AMD Ryzen AI Embedded P174i vs Intel Core 9 273PTE Comparison

Head-to-Head Benchmarks

The database contains no directly paired benchmark scores for the AMD Ryzen AI Embedded P174i and the Intel Core 9 273PTE. However, the recorded data for the Intel part provides a clear performance profile, while the AMD part’s percentile ranking and architectural details allow for indirect comparison based on known measurement patterns.

The Intel Core 9 273PTE delivers a multi-core Cinebench R23 score of 20445, with a single-core score of 2886 in the same test. In Cinebench R20, it scores 8586 multi-core and 1212 single-core, while in Cinebench R15 it reaches 2060 multi-core and 290 single-core. These results show a consistent scaling pattern across rendering workloads, with the multi-core advantage growing as the test becomes more demanding.

For PassMark integer math, the Intel part scores 82411, while floating-point math reaches 60673. Data compression hits 258704, and data encryption scores 14253. Extended instructions produce 15952, and random string sorting achieves 28973. The multi-thread PassMark score is 24054, with physics at 1917 and single-thread at 3433.

The AMD Ryzen AI Embedded P174i has no individual benchmark scores in the database, but it holds a percentile rank of 50 against all CPUs. The Intel Core 9 273PTE sits at the 82nd percentile, indicating it outperforms a significantly larger share of the CPU population. The Intel part’s average benchmark score of 31143 places it near the Intel Core i7-12700F, which scores 31081 and is only 0.2% slower. The AMD Ryzen 9 8945HS also sits close at 31074, again 0.2% behind. The Intel Core i7-13700TE trails by 0.4% with 31028, while the Intel Core i7-12650HX leads the Intel Core 9 273PTE by 0.5% with 31290.

Because the AMD part has no direct scores, the head-to-head comparison relies on the structural differences in core counts, clock speeds, and cache configurations. The Intel part uses 12 cores and 24 threads, while the AMD part uses 10 cores and 20 threads. This gives the Intel part a 20% thread advantage, which typically translates to higher multi-threaded throughput in heavily parallel workloads. The Intel part also boosts to 5.50 GHz versus 5.00 GHz for the AMD part, a 10% higher peak clock that favors single-thread responsiveness.

Where Each One Wins

The Intel Core 9 273PTE wins in scenarios that demand sustained multi-core performance. Its 12 cores and 24 threads, combined with 36 MB of shared L3 cache, position it well for rendering, video encoding, simulation, and other workloads that scale with thread count. The Cinebench R23 multi-core score of 20445 confirms this capability, and the 82nd percentile ranking suggests it handles these tasks better than most CPUs in the database.

The AMD Ryzen AI Embedded P174i wins in power-constrained environments. Its 28 W TDP is substantially lower than the Intel part’s 45 W TDP, making it suitable for compact systems, embedded applications, and mobile chassis where thermal and power budgets are tight. The AMD part also uses a 4 nm process from TSMC, which typically delivers higher energy efficiency per transistor compared to Intel’s 10 nm node. The AMD part’s 5.00 GHz boost clock, while lower than the Intel part’s 5.50 GHz, still provides respectable single-thread performance for interactive tasks.

For memory flexibility, the Intel part supports both DDR4 and DDR5, while the AMD part supports DDR5 and LPDDR5X. This gives the Intel part an advantage in systems that reuse older DDR4 modules, whereas the AMD part offers low-power LPDDR5X for thin-and-light designs. Both parts support ECC memory, which matters for reliability-sensitive embedded and server-like workloads.

In terms of PCIe connectivity, the Intel part uses Gen 5 with 16 lanes, offering double the bandwidth per lane compared to the AMD part’s Gen 4 with 16 lanes. This favors the Intel part for high-throughput peripherals such as modern GPUs or NVMe storage. However, the AMD part’s integrated Radeon 880M graphics likely outperforms the Intel UHD Graphics 730 in iGPU-bound tasks, though the database does not include specific graphics benchmark scores for either part.

The Verdict

The recorded data indicates that the Intel Core 9 273PTE is the stronger performer in compute-heavy applications. Its 82nd percentile ranking, 12 cores, 24 threads, and 36 MB L3 cache deliver a multi-core Cinebench R23 score of 20445, placing it within 0.5% of the Intel Core i7-12650HX and 0.2% of the Intel Core i7-12700F. For users running rendering, compilation, or data-processing workloads, the Intel part provides a clear performance advantage.

The AMD Ryzen AI Embedded P174i targets a different use case. Its 28 W TDP and 4 nm process make it a fit for power-sensitive embedded systems and mobile devices, where the Intel part’s 45 W TDP would be impractical. The AMD part’s 10 cores and 20 threads still offer solid multi-threading for its class, and its 5.00 GHz boost clock ensures responsive single-thread behavior. The AMD part also supports LPDDR5X, which is absent from the Intel part’s memory specification.

The Intel Core 9 273PTE has a launch MSRP of $549. The AMD part has no recorded launch MSRP. The Intel part targets desktop systems with Socket 1700, while the AMD part uses AMD Socket FP8 for mobile and embedded platforms. The choice between these two CPUs depends primarily on the target platform: desktop builders with power headroom should select the Intel part, while embedded and mobile designers with strict power budgets should select the AMD part.

FAQ

Q: Which CPU has more cores and threads?

A: The Intel Core 9 273PTE has 12 cores and 24 threads, while the AMD Ryzen AI Embedded P174i has 10 cores and 20 threads.

Q: What is the boost clock difference between the two?

A: The Intel Core 9 273PTE boosts to 5.50 GHz, while the AMD Ryzen AI Embedded P174i boosts to 5.00 GHz.

Q: How much L3 cache does each CPU have?

A: The Intel Core 9 273PTE has 36 MB of shared L3 cache, while the AMD Ryzen AI Embedded P174i has 16 MB of L3 cache.

Q: Which CPU supports DDR4 memory?

A: The Intel Core 9 273PTE supports both DDR4 and DDR5, while the AMD Ryzen AI Embedded P174i supports DDR5 and LPDDR5X only.

Q: What is the TDP of each CPU?

A: The AMD Ryzen AI Embedded P174i has a TDP of 28 W, while the Intel Core 9 273PTE has a TDP of 45 W.

Q: Which CPU has a higher percentile ranking in the database?

A: The Intel Core 9 273PTE ranks at the 82nd percentile against all CPUs, while the AMD Ryzen AI Embedded P174i ranks at the 50th percentile.

Architecture Differences

The AMD Ryzen AI Embedded P174i uses the Gorgon Point codename and belongs to the Ryzen AI Embedded generation based on Zen 5 and Zen 5c cores. It is fabricated on a 4 nm process at TSMC, with a die size of 233 mm². The Intel Core 9 273PTE uses the Bartlett Lake codename and belongs to the Core 9 generation. It is fabricated on a 10 nm process at Intel, with no die size recorded.

The AMD part implements a hybrid core design with Zen 5 and Zen 5c variants, which typically allows a mix of high-performance and high-efficiency cores. The Intel part also uses a hybrid architecture, though the database does not specify the exact core types. Both parts support simultaneous multithreading, given their thread counts exceed core counts.

The cache hierarchy differs significantly. The AMD part uses 80 KB of L1 cache per core and 1 MB of L2 cache per core, with 16 MB of L3 cache. The Intel part uses the same 80 KB of L1 cache per core but doubles the L2 cache to 2 MB per core, and provides 36 MB of shared L3 cache. The larger L2 and L3 caches on the Intel part likely reduce memory latency for frequently accessed data.

The AMD part integrates Radeon 880M graphics, while the Intel part integrates UHD Graphics 730. Both parts support ECC memory, which is unusual for consumer CPUs and suggests a focus on embedded or workstation reliability. The AMD part uses 4 nm TSMC fabrication, while the Intel part uses 10 nm Intel fabrication, which impacts transistor density and power efficiency.

Specification Differences

The two CPUs differ in core count, with the Intel part offering 12 cores versus 10 for the AMD part. Thread counts follow accordingly, at 24 versus 20. Base clocks differ, with the AMD part at 2.00 GHz and the Intel part at 1.40 GHz. Boost clocks also differ, with the Intel part reaching 5.50 GHz versus 5.00 GHz for the AMD part.

TDP is a major differentiator: the AMD part consumes 28 W, while the Intel part consumes 45 W. The socket types are incompatible, with the AMD part using AMD Socket FP8 and the Intel part using Intel Socket 1700. The process nodes differ, with the AMD part at 4 nm and the Intel part at 10 nm.

Memory support varies: the AMD part supports DDR5 and LPDDR5X, while the Intel part supports DDR4 and DDR5. Both use dual-channel memory buses and achieve the same memory bandwidth of 89.6 GB/s. PCIe generation differs, with the AMD part using Gen 4 and the Intel part using Gen 5, both with 16 lanes.

The integrated graphics differ, with the AMD part featuring Radeon 880M and the Intel part featuring UHD Graphics 730. The Intel part has a recorded part number of SA4QJ and a launch MSRP of $549, while the AMD part has no recorded part number or launch MSRP. The release dates are close, with the AMD part on 2026-02-28 and the Intel part on 2026-03-08. Both CPUs are currently active in production, and neither has an unlocked multiplier.