AMD Ryzen 3 3100U vs AMD Ryzen Embedded 8845HS Comparison

Head-to-Head Benchmarks

The benchmark database contains no direct head-to-head matchup between the AMD Ryzen 3 3100U and the AMD Ryzen Embedded 8845HS. The headToHeadBenchmarks array is empty, and neither processor has recorded wins against the other. This absence of direct comparison data is itself informative: the two chips occupy such different performance tiers that standardized cross-testing has not been conducted, or at least has not been logged in the database.

What can be assessed is the standalone benchmark profile of the Ryzen 3 3100U, which has a full set of PassMark results, versus the Ryzen Embedded 8845HS, which has no recorded benchmark scores at all in the database. The 3100U posts an average benchmark score of 6,247, placing it at the 62nd percentile of all CPUs tracked. Its nearest rivals in the database include the AMD Ryzen Threadripper 1950X with an average score of 6,231 (a delta of 0.3%), the AMD EPYC 7272 at 6,186 (1% ahead), the Intel Core i9-10920X at 6,347 (1.6% behind), and the Intel Core i9-7940X at 6,147 (1.6% ahead). These deltas are small, indicating the 3100U sits in a tightly clustered performance band despite its modest core count.

Looking at individual PassMark subtests for the 3100U, data compression scores 38,455, which is its strongest result by a wide margin. Integer math scores 8,873, floating point math scores 5,854, and extended instructions score 2,116. Single-thread performance is recorded at 1,592, with multithread at 3,348. Physics processing scores 232, random string sorting scores 4,666, data encryption scores 1,972, and prime number finding scores 18. The gap between the compression score and the rest of the suite suggests the 3100U's architecture handles memory-intensive or vectorized workloads disproportionately well relative to its raw compute throughput.

The Ryzen Embedded 8845HS, by contrast, has an average benchmark score of 0 and a 50th percentile ranking, which reflects missing data rather than actual performance parity. With 8 cores and 16 threads versus the 3100U's 2 cores and 2 threads, the raw thread count difference is 4x in the Embedded chip's favor. Clock speeds reinforce this: the 8845HS bases at 3.80 GHz and boosts to 5.10 GHz, while the 3100U bases at 1.90 GHz and boosts to 3.20 GHz. These figures alone imply a substantial performance gap, but without direct benchmark results, the database cannot quantify it.

Architecture Differences

The architectural divide between these two processors is generational and fundamental. The Ryzen 3 3100U uses the Picasso codename, built on the Zen+ microarchitecture, while the Ryzen Embedded 8845HS uses the Hawk Point codename with the Zen 4 architecture. The 3100U is manufactured on a 12 nm process at GlobalFoundries, containing 4,940 million transistors on a 210 mm² die. The 8845HS uses a 4 nm process at TSMC, with 25,000 million transistors on a 178 mm² die. The transistor density difference is stark: the 8845HS packs roughly 5x more transistors into a smaller physical area, reflecting the process node advantage.

Cache hierarchies differ significantly. The 3100U has 96 KB of L1 cache per core, 512 KB of L2 per core, and 4 MB of shared L3 cache. The 8845HS has 64 KB of L1 per core, 1 MB of L2 per core, and 16 MB of shared L3 cache. Despite having less L1 per core, the 8845HS has 2x the L2 per core and 4x the total L3. With 8 cores, its aggregate L2 is 8 MB versus 1 MB for the 3100U, and its L3 is 16 MB versus 4 MB.

Memory support diverges completely. The 3100U supports DDR4 with dual-channel memory and a bandwidth of 38.4 GB/s. The 8845HS supports DDR5 with dual-channel memory and a bandwidth of 89.6 GB/s, a 2.3x improvement. ECC memory is not supported on the 3100U but is supported on the 8845HS, which is notable for an embedded-market processor. PCIe generation also differs: the 3100U uses Gen 3, while the 8845HS uses Gen 4 with 20 lanes (CPU only).

Integrated graphics present another contrast. The 3100U carries Radeon Vega 8, while the 8845HS carries Radeon 780M. Both are integrated solutions, but the 780M is from a later architecture generation. The 8845HS also has a higher base clock of 3.80 GHz versus 1.90 GHz, and a higher boost clock of 5.10 GHz versus 3.20 GHz. Its TDP is 45 watts versus 15 watts for the 3100U, a 3x increase that likely reflects the additional cores and higher clock speeds.

The socket types differ as well: the 3100U uses AMD Socket FP5, while the 8845HS uses AMD Socket FP8. Neither processor has an unlocked multiplier, so overclocking is not a differentiator. The 3100U has a known part number (YM3100C4T2OFG), while the 8845HS part number is listed as unknown in the database.

FAQ

Q: Which processor has more cores and threads?

A: The AMD Ryzen Embedded 8845HS has 8 cores and 16 threads, while the AMD Ryzen 3 3100U has 2 cores and 2 threads. The 8845HS offers 4x the core count and 8x the thread count.

Q: What is the difference in process node and foundry?

A: The Ryzen 3 3100U uses a 12 nm process at GlobalFoundries with 4,940 million transistors. The Ryzen Embedded 8845HS uses a 4 nm process at TSMC with 25,000 million transistors. The 8845HS has roughly 5x more transistors despite a smaller die size of 178 mm² versus 210 mm².

Q: How do the cache sizes compare?

A: The 3100U has 96 KB of L1 per core, 512 KB of L2 per core, and 4 MB of shared L3. The 8845HS has 64 KB of L1 per core, 1 MB of L2 per core, and 16 MB of shared L3. The 8845HS has 4x the L3 cache and 2x the L2 per core.

Q: Which processor supports ECC memory?

A: The Ryzen Embedded 8845HS supports ECC memory, while the Ryzen 3 3100U does not. This makes the 8845HS more suitable for reliability-focused embedded workloads.

Q: What memory types do they support?

A: The 3100U supports DDR4 with 38.4 GB/s bandwidth. The 8845HS supports DDR5 with 89.6 GB/s bandwidth. Both use dual-channel memory buses.

Q: Is there any direct benchmark comparison data available?

A: No. The database contains no head-to-head benchmark results between these two processors. The 8845HS has no recorded benchmark scores, while the 3100U has a full PassMark suite with an average score of 6,247.

Specification Differences

| Specification | AMD Ryzen 3 3100U | AMD Ryzen Embedded 8845HS |

|---|---|---|

| Cores | 2 | 8 |

| Threads | 2 | 16 |

| Base Clock | 1.90 GHz | 3.80 GHz |

| Boost Clock | 3.20 GHz | 5.10 GHz |

| TDP | 15 W | 45 W |

| Socket | AMD Socket FP5 | AMD Socket FP8 |

| Architecture | Zen+ (Picasso) | Zen 4 (Hawk Point) |

| Process Node | 12 nm | 4 nm |

| Foundry | GlobalFoundries | TSMC |

| Transistors | 4,940 million | 25,000 million |

| Die Size | 210 mm² | 178 mm² |

| L1 Cache | 96 KB (per core) | 64 KB (per core) |

| L2 Cache | 512 KB (per core) | 1 MB (per core) |

| L3 Cache | 4 MB (shared) | 16 MB (shared) |

| Memory Support | DDR4 | DDR5 |

| Memory Bandwidth | 38.4 GB/s | 89.6 GB/s |

| ECC Memory | No | Yes |

| PCIe | Gen 3 | Gen 4, 20 Lanes (CPU only) |

| Integrated Graphics | Radeon Vega 8 | Radeon 780M |

| Release Date | 2026-05-31 | 2024-04-01 |

| Market Segment | Mobile | Mobile |

| Production Status | Active | Active |

| Multiplier Unlocked | No | No |

Both processors are manufactured by AMD, target the mobile market segment, are currently active in production, and lack unlocked multipliers. The 8845HS is from the 8000 series, while the 3100U is from the 3000 series. The 3100U has a part number listed, while the 8845HS does not. Neither has a launch MSRP recorded in the database.

The Verdict

The data presents an unambiguous performance hierarchy. The Ryzen Embedded 8845HS dominates on every compute-relevant specification: 4x the cores, 8x the threads, 2x the base clock, 1.6x the boost clock, 4x the L3 cache, 2x the L2 per core, and 2.3x the memory bandwidth. Its 4 nm process node with 25,000 million transistors versus the 3100U's 12 nm node with 4,940 million transistors indicates a far denser and more modern design. The 8845HS also supports ECC memory and PCIe Gen 4, neither of which the 3100U offers.

However, the database lacks direct benchmark confirmation. The 8845HS has no recorded scores, so its performance advantage is inferred from specifications rather than measured results. The 3100U, despite its modest core count and older architecture, achieves a 62nd percentile ranking and an average score of 6,247, placing it in the same performance band as high-core-count desktop and server processors like the Threadripper 1950X and EPYC 7272. This suggests that for certain workloads, particularly the data compression test where it scores 38,455, the 3100U punches above its weight.

The 8845HS also has a higher TDP of 45 watts versus 15 watts, which means it requires more power and cooling. Its release date of April 2024 predates the 3100U's May 2026 release, making the 3100U the more recent product despite being architecturally older. The 8845HS belongs to the 8000 series, while the 3100U belongs to the 3000 series, and the generation gap is evident in every major specification.

Where Each One Wins

The Ryzen 3 3100U wins on power efficiency and integration simplicity. Its 15 watt TDP is one-third of the 8845HS's 45 watt TDP, making it suitable for passively cooled or battery-constrained designs. Its smaller transistor count and older process node may also translate to lower manufacturing complexity for certain embedded applications. The 3100U's 62nd percentile ranking with an average score of 6,247, supported by a strong data compression result of 38,455, indicates that it handles specific algorithmic workloads competitively despite its 2-core limitation. Its DDR4 memory support and Gen 3 PCIe may be sufficient for legacy systems or applications that do not require the latest memory standards. The 3100U also has a known part number, which aids in procurement and traceability.

The Ryzen Embedded 8845HS wins on raw compute capability and modern feature support. Its 8 cores and 16 threads, combined with a 5.10 GHz boost clock and 16 MB of L3 cache, position it for multi-threaded workloads, virtualization, or real-time processing tasks that demand parallel throughput. The 89.6 GB/s DDR5 memory bandwidth is 2.3x the 3100U's 38.4 GB/s, benefiting memory-bound applications. ECC memory support provides data integrity for reliability-critical embedded deployments. PCIe Gen 4 with 20 lanes offers higher I/O bandwidth for peripherals. The 4 nm process with 25,000 million transistors and a smaller die size of 178 mm² indicates a more advanced manufacturing approach, potentially yielding better performance per transistor. The Radeon 780M integrated graphics represents a newer GPU generation than the Radeon Vega 8.

For workloads where power draw and thermal output are the primary constraints, the 3100U is the logical choice from the recorded data. For workloads where core count, clock speed, memory bandwidth, and ECC support are paramount, the 8845HS is the clear selection based on specifications. The absence of direct benchmark data for the 8845HS means its wins are projected from architecture and configuration rather than measured outcomes, while the 3100U's measured results provide concrete evidence of its capabilities.