display and light graphics workloads.

The Qualcomm Snapdragon X2E-78-100 offers a higher core count at 12 cores, a faster base clock of 4.00 GHz, and a much larger L1 cache per core at 288 KB. Its 16 MB shared L2 cache consolidates secondary cache in a single pool, which can benefit workloads with high locality across cores. The LPDDR5X memory support with 152.4 GB/s bandwidth gives the Qualcomm part a clear memory throughput advantage, nearly 70 percent higher than the AMD part. The Gen 5 PCIe interface, despite fewer lanes at 12, offers newer signaling technology compared to the AMD part's Gen 4 with 20 lanes.

The 3 nm process node for the Qualcomm part indicates a more advanced manufacturing technology than the AMD part's 4 nm node, though both come from TSMC. The larger die size on the Qualcomm part, 220 mm² versus 178 mm², reflects the additional cores and cache resources. The absence of ECC support on the Qualcomm part may matter for certain embedded and reliability-focused deployments where the AMD part's ECC capability is a differentiator.

Users requiring ECC memory, multithreading with a higher boost clock, or a familiar AMD socket ecosystem would find the Ryzen Embedded 8845HS aligned with those needs. Users prioritizing core count, memory bandwidth, LPDDR5X support, or the newer PCIe Gen 5 interface would find the Snapdragon X2E-78-100 better suited. Neither part shows a measured performance advantage in the database, so the choice hinges on which architectural features matter more for the intended application.

Specification Differences

| Specification | AMD Ryzen Embedded 8845HS | Qualcomm Snapdragon X2E-78-100 |

| --- | --- | --- |

| Cores | 8 | 12 |

| Threads | 16 | 12 |

| Base clock | 3.80 GHz | 4.00 GHz |

| Boost clock | 5.10 GHz | Not listed |

| Process node | 4 nm | 3 nm |

| Die size | 178 mm² | 220 mm² |

| L1 cache | 64 KB per core | 288 KB per core |

| L2 cache | 1 MB per core | 16 MB shared |

| L3 cache | 16 MB shared | Not listed |

| Memory support | DDR5 | LPDDR5X |

| Memory bandwidth | 89.6 GB/s | 152.4 GB/s |

| ECC memory | Supported | Not supported |

| PCIe | Gen 4, 20 lanes | Gen 5, 12 lanes |

| Integrated graphics | Radeon 780M | Adreno X2-85 |

| Socket | AMD Socket FP8 | Qualcomm BGA 2343 |

| Codename | Hawk Point | Glymur |

| Release date | 2024-04-01 | 2026-04-05 |

| Part number | Unknown | X2E78100 |

The two processors share no identical specifications in the recorded fields. The AMD part offers more threads, a higher boost clock, ECC support, and a larger L3 cache. The Qualcomm part offers more cores, a higher base clock, a smaller process node, larger L1 cache per core, a shared L2 pool, higher memory bandwidth, and newer PCIe generation. Both use dual-channel memory buses, both come from TSMC, both target the mobile market segment, both are active in production, and neither has an unlocked multiplier.

FAQ

Q: Which processor has more cores?

A: The Qualcomm Snapdragon X2E-78-100 has 12 cores, while the AMD Ryzen Embedded 8845HS has 8 cores.

Q: Does the AMD Ryzen Embedded 8845HS support ECC memory?

A: Yes, the AMD processor supports ECC memory. The Qualcomm Snapdragon X2E-78-100 does not support ECC memory.

Q: What is the memory bandwidth difference between the two processors?

A: The Qualcomm Snapdragon X2E-78-100 has a memory bandwidth of 152.4 GB/s with LPDDR5X support, while the AMD Ryzen Embedded 8845HS has 89.6 GB/s with DDR5 support.

Q: Which processor uses a smaller manufacturing process node?

A: The Qualcomm Snapdragon X2E-78-100 uses a 3 nm process node from TSMC. The AMD Ryzen Embedded 8845HS uses a 4 nm process node from TSMC.

Q: Do both processors have the same number of threads?

A: No. The AMD Ryzen Embedded 8845HS has 16 threads across 8 cores, while the Qualcomm Snapdragon X2E-78-100 has 12 threads across 12 cores.

Q: Which processor has a higher base clock speed?

A: The Qualcomm Snapdragon X2E-78-100 has a base clock of 4.00 GHz, which is higher than the AMD Ryzen Embedded 8845HS base clock of 3.80 GHz. The AMD processor has a boost clock of 5.10 GHz, while the Qualcomm processor has no boost clock listed.