CPU

Qualcomm Snapdragon X2E-78-100

Unknown processor specifications and benchmark scores

12
Cores
12
Threads
—
GHz Boost
—
TDP
Integrated GPU NPU

At a Glance

Unknown
Cores / Threads 12C / 12T
Base Clock 4 GHz
Socket Qualcomm BGA 2343
nm
Process 3 nm
Released Apr 2026

Qualcomm Snapdragon X2E-78-100 Specifications

Snapdragon X2E-78-100 Core Configuration

Processing cores and threading

The Qualcomm Snapdragon X2E-78-100 features 12 physical cores and 12 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
12
Threads
12
Hybrid Cores
6 + 6
SMP CPUs
1

Snapdragon X2E-78-100 Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Snapdragon X2E-78-100 benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Snapdragon X2E-78-100 by Qualcomm can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
4 GHz
Boost Clock
N/A
E-Core Frequency
3.4 GHz
Multiplier
40x

Qualcomm's Snapdragon X2E-78-100 Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the Snapdragon X2E-78-100 processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Snapdragon X2E-78-100's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
288 KB (per core)
L2 Cache
16 MB (shared)

Unknown Architecture & Process

Manufacturing and design details

The Qualcomm Snapdragon X2E-78-100 is built on Unknown's 3 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in Snapdragon X2E-78-100 incorporate advanced branch prediction and out-of-order execution for optimal performance.

Codename
Glymur
Process Node
3 nm
Foundry
TSMC
Die Size
220 mm²
Generation
Snapdragon X2 (Elite)

Power & Thermal

TDP and power specifications

The Qualcomm Snapdragon X2E-78-100 has a TDP (Thermal Design Power) of varies based on configuration, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
N/A

Qualcomm BGA 2343 Platform & Socket

Compatibility information

The Snapdragon X2E-78-100 uses the Qualcomm BGA 2343 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
Qualcomm BGA 2343
PCIe
Gen 5, 12 Lanes(CPU only)
Package
FC-BGA
DDR5

Qualcomm BGA 2343 Memory Support

RAM compatibility and speeds

Memory support specifications for the Snapdragon X2E-78-100 define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Snapdragon X2E-78-100 determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Type
LPDDR5X
Memory Bus
Dual-channel
Memory Bandwidth
152.4 GB/s

Qualcomm's Snapdragon X2E-78-100 Integrated Graphics

Built-in GPU specifications

The Qualcomm Snapdragon X2E-78-100 includes integrated graphics, eliminating the need for a dedicated GPU in basic computing scenarios. Integrated graphics are ideal for office productivity, video playback, and light gaming. While not designed for demanding GPU benchmarks, the iGPU in the Snapdragon X2E-78-100 provides hardware video encoding and decoding capabilities. This makes the processor suitable for compact builds, HTPCs, and systems where power efficiency is prioritized over gaming performance.

iGPU
Adreno X2-85
Graphics Model
Adreno X2-85

Snapdragon X2E-78-100 by Qualcomm AI & NPU

Neural processing capabilities

The Qualcomm Snapdragon X2E-78-100 features a dedicated Neural Processing Unit (NPU) for accelerating AI and machine learning workloads. This specialized hardware offloads AI tasks from the CPU cores, improving efficiency in applications like real-time video enhancement, noise cancellation, and intelligent assistants. NPU performance is measured in TOPS (Tera Operations Per Second), with higher values indicating faster AI processing. The NPU enables on-device AI capabilities without relying on cloud services, enhancing privacy and reducing latency.

NPU
Yes / 80 TOPS

Product Information

Release and pricing details

The Qualcomm Snapdragon X2E-78-100 is manufactured by Unknown and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Snapdragon X2E-78-100 by Qualcomm offers a specific balance of performance, features, and cost within Unknown's product lineup.

Manufacturer
Unknown
Release Date
Apr 2026
Market
Mobile
Status
Active
Part Number
X2E78100

About Qualcomm Snapdragon X2E-78-100

Benchmark Performance

The Qualcomm Snapdragon X2E-78-100 presents an unusual benchmark profile. With an average benchmark score of zero and no entries in the benchmarks array, the data does not currently contain any measured performance results for this processor. The percentile ranking of 50 against all CPUs indicates a theoretical midpoint position, but this is derived from an empty benchmark set rather than actual test data.

The absence of benchmark scores is notable given the hardware specifications. The processor packs 12 cores and 12 threads with a base clock of 4.00 GHz. This clock speed is uniform across all cores, suggesting a design where every core operates at the same frequency rather than a hybrid architecture with separate performance and efficiency clusters. The 3 nm process node from TSMC places this chip in the latest manufacturing generation, which historically correlates with strong performance-per-clock characteristics.

Without rival comparison data — the nearestRivals array is empty — the benchmark section cannot offer percentage deltas or relative positioning. What can be stated from the available facts is that the processor's specifications place it in a class where 12 threads at 4.00 GHz base clock represent a substantial compute resource. The 16 MB shared L2 cache and 288 KB L1 cache per core provide a sizeable on-die memory hierarchy that should benefit workloads with moderate data reuse.

The 50th percentile ranking, while not backed by measured scores, does indicate that this processor sits at the median of all CPUs in the database. For a mobile processor with 12 threads, this suggests the database currently lacks comparative entries that would push it higher or lower. As benchmark data becomes available, this percentile will likely shift based on how the Snapdragon X2E-78-100 performs against x86 competitors and other ARM-based silicon.

How It Compares

The nearestRivals field is empty, meaning the database currently holds no direct comparison points for the Snapdragon X2E-78-100. This is unusual for a processor with an active production status and a release date of 2026-04-05. Without rival scores, the comparison section cannot provide the typical analysis of percentage advantages or deficits.

The lack of rivals may stem from the processor's recent release or its unique positioning. Qualcomm's Snapdragon X2 series, with the codename Glymur, targets the mobile segment. The 12-core, 12-thread configuration with a 4.00 GHz base clock distinguishes it from typical mobile processors, which often employ fewer cores or lower base clocks to manage power. The 3 nm process node and TSMC foundry relationship align it with current-generation manufacturing, potentially giving it an efficiency advantage over chips built on older nodes.

What can be inferred from the available data is that the Snapdragon X2E-78-100 does not slot neatly into existing categories. It is not a low-power mobile chip by core count, nor does it match desktop processors in thread count. The 152.4 GB/s memory bandwidth and dual-channel LPDDR5X support indicate a design aimed at bandwidth-sensitive workloads, which could include integrated graphics tasks or AI inference. The Adreno X2-85 integrated GPU further suggests a focus on visual and compute acceleration.

As the database populates with benchmark results from other processors, the comparison section will gain substance. For now, the empty nearestRivals list means no percentage deltas can be cited, and the processor's performance relative to specific competitors remains unquantified.

Single-Thread vs Multi-Thread Behavior

The Snapdragon X2E-78-100 employs a symmetric core design: 12 cores and 12 threads, with no hyperthreading or SMT. This means each core handles one thread, and all cores run at a 4.00 GHz base clock. The absence of a boost clock value in the spec sheet is notable — it may indicate that the processor does not implement dynamic frequency scaling beyond its base rate, or that the boost clock data has not yet been recorded.

The single-thread performance implications stem directly from the 4.00 GHz base clock. Without a boost clock, single-threaded workloads will run at this frequency, which is competitive for modern processors but not exceptional for tasks that benefit from high turbo frequencies. The 288 KB L1 cache per core is generous, providing fast access to working sets for individual threads. This cache configuration should help latency-sensitive single-threaded applications, such as database queries or light scripting workloads, by reducing memory access stalls.

Multi-threaded behavior is where this processor's configuration shows its strength. Twelve cores at 4.00 GHz offer a high aggregate compute throughput for parallel workloads. The 16 MB shared L2 cache is a key asset here — shared caches allow cores to communicate through the cache hierarchy without hitting main memory, which is critical for parallel workloads with inter-thread communication. The dual-channel LPDDR5X memory with 152.4 GB/s bandwidth provides ample data flow to keep 12 cores fed, provided the workload has sufficient parallelism.

The lack of SMT means that the processor handles thread scheduling at the OS level with exactly 12 hardware threads. For workloads that behave well with one thread per core — such as many scientific computations, video encoding, or 3D rendering — this design avoids the overhead of SMT contention. However, workloads that benefit from SMT (like some server applications with high thread counts and low per-thread resource usage) may see less throughput per core compared to processors with SMT.

Real-world behavior will depend on the software's ability to utilize 12 threads. Well-parallelized applications will see near-linear scaling from the uniform 4.00 GHz clocks. Mixed workloads that alternate between single-threaded and multi-threaded phases will benefit from the consistent frequency, as there are no frequency drops between core count transitions.

Who Should Consider It

The Snapdragon X2E-78-100 targets a specific workload profile based on its specifications. The 12 cores and 12 threads at 4.00 GHz make it a strong candidate for multi-threaded mobile computing tasks. Content creation applications that scale across cores — such as video rendering, photo batch processing, or code compilation — should see strong performance from the uniform core configuration.

For gaming, the processor's suitability depends on the integrated Adreno X2-85 GPU. The 152.4 GB/s memory bandwidth is substantial for an integrated solution, which helps feed both the CPU and GPU. However, the lack of a discrete GPU option in the spec sheet, combined with the mobile market segment, suggests this processor is designed for laptops or portable devices where dedicated graphics are not the primary focus. Games that are CPU-bound at 1080p or lower resolutions may benefit from the 12 cores, but GPU-bound titles will rely on the Adreno X2-85's capabilities.

Office and productivity workloads present a mixed picture. Single-threaded applications like spreadsheet calculations or word processing will run at the 4.00 GHz base clock, which is adequate but not leading-edge for such tasks. The real advantage appears in multitasking scenarios — running multiple office applications simultaneously, background processes, and communication tools will leverage the 12 cores to maintain responsiveness without frequency throttling.

The 16 MB shared L2 cache is particularly beneficial for workloads with moderate data sets that fit within this cache. Database operations, financial modeling, and scientific simulations with working sets under 16 MB will see reduced memory latency. The processor's 3 nm process node also suggests strong power efficiency, making it suitable for thin-and-light mobile devices where sustained multi-core performance matters without excessive battery drain.

The lack of benchmark scores means recommendations must be based on architectural characteristics. The symmetric 12-core design with no SMT and a fixed 4.00 GHz clock is best suited for workloads that scale well with physical cores and do not rely on high turbo frequencies. Users who run heavily threaded applications on a mobile platform — such as on-the-go developers compiling large codebases or video editors processing 4K footage — represent the primary audience.

Power and Thermals

The TDP field is null in the spec sheet, meaning no thermal design power figure is available. The absence of a TDP value and a boost clock suggests that power management behavior may differ from typical processors. Without a TDP number, cooling recommendations must be based on indirect indicators.

The 3 nm process node from TSMC is a strong positive indication for power efficiency. TSMC's 3 nm manufacturing typically delivers significant power reductions at equivalent performance compared to older nodes. The 12 cores at 4.00 GHz will generate heat, but the process node should keep power density manageable for mobile form factors.

The die size of 220 mm² is moderate — not exceptionally large, which helps with heat dissipation across the die surface. The mobile market segment implies that the processor is designed for laptops or portable devices, which typically have constrained thermal budgets. Without a TDP figure, the cooling tier required is ambiguous, but the process node and mobile targeting suggest that a capable air cooler — such as a well-designed laptop heat pipe assembly — should suffice.

The absence of a boost clock may simplify thermal management. If the processor runs at a constant 4.00 GHz, the thermal load is predictable — cooling solutions can be sized for a steady-state load rather than peak boost spikes. This could make thermal design easier for system integrators, as the cooling solution does not need to handle transient power spikes from turbo states.

The integrated Adreno X2-85 GPU adds to the thermal load during graphics-intensive tasks. The 152.4 GB/s memory bandwidth suggests the memory subsystem is designed for high throughput, which can also contribute to power draw. For sustained workloads that stress both CPU and GPU, such as gaming or GPU-accelerated compute, the thermal solution must handle simultaneous loads from both components.

Given the lack of specific thermal data, the safest assessment is that the Snapdragon X2E-78-100 requires a cooling solution appropriate for a 12-core mobile processor on a 3 nm node — typically a dual-fan or large single-fan heat pipe assembly in a laptop chassis, or a compact liquid cooler in a mini-PC form factor. The exact cooling tier will depend on the chassis design and intended use case.

Platform and Compatibility

The Snapdragon X2E-78-100 uses the Qualcomm BGA 2343 socket, confirming its soldered, non-upgradeable nature. This is a mobile-focused platform where the processor is permanently attached to the motherboard. The socket designation indicates a specific Qualcomm platform that is unlikely to be compatible with other processors.

Memory support is limited to LPDDR5X, running on a dual-channel bus. The 152.4 GB/s memory bandwidth is the maximum figure provided, which represents a high-throughput configuration for LPDDR5X. The memory is not ECC-capable, so this processor is not intended for memory-error-sensitive workloads like critical server applications. The dual-channel configuration means memory expansion is limited to two channels, which is standard for mobile platforms.

PCIe support includes Gen 5 with 12 lanes available for CPU-attached devices. This is a substantial PCIe lane count for a mobile processor, allowing for fast NVMe storage, a discrete GPU (if the platform supports it), or other high-bandwidth peripherals. The Gen 5 standard provides high data transfer rates for storage and expansion cards, though the 12-lane allocation limits the number of PCIe devices that can be connected directly to the CPU.

The integrated Adreno X2-85 GPU eliminates the need for a separate graphics card for basic display output. The processor's platform supports a single display pipeline through this integrated GPU, though the PCIe lanes could accommodate a discrete GPU for users requiring more graphics performance.

The production status is active, and the release date of 2026-04-05 indicates this is a current-generation product. The Snapdragon X2 (Elite) generation, codenamed Glymur, represents Qualcomm's latest mobile compute platform. The 3 nm process node from TSMC confirms this is a leading-edge product at the time of release.

Upgrade path is limited by the BGA socket — once the system is built, the processor cannot be replaced. Users should consider their performance needs for the lifespan of the device, as the 12-core configuration with 4.00 GHz base clock is the maximum this platform offers. The platform's memory and PCIe capabilities are fixed at the time of purchase, so there is no expansion beyond what the motherboard provides.

FAQ

Q: How many cores and threads does the Snapdragon X2E-78-100 have?

A: It has 12 cores and 12 threads. The processor does not support SMT or hyperthreading, so each core handles exactly one thread.

Q: What is the base clock speed of this processor?

A: The base clock is 4.00 GHz. No boost clock is listed in the specifications, so the processor appears to operate at a fixed 4.00 GHz across all cores.

Q: Does this processor support ECC memory?

A: No, ECC memory is not supported. The processor only supports LPDDR5X memory in a dual-channel configuration.

Q: What is the socket type, and can the processor be upgraded?

A: It uses the Qualcomm BGA 2343 socket, which is a ball-grid array. This means the processor is soldered onto the motherboard and cannot be upgraded or replaced.

Q: What integrated graphics does the Snapdragon X2E-78-100 include?

A: It includes the Adreno X2-85 integrated GPU. This handles graphics output without needing a separate graphics card.

Q: What PCIe version and lane count does the processor support?

A: It supports PCIe Gen 5 with 12 lanes available for CPU-attached devices. This allows for high-speed storage or other expansion cards connected directly to the processor.

Detailed benchmark scores and charts for the Qualcomm Snapdragon X2E-78-100 are below.

Benchmark Scores

No benchmark data available for this CPU.

The AMD Equivalent of Snapdragon X2E-78-100

Looking for a similar processor from AMD? The AMD Ryzen 5 3501U offers comparable performance and features in the AMD lineup.

AMD Ryzen 5 3501U

AMD • 4 Cores

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