AMD Ryzen 3 110 vs Qualcomm Snapdragon X2E-94-100 Comparison

Head-to-Head Benchmarks

The recorded database contains no head-to-head benchmark entries for the AMD Ryzen 3 110 and the Qualcomm Snapdragon X2E-94-100. Both processors show an average benchmark score of zero, and neither has any nearest rivals listed. The wins column for each side is also zero, meaning there are no direct measurement comparisons available for these two mobile processors.

The absence of benchmark data does not imply equivalence. The two chips occupy very different positions in the mobile processor landscape based on their recorded specifications. The AMD Ryzen 3 110 sits at the 50th percentile among all CPUs in the database, which indicates a mid-pack standing. The Qualcomm Snapdragon X2E-94-100 also records a 50th percentile, but that percentile is calculated across the same database and does not account for the architectural differences that separate these two parts.

Without direct scores, the only quantitative comparisons come from the specification sheet. The Snapdragon X2E-94-100 offers 18 cores and 18 threads, while the Ryzen 3 110 provides 4 cores and 8 threads. That is a 14-core and 10-thread gap in favor of the Qualcomm part. Clock speeds also favor the Snapdragon: its base clock of 4.45 GHz is 1.45 GHz higher than the Ryzen's 3.00 GHz base, and its boost clock of 4.70 GHz exceeds the Ryzen's 4.30 GHz boost by 0.40 GHz.

The memory subsystem shows an even larger divide. The Snapdragon supports LPDDR5X memory across a triple-channel bus, delivering 228.6 GB/s of bandwidth. The Ryzen uses DDR5 on a dual-channel bus, capping at 76.8 GB/s. That is a 151.8 GB/s difference, or roughly three times the bandwidth for the Qualcomm part.

The Ryzen counters in cache organization. Its L1 cache is 64 KB per core, while the Snapdragon's L1 is 288 KB per core. The Ryzen's L2 is 512 KB per core, versus the Snapdragon's 16 MB per module. The L3 cache favors the Snapdragon: 9 MB shared versus 8 MB shared for the Ryzen. Die size is close, with the Snapdragon at 220 mm² and the Ryzen at 210 mm², a 10 mm² difference.

Architecture Differences

The manufacturing process separates these two processors by a full node generation. The AMD Ryzen 3 110 uses TSMC's 6 nm process, while the Qualcomm Snapdragon X2E-94-100 uses TSMC's 3 nm process. That three-nanometer gap is significant for power efficiency and transistor density, though the database does not record transistor counts for either chip.

The Ryzen 3 110 is built on AMD's Zen 3+ architecture, codenamed Rembrandt-R. It belongs to the Ryzen 3 generation and fits into AMD Socket FP7. The Snapdragon X2E-94-100 uses the Glymur codename and belongs to the Snapdragon X2 Elite generation. Its socket is Qualcomm BGA 2343, which is a ball-grid array design that is not socketed in the traditional desktop sense.

Core counts reflect different design philosophies. The Ryzen uses 4 cores with 8 threads, meaning it supports simultaneous multithreading. The Snapdragon uses 18 cores with 18 threads, indicating no multithreading per core. This is a classic efficiency-core versus performance-core tradeoff, though the database does not specify P-core and E-core ratios for the Snapdragon.

Cache hierarchies diverge sharply. The Ryzen allocates 64 KB of L1 per core, 512 KB of L2 per core, and shares 8 MB of L3 across all four cores. The Snapdragon allocates 288 KB of L1 per core and 16 MB of L2 per module. Its L3 is 9 MB shared. The per-module L2 design suggests a clustered core topology that differs from the Ryzen's uniform per-core L2.

Memory support is another major architectural split. The Ryzen uses DDR5 with a dual-channel bus and ECC support enabled. The Snapdragon uses LPDDR5X with a triple-channel bus and no ECC support. The memory bandwidth advantage for the Snapdragon is 228.6 GB/s versus 76.8 GB/s, which is a direct consequence of the wider bus and faster memory type.

PCIe connectivity also differs. The Ryzen provides PCIe Gen 4 with 20 lanes available to the CPU. The Snapdragon provides PCIe Gen 5 with 12 lanes. The newer PCIe standard offers higher per-lane bandwidth, but the Ryzen has more total lanes.

Integrated graphics are present on both. The Ryzen uses the Radeon 660M, while the Snapdragon uses the Adreno X2-90. The database does not record shader counts, clock speeds, or performance metrics for either GPU, so no direct comparison is possible beyond naming.

Power characteristics are partially documented. The Ryzen has a TDP of 28 watts. The Snapdragon's TDP is not recorded in the database. The 6 nm versus 3 nm process difference implies the Snapdragon could achieve higher performance at similar power, but the missing TDP figure prevents any quantitative power analysis.

The Verdict

The recorded data points to a clear performance hierarchy, but with substantial caveats. The Snapdragon X2E-94-100 holds advantages in core count, clock speed, memory bandwidth, process node, and cache capacity. The Ryzen 3 110 holds advantages in PCIe lane count, ECC memory support, and smaller die size.

For multi-threaded workloads, the Snapdragon's 18 cores versus 4 cores is a decisive factor. The 14-core advantage, combined with a 1.45 GHz higher base clock, suggests the Snapdragon will dominate any parallel processing scenario. The triple-channel memory at 228.6 GB/s further supports this, as memory-bound multi-threaded tasks will have three times the bandwidth to feed the extra cores.

For single-threaded responsiveness, the Snapdragon's 4.70 GHz boost clock edges out the Ryzen's 4.30 GHz boost. The newer 3 nm process also implies better transistor switching characteristics, though the database does not provide instruction-level benchmarks to confirm this.

The Ryzen's strengths are narrower. Its 20 PCIe Gen 4 lanes offer more device connectivity than the Snapdragon's 12 PCIe Gen 5 lanes. ECC memory support makes the Ryzen suitable for error-sensitive workloads, a feature the Snapdragon lacks entirely. The 28-watt TDP is the only power figure available, and it positions the Ryzen as a low-power part.

Neither processor has benchmark scores in the database, so the verdict must rest on specifications alone. The data suggests the Snapdragon is designed for high-throughput mobile computing, while the Ryzen targets efficiency and stability. The 50th percentile ranking for both chips is identical, but that ranking does not factor in the architectural gulf between them.

FAQ

Q: Which processor has more cores?

A: The Qualcomm Snapdragon X2E-94-100 has 18 cores and 18 threads. The AMD Ryzen 3 110 has 4 cores and 8 threads.

Q: What is the memory bandwidth difference?

A: The Snapdragon supports LPDDR5X on a triple-channel bus with 228.6 GB/s. The Ryzen supports DDR5 on a dual-channel bus with 76.8 GB/s. The Snapdragon delivers 151.8 GB/s more bandwidth.

Q: Do both processors support ECC memory?

A: No. The Ryzen 3 110 has ECC memory support enabled. The Snapdragon X2E-94-100 does not support ECC.

Q: Which processor uses a smaller manufacturing process?

A: The Snapdragon uses TSMC's 3 nm process. The Ryzen uses TSMC's 6 nm process.

Q: What are the boost clock speeds?

A: The Snapdragon boosts to 4.70 GHz. The Ryzen boosts to 4.30 GHz. The Snapdragon's boost is 0.40 GHz higher.

Q: Which processor has more PCIe lanes?

A: The Ryzen provides 20 PCIe Gen 4 lanes. The Snapdragon provides 12 PCIe Gen 5 lanes.

Where Each One Wins

The Snapdragon X2E-94-100 wins in every category that directly affects raw computational throughput. Its 18 cores and 18 threads provide a 14-core and 10-thread advantage over the Ryzen. Its base clock of 4.45 GHz is 1.45 GHz higher, and its boost clock of 4.70 GHz is 0.40 GHz higher. The triple-channel LPDDR5X memory delivers 228.6 GB/s, which is 151.8 GB/s more than the Ryzen's dual-channel DDR5. The 9 MB L3 cache is 1 MB larger than the Ryzen's 8 MB. The 3 nm process node is two generations ahead of the 6 nm node used by the Ryzen. The 16 MB per-module L2 cache dwarfs the Ryzen's 512 KB per-core L2.

The Ryzen 3 110 wins in connectivity and reliability features. Its 20 PCIe Gen 4 lanes outnumber the Snapdragon's 12 PCIe Gen 5 lanes by eight lanes. ECC memory support is present on the Ryzen and absent on the Snapdragon. The Ryzen's 210 mm² die is 10 mm² smaller than the Snapdragon's 220 mm² die, which could indicate lower manufacturing cost per wafer, though the database does not record pricing. The Ryzen's 28-watt TDP is the only power figure recorded, giving it a defined power envelope that the Snapdragon lacks.

For workloads that scale with core count, such as rendering, compilation, or scientific simulation, the Snapdragon is the obvious choice based on core and memory advantages. For workloads that require data integrity through ECC, or that need many PCIe devices attached directly to the CPU, the Ryzen is the only option between these two.

Specification Differences

| Specification | AMD Ryzen 3 110 | Qualcomm Snapdragon X2E-94-100 |

|---|---|---|

| Cores | 4 | 18 |

| Threads | 8 | 18 |

| Base clock | 3.00 GHz | 4.45 GHz |

| Boost clock | 4.30 GHz | 4.70 GHz |

| TDP | 28 watts | Not recorded |

| Socket | AMD Socket FP7 | Qualcomm BGA 2343 |

| Architecture / codename | Zen 3+ (Rembrandt-R) | Glymur |

| Process node | 6 nm (TSMC) | 3 nm (TSMC) |

| Die size | 210 mm² | 220 mm² |

| L1 cache | 64 KB per core | 288 KB per core |

| L2 cache | 512 KB per core | 16 MB per module |

| L3 cache | 8 MB shared | 9 MB shared |

| Memory support | DDR5 | LPDDR5X |

| Memory bus | Dual-channel | Triple-channel |

| Memory bandwidth | 76.8 GB/s | 228.6 GB/s |

| ECC support | Yes | No |

| PCIe | Gen 4, 20 lanes | Gen 5, 12 lanes |

| Integrated graphics | Radeon 660M | Adreno X2-90 |

| Production status | Active | Active |

| Release date | 2025-09-30 | 2026-04-05 |

| Multiplier unlocked | No | No |