AMD Ryzen AI Embedded P174 vs Intel Core 9 273PE Comparison

AMD
AMD

AMD Ryzen AI Embedded P174

CORE STATE Gorgon Point
CORE SPECS 10 Cores / 20 Threads
CLOCK SPEED 2 Base / 5 GHz Turbo
CACHE 16 MB
MAX TDP 28W
ARCHITECTURE Gorgon Point
nm
PROCESS 4 nm
LAUNCH DATE 2026
VS
Intel
INTEL

Core 9 273PE

CORE STATE Bartlett Lake
CORE SPECS 12 Cores / 24 Threads
CLOCK SPEED 2.3 Base / 5.7 GHz Turbo
CACHE 36 MB (shared)
MAX TDP 65W
ARCHITECTURE Bartlett Lake
nm
PROCESS 10 nm
LAUNCH DATE 2026

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
N/A
3,153
cinebench_cinebench_r15_singlecore
N/A
445
cinebench_cinebench_r20_multicore
N/A
13,140
cinebench_cinebench_r20_singlecore
N/A
1,855
cinebench_cinebench_r23_multicore
N/A
31,288
cinebench_cinebench_r23_singlecore
N/A
4,417
passmark_data_compression
N/A
405,885
passmark_data_encryption
N/A
22,719
passmark_extended_instructions
N/A
24,630
passmark_find_prime_numbers
N/A
203
passmark_floating_point_math
N/A
107,884
passmark_integer_math
N/A
139,410
passmark_multithread
N/A
36,810
passmark_physics
N/A
3,120
passmark_random_string_sorting
N/A
45,098
passmark_single_thread
N/A
3,650
passmark_singlethread
N/A
3,650

Analysis: AMD Ryzen AI Embedded P174 vs Intel Core 9 273PE

FAQ

Q: What are the core and thread counts for each processor?

A: The AMD Ryzen AI Embedded P174 has 10 cores and 20 threads. The Intel Core 9 273PE has 12 cores and 24 threads.

Q: Which processor has the higher boost clock?

A: The Intel Core 9 273PE boosts to 5.70 GHz, while the AMD Ryzen AI Embedded P174 boosts to 5.00 GHz.

Q: What is the difference in process node size?

A: The AMD Ryzen AI Embedded P174 is fabricated on a 4 nm process by TSMC. The Intel Core 9 273PE uses a 10 nm process from Intel.

Q: Which processor supports PCIe Gen 5?

A: The Intel Core 9 273PE supports PCIe Gen 5 with 16 lanes (CPU only). The AMD Ryzen AI Embedded P174 supports PCIe Gen 4 with the same 16-lane count.

Q: What is the L3 cache capacity for each chip?

A: The AMD Ryzen AI Embedded P174 has 16 MB of L3 cache. The Intel Core 9 273PE has 36 MB of shared L3 cache.

Q: What is the launch MSRP of the Intel part?

A: The Intel Core 9 273PE has a launch MSRP of $549.

Architecture Differences

The AMD Ryzen AI Embedded P174 uses the Gorgon Point codename and belongs to the Ryzen AI Embedded generation built on Zen 5 / Zen 5c cores. It is manufactured on a 4 nm process at TSMC, with a die size of 233 mm². The processor integrates a Radeon 880M graphics solution. The CPU supports DDR5 and LPDDR5X memory over a dual-channel bus, delivering 89.6 GB/s of bandwidth. ECC memory is supported. The platform uses AMD Socket FP8, which targets the mobile segment. The production status is Active, with a release date of February 28, 2026.

The Intel Core 9 273PE carries the Bartlett Lake codename and belongs to the Core 9 generation. It uses a 10 nm process fabricated by Intel. The die size is not recorded. The integrated graphics are UHD Graphics 730. Memory support includes both DDR4 and DDR5, also over a dual-channel bus with the same 89.6 GB/s bandwidth. ECC memory is supported. The socket is Intel Socket 1700, and the market segment is Desktop. The release date is March 8, 2026, and the part number is SA4QD.

The two designs differ in core organization. The AMD part uses a hybrid arrangement of Zen 5 and Zen 5c cores, with 10 cores and 20 threads total. The Intel part uses 12 cores and 24 threads, with a larger per-core L2 cache of 2 MB compared to 1 MB for the AMD chip. The L1 cache is identical at 80 KB per core. The L3 cache favors Intel significantly: 36 MB shared versus 16 MB on the AMD processor.

Process node and foundry divergence is notable. The AMD chip uses a 4 nm process from TSMC, while Intel uses its own 10 nm process. This difference typically affects power efficiency and thermal characteristics. The TDP values reflect that: the AMD part is rated at 28 watts, while the Intel part is rated at 65 watts. The socket types are incompatible, so platform choice is constrained by motherboard selection.

PCIe support differs by generation. The AMD processor provides PCIe Gen 4 with 16 lanes (CPU only). The Intel processor provides PCIe Gen 5 with the same 16 lanes (CPU only). This affects available bandwidth for discrete GPUs or storage devices. Memory flexibility also differs: AMD supports DDR5 and LPDDR5X, while Intel supports DDR4 and DDR5. Both support ECC.

The Verdict

The recorded data shows a clear performance hierarchy. The Intel Core 9 273PE holds the 90th percentile among all CPUs in the database, while the AMD Ryzen AI Embedded P174 sits at the 50th percentile. The average benchmark score for the Intel part is 49,845, whereas the AMD part has an average benchmark score of 0 in the current records. The Intel processor dominates the benchmark suite, with wins across every recorded test.

The AMD part is a mobile-oriented processor with a lower TDP of 28 watts, a 4 nm process, and integrated Radeon 880M graphics. The Intel part is a desktop processor with a TDP of 65 watts, a 10 nm process, and UHD Graphics 730. The Intel part uses more power and more cores, and it delivers higher clock speeds. The AMD part offers a smaller process node and LPDDR5X memory support, which are relevant for power-constrained or compact systems.

For users who need maximum multi-threaded and single-threaded performance, the Intel Core 9 273PE is the choice based on benchmark results. It leads in every test category, including Cinebench and Passmark workloads. The AMD processor, while having no recorded benchmark scores in this dataset, is positioned for embedded and mobile use cases where the 28-watt TDP and 4 nm process may be more suitable. The data does not show any performance advantage for the AMD part.

Specification Differences

The two processors differ in several key specifications. The AMD Ryzen AI Embedded P174 has 10 cores and 20 threads, while the Intel Core 9 273PE has 12 cores and 24 threads. The base clock is 2.00 GHz for AMD and 2.30 GHz for Intel. The boost clock is 5.00 GHz for AMD and 5.70 GHz for Intel. The TDP is 28 watts for AMD and 65 watts for Intel.

The socket types are different: AMD uses Socket FP8, Intel uses Socket 1700. The codenames are Gorgon Point for AMD and Bartlett Lake for Intel. The process nodes are 4 nm (TSMC) for AMD and 10 nm (Intel) for Intel. The die size is 233 mm² for AMD and not recorded for Intel.

Cache configurations differ. The L1 cache is 80 KB per core for both. The L2 cache is 1 MB per core for AMD and 2 MB per core for Intel. The L3 cache is 16 MB for AMD and 36 MB shared for Intel.

Memory support differs. AMD supports DDR5 and LPDDR5X, while Intel supports DDR4 and DDR5. Both use dual-channel memory buses with 89.6 GB/s bandwidth. Both support ECC memory.

PCIe support differs by generation: AMD uses Gen 4 with 16 lanes, Intel uses Gen 5 with 16 lanes. The integrated graphics are Radeon 880M for AMD and UHD Graphics 730 for Intel. The market segments are Mobile for AMD and Desktop for Intel. The release dates are February 28, 2026 for AMD and March 8, 2026 for Intel. The Intel part has a launch MSRP of $549; the AMD part has no recorded launch MSRP.

Head-to-Head Benchmarks

The database contains no direct head-to-head benchmark entries for this pair. The available benchmark data covers the Intel Core 9 273PE only. The AMD Ryzen AI Embedded P174 has no recorded benchmark scores in the current dataset. The comparison therefore relies on the Intel part's individual scores and its position relative to other CPUs.

The Intel Core 9 273PE achieves a Cinebench R15 multicore score of 3153 and a single-core score of 445. In Cinebench R20, the multicore score is 13140 and the single-core score is 1855. Cinebench R23 results show a multicore score of 31288 and a single-core score of 4417. These scores indicate strong multi-threaded capability, consistent with the 12-core and 24-thread configuration.

Passmark results for the Intel part show a multithread score of 36810 and a single-thread score of 3650. The integer math score is 139410, the floating-point math score is 107884, and the extended instructions score is 24630. Data compression scores 405885, data encryption scores 22719, and random string sorting scores 45098. The physics score is 3120, and the find prime numbers score is 203.

The nearest rivals for the Intel part provide context. The AMD Ryzen AI Max+ 388 has an average score of 49796, which is 0.1% higher than the Intel part's 49845. The Intel Core i5-14600KF scores 49394, which is 0.9% lower. The Intel Core i9-13980HX scores 50398, which is 1.1% higher. The AMD Ryzen AI 9 HX PRO 370 scores 50448, which is 1.2% higher. These deltas are small, placing the Intel Core 9 273PE in a tight competitive band around the 49,800 to 50,400 average score range.

The AMD Ryzen AI Embedded P174 has an average benchmark score of 0 and no nearest rivals listed. The percentile of 50 indicates it sits at the median of all CPUs in the database, but without benchmark data, the practical performance cannot be quantified from these records.

Where Each One Wins

The Intel Core 9 273PE wins in every recorded benchmark category, based on the available data. It shows strength in multi-threaded workloads, as demonstrated by the Cinebench R23 multicore score of 31288 and the Passmark multithread score of 36810. The single-thread performance is also strong, with a Cinebench R23 single-core score of 4417 and a Passmark single-thread score of 3650. This combination suits applications that benefit from both high core counts and high per-core speeds, such as rendering, compilation, and simulation tasks.

The Passmark integer math score of 139410 and floating-point math score of 107884 indicate capability in general-purpose computing, scientific calculations, and financial modeling. The data compression score of 405885 suggests efficient handling of archival and storage workloads. The random string sorting score of 45098 points to solid performance in text processing and database operations. The physics score of 3120 aligns with simulation and physical modeling tasks.

The AMD Ryzen AI Embedded P174 has no recorded wins in this dataset. Its potential advantages are contextual rather than benchmark-driven. The 28-watt TDP and 4 nm process suggest suitability for power-sensitive embedded environments, where thermal limits and energy consumption are primary constraints. The support for LPDDR5X memory indicates a design for mobile or compact systems. The Radeon 880M integrated graphics may offer different capabilities than the Intel UHD Graphics 730, but no comparative graphics data is available.

The Intel part's nearest rivals show that the performance edge is narrow. The AMD Ryzen AI Max+ 388 is 0.1% faster, and the AMD Ryzen AI 9 HX PRO 370 is 1.2% faster. The Intel Core i9-13980HX is 1.1% faster, while the Intel Core i5-14600KF is 0.9% slower. The Intel Core 9 273PE sits within a 1.2% band of these competitors, indicating that the choice among these processors would depend on platform, power, and price considerations rather than large performance gaps.

For users prioritizing raw compute performance, the Intel Core 9 273PE is the only processor with measured data supporting it. The AMD processor's lack of benchmark scores means no performance claims can be made from the database. The selection between these two parts, from the recorded information, comes down to the Intel part for performance and the AMD part for lower power consumption and a smaller process node.

DETAILED SPECIFICATIONS

SPECIFICATION
AI Embedded P174
9 273PE
Core Specs
Cores
10
12 +20.0%
Threads
20
24 +20.0%
Base Clock (GHz)
2
2.3 +15.0%
Boost Clock (GHz)
5
5.7 +14.0%
Frequency (GHz)
2
2.3 +15.0%
Turbo Clock (GHz)
5
5.7 +14.0%
Multiplier
20
23 +15.0%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
80 KB (per core)
80 KB (per core)
L2 Cache
1 MB (per core)
2 MB (per core)
L3 Cache
16 MB
36 MB (shared)
Power
TDP (W)
28
65 +132.1%
PL1
—
65 W
PL2
—
219 W
Configurable TDP
15-54 W
—
Architecture
Codename
Gorgon Point
Bartlett Lake
Generation
Ryzen AI Embedded (Zen 5 / Zen 5c)
Core 9 (Bartlett Lake)
Process Size
4 nm
10 nm
Die Size
233 mm²
—
Foundry
TSMC
Intel
Memory
Memory Support
DDR5, LPDDR5X
DDR4, DDR5
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
89.6 GB/s
89.6 GB/s
ECC Memory
Yes
Yes
DDR4 Speed
—
3200 MT/s
Platform
Socket
AMD Socket FP8
Intel Socket 1700
Chipsets
—
W680, R680E, Q670e, Q670, H610E, H610
PCIe
Gen 4, 16 Lanes(CPU only)
Gen 5, 16 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
4 + 6
—
E-Core Frequency
1400 MHz up to 3.2 GHz
—
P-Core Turbo
—
5.4 GHz
AI/NPU
NPU
Yes / 50 TOPS
—
Graphics
Integrated Graphics
Radeon 880M
UHD Graphics 730
Other
Market
Mobile
Desktop
Production Status
Active
Active
Launch Price
—
$549
Part Number
unknown
SA4QD
Package
FP8
FC-LGA16A
Tj Max
105°C
100°C
View Ryzen AI Embedded P174 Details View Core 9 273PE Details