AMD Ryzen Embedded 8845HS vs Intel Core 5 223PQE Comparison

Head-to-Head Benchmarks

The recorded database contains no benchmark scores for either the AMD Ryzen Embedded 8845HS or the Intel Core 5 223PQE. Both processors hold a percentile rank of 50 against all CPUs in the database, and their average benchmark scores are listed as zero. This means no direct performance comparison can be drawn from measured results at this time.

What the data does show is the architectural positioning of each chip. The AMD Ryzen Embedded 8845HS belongs to the 8000 series, uses Zen 4 architecture, and carries the Hawk Point codename. It is built on a 4 nm process by TSMC, with 25,000 million transistors on a 178 mm² die. The Intel Core 5 223PQE comes from the Bartlett Lake codename family, is fabricated on a 10 nm Intel process, and the database does not list transistor count or die size.

Both parts offer 8 cores and 16 threads. The Intel chip has a higher base clock at 4.00 GHz compared to 3.80 GHz for the AMD part. Boost clocks follow the same pattern: the Intel Core 5 223PQE reaches 5.50 GHz while the AMD Ryzen Embedded 8845HS tops out at 5.10 GHz. On raw clock speed alone, Intel leads by 200 MHz at base and 400 MHz at boost.

However, clock speed advantages do not automatically translate to application wins. The AMD processor uses a smaller 4 nm process, a factor that historically correlates with improved power efficiency per operation. The Intel chip operates at a 125 W TDP, while the AMD part draws 45 W. That 80 W difference in thermal design power is substantial, and it suggests the AMD processor is positioned for thermally constrained environments, while the Intel processor is designed for systems where higher power delivery is acceptable.

Cache hierarchies differ meaningfully. The AMD Ryzen Embedded 8845HS packs 64 KB of L1 cache per core, 1 MB of L2 per core, and 16 MB of shared L3. The Intel Core 5 223PQE counters with 80 KB of L1 per core, 2 MB of L2 per core, and 24 MB of shared L3. Intel holds the capacity advantage at every cache level: 16 KB more L1 per core, 1 MB more L2 per core, and 8 MB more L3 overall. Larger caches can reduce memory latency and improve performance in workloads that repeatedly access the same data, such as database queries or compiled code loops.

Memory support is another point of divergence. AMD lists DDR5-only support, while Intel supports both DDR4 and DDR5. Both run dual-channel memory buses and deliver identical theoretical memory bandwidth of 89.6 GB/s. The Intel flexibility with DDR4 allows system builders to reuse existing memory modules, which can affect platform cost and availability, though no pricing analysis is included here. Both processors support ECC memory, which matters for embedded and reliability-focused deployments.

PCI Express capabilities differ by generation and lane count. The AMD Ryzen Embedded 8845HS provides Gen 4 with 20 CPU lanes. The Intel Core 5 223PQE provides Gen 5 with 16 CPU lanes. Gen 5 doubles the per-lane bandwidth of Gen 4, so the Intel part, despite fewer lanes, offers higher total bandwidth potential for connected devices such as storage controllers or accelerators. The AMD part offers more lanes, which can suit systems needing many simultaneous Gen 4 devices.

Integrated graphics also separate these chips. AMD uses the Radeon 780M, while Intel uses UHD Graphics 770. The database does not provide benchmark scores for either iGPU, so no performance ranking is possible. The Radeon 780M is a high-core-count integrated part known in the product stack for strong iGPU throughput, and UHD Graphics 770 is a mainstream Intel graphics solution. Without measured data, the comparison stops at feature naming.

The socket and market segment distinguish deployment targets clearly. AMD uses AMD Socket FP8 and targets the mobile segment. Intel uses Intel Socket 1700 and targets the desktop segment. The AMD part released in April 2024, while the Intel part is dated March 2026 in the database. The Intel launch MSRP is stated as $319, which may be stated once as launch MSRP, nothing more. The AMD part has no launch MSRP listed.

Both processors are marked active in production status. Neither has an unlocked multiplier, so overclocking via multiplier adjustment is not supported on either platform. The Intel part number is listed as SA4QC, while the AMD part number is unknown.

FAQ

Q: Which processor has the higher boost clock?

A: The Intel Core 5 223PQE reaches 5.50 GHz boost, 400 MHz higher than the AMD Ryzen Embedded 8845HS at 5.10 GHz. The Intel chip also leads base clocks at 4.00 GHz versus 3.80 GHz.

Q: Do both processors support ECC memory?

A: Yes, both the AMD Ryzen Embedded 8845HS and the Intel Core 5 223PQE list ECC memory as enabled. This makes both suitable for embedded or server-adjacent workloads where memory error correction is required.

Q: What memory types does each processor support?

A: The AMD Ryzen Embedded 8845HS supports only DDR5. The Intel Core 5 223PQE supports both DDR4 and DDR5. Both operate on dual-channel memory buses with 89.6 GB/s theoretical bandwidth.

Q: How many cores and threads does each CPU have?

A: Both processors have identical core and thread counts: 8 cores and 16 threads. This parity means thread-heavy workloads will not see a core-count advantage on either side.

Q: Which CPU has more L3 cache?

A: The Intel Core 5 223PQE has 24 MB of shared L3 cache, while the AMD Ryzen Embedded 8845HS has 16 MB. Intel also leads in per-core L1 and L2 cache capacities.

Q: What are the socket and market segment differences?

A: The AMD Ryzen Embedded 8845HS uses AMD Socket FP8 and is classified as a mobile part. The Intel Core 5 223PQE uses Intel Socket 1700 and is classified as a desktop part.

Where Each One Wins

The Intel Core 5 223PQE wins on clock speed across both base and boost frequencies. A 4.00 GHz base clock and 5.50 GHz boost clock give it a raw frequency edge over the AMD Ryzen Embedded 8845HS. Higher clocks can directly benefit lightly threaded workloads, such as legacy single-threaded applications, interactive response times, or tasks that do not scale well across cores. The Intel chip also holds a clear cache advantage: 80 KB L1 per core, 2 MB L2 per core, and 24 MB L3 shared. For workloads with high data reuse, such as compression, parsing, or certain simulation loops, the larger caches can reduce stalls and improve throughput.

The Intel part also offers PCIe Gen 5 with 16 lanes. For systems using Gen 5 NVMe drives or accelerators, the doubled per-lane bandwidth can provide higher peak transfer rates than the AMD chip's Gen 4 implementation. The Intel processor's support for both DDR4 and DDR5 memory opens deployment flexibility, allowing builders to choose older DDR4 modules or newer DDR5 modules depending on platform constraints.

The AMD Ryzen Embedded 8845HS wins on power efficiency and process technology. At 45 W TDP versus 125 W, it draws 80 W less under the rated thermal envelope. That difference matters for fanless designs, compact embedded systems, battery-powered mobile deployments, or chassis with limited cooling. The 4 nm TSMC process is several generations ahead of the 10 nm Intel node in terms of feature size, which typically enables lower switching power and better performance per watt, though the database does not include measured power efficiency numbers.

AMD also offers more PCIe lanes at 20, even though they are Gen 4. Systems that need many simultaneous connections, such as industrial controllers with multiple network cards, capture cards, or storage adapters, may benefit from the extra lanes. The Radeon 780M integrated GPU is positioned as a higher-end integrated graphics solution compared to Intel's UHD Graphics 770, which could matter for embedded systems with GPU-accelerated display or compute tasks, though no iGPU benchmark data exists in the database.

In scenarios where raw frequency and cache capacity dominate, the Intel Core 5 223PQE appears favored. In scenarios where thermal budget, process efficiency, lane count, or integrated graphics capability are the deciding factors, the AMD Ryzen Embedded 8845HS appears favored. The two chips are not direct substitutes: one is a mobile embedded processor, the other a desktop embedded processor.

Specification Differences

The core count and thread count are identical at 8 and 16, respectively. The memory bandwidth is also identical at 89.6 GB/s, as is the dual-channel memory bus. ECC support is present on both. Neither processor has an unlocked multiplier. Both are active in production status.

Clock speeds differ. AMD: base 3.80 GHz, boost 5.10 GHz. Intel: base 4.00 GHz, boost 5.50 GHz. Intel leads both by 200 MHz and 400 MHz, respectively.

TDP differs sharply. AMD is rated at 45 W. Intel is rated at 125 W. That is an 80 W gap in thermal design power.

Sockets differ. AMD uses AMD Socket FP8. Intel uses Intel Socket 1700.

Process node and foundry differ. AMD uses 4 nm TSMC. Intel uses 10 nm Intel.

Transistor count and die size are listed only for AMD: 25,000 million transistors and 178 mm². Intel has no listed transistor count or die size in the database.

Cache capacities differ at every level. AMD L1: 64 KB per core. Intel L1: 80 KB per core. AMD L2: 1 MB per core. Intel L2: 2 MB per core. AMD L3: 16 MB shared. Intel L3: 24 MB shared.

Memory support differs. AMD supports DDR5 only. Intel supports DDR4 and DDR5.

PCIe differs. AMD: Gen 4, 20 lanes (CPU only). Intel: Gen 5, 16 lanes (CPU only).

Integrated graphics differ. AMD: Radeon 780M. Intel: UHD Graphics 770.

Market segment differs. AMD: Mobile. Intel: Desktop.

Release dates differ. AMD: April 2024. Intel: March 2026.

Launch MSRP differs. Intel has a launch MSRP of $319. AMD has no launch MSRP listed.

Architecture Differences

The AMD Ryzen Embedded 8845HS uses Zen 4 architecture with the Hawk Point codename, part of the 8000 series generation. Zen 4 is a modern high-performance core design from AMD, fabricated on a 4 nm TSMC process. The database lists 25,000 million transistors and a 178 mm² die size for this part. The smaller process node suggests denser transistor packing and lower operating voltages per transistor, which aligns with the 45 W TDP rating.

The Intel Core 5 223PQE uses the Bartlett Lake codename, listed in the Core 5 generation. The database does not provide an architecture name beyond the codename, but the process node is 10 nm from Intel. This is a larger process feature size than the AMD 4 nm node. The Intel chip has a 125 W TDP, which is consistent with a less power-efficient process node and a desktop-oriented power envelope.

Cache structure reflects different design philosophies. AMD allocates 64 KB L1 and 1 MB L2 per core, with 16 MB shared L3. Intel allocates 80 KB L1 and 2 MB L2 per core, with 24 MB shared L3. Intel dedicates more silicon to cache at each level, which can benefit workloads with high locality. AMD's smaller cache allocation may be balanced by the lower-latency characteristics of Zen 4, though latency data is not present in the database.

Memory controller design differs. AMD supports only DDR5, while Intel supports both DDR4 and DDR5. Both achieve the same theoretical bandwidth of 89.6 GB/s on a dual-channel bus. The Intel approach offers broader memory compatibility, while the AMD approach focuses exclusively on the newer standard.

PCIe implementation differs by generation and lane count. AMD provides Gen 4 across 20 lanes. Intel provides Gen 5 across 16 lanes. Gen 5 provides double the per-lane bandwidth of Gen 4, so the Intel controller can move more data per lane. The AMD controller provides more total lanes for parallel device connectivity. Embedded systems often use PCIe for storage, networking, and accelerators, so this tradeoff has real implications.

Integrated graphics architectures differ. AMD uses Radeon 780M, which is built on the RDNA integrated graphics line and is positioned as a high-tier iGPU in the AMD mobile stack. Intel uses UHD Graphics 770, which is the mainstream Intel Xe-based graphics solution found in desktop processors. The database does not include graphics benchmark scores, so relative GPU performance cannot be quantified.

The mobile versus desktop market segment distinction influences the platform context. The AMD part uses Socket FP8, a mobile socket, and is rated at 45 W, fitting thin-and-light embedded systems, industrial laptops, or compact fanless units. The Intel part uses Socket 1700, a desktop socket, and is rated at 125 W, fitting larger embedded PCs, edge servers, or workstation-class systems with active cooling. Release timing also differs, with AMD launching in April 2024 and Intel dated March 2026, roughly two years later. Both are active in production as of the database records.

The architecture differences combine to create two distinct deployment profiles. The AMD Ryzen Embedded 8845HS is a power-lean, mobile-socket processor with a modern 4 nm process, exclusive DDR5 support, 20 Gen 4 PCIe lanes, and a high-tier Radeon iGPU. The Intel Core 5 223PQE is a higher-power, desktop-socket processor with a 10 nm process, DDR4/DDR5 flexibility, 16 Gen 5 PCIe lanes, larger caches, and higher clock speeds. Benchmark data is not yet available to rank their real-world performance, so the recorded specifications are the primary basis for comparison.