Intel Atom x7809C

Intel Atom x7809C is an 8-core, 8-thread mobile processor built on the Amston Lake architecture and Intel's 10 nm process. Its base clock is 2.00 GHz and its boost clock is 3.60 GHz, with a TDP of 25 W. The launch MSRP is $117. It uses the Intel BGA 1264 socket, supports DDR4 and DDR5 through a single-channel 38.4 GB/s memory interface, provides 9 Gen 3 PCIe lanes from the CPU, and is listed as Active in production with a release date of 2024-04-07. The part number is SRNEN.

Platform and Compatibility

The x7809C is specified for Intel BGA 1264. BGA packaging means the CPU is attached to the board, so the upgrade path is a board-level decision rather than a simple socketed CPU swap. The processor belongs to the Atom generation, listed as Atom (Gracemont), and the architecture record names Amston Lake as both architecture and codename. No series grouping is listed.

Memory support is DDR4 and DDR5. The memory bus is single-channel, and the listed memory bandwidth is 38.4 GB/s. ECC memory is not listed as supported. A single-channel bus gives all memory traffic one path to the CPU; with 8 cores and 8 threads, workloads that are memory-sensitive can be constrained by that path. The cache configuration helps: L1 is 96 KB per core, L2 is 2 MB per module, and L3 is 6 MB shared.

PCIe capability is Gen 3 with 9 lanes, labeled as CPU only. This means the listed I/O budget is provided directly by the processor; the data does not describe chipset-provided lanes. For expansion planning, 9 lanes of PCIe Gen 3 is a small direct-connect budget.

No integrated graphics are listed in the record, so display or graphics work must be handled elsewhere in the system. The platform is in the Mobile segment, with Active production status and a 2024-04-07 release date. The multiplier is not unlocked, making this a locked part.

Power and Thermals

The TDP is 25 W. This is a low-power rating, and the implied cooling tier is compact: a small low-profile cooler or a chassis designed for minimal heat rejection. The data does not provide a separate turbo power figure, so the sustained thermal behavior beyond the 25 W base is not defined.

The clock range is 2.00 GHz base to 3.60 GHz boost. The 3.60 GHz boost is high relative to the low TDP, suggesting that the power delivery is arranged to allow short single-thread bursts. The data does not state how long that boost lasts or how many cores can hold 3.60 GHz at once.

The manufacturing details list Intel as the foundry and a 10 nm process node. The 10 nm process is the only process-size figure in the record. Combined with the 25 W TDP, it frames the x7809C as a low-power mobile part.

Because no integrated graphics are listed, the 25 W figure is attributed to the CPU in this record, not to a GPU block. Production status is Active, and the multiplier is locked, so the part is not designed for user overclocking; the thermal and power management scheme is intended to operate within the stated nominal class.

Single-Thread vs Multi-Thread Behavior

The x7809C has 8 cores and 8 threads. Thread count equals core count, which means the data does not list extra threads per core. Multi-thread workloads can use eight software threads at most, while single-thread workloads can target the 3.60 GHz boost clock.

The base clock is 2.00 GHz. A 3.60 GHz boost ceiling is materially higher than the 2.00 GHz base, and this spread matters for workloads that alternate between light interaction and heavier compute. Lightly threaded tasks should be able to hit the upper clock range if thermal and power limits allow; the short declarative takeaway is that the boost clock, not the base clock, defines the single-thread experience.

The multi-thread split is different. Eight Gracemont cores provide parallel throughput, but with only one thread per core, there is no thread-level bonus beyond the core count. Shared L3 is 6 MB, L2 is 2 MB per module, and L1 is 96 KB per core. Multi-thread code that shares data can exploit the shared L3, while per-module L2 can capture local reuse.

Memory is a limiting factor in multi-thread performance. The DDR4/DDR5 interface is single-channel and rated at 38.4 GB/s. A single-thread workload rarely saturates this link; an 8-core workload can generate enough demand to approach the ceiling. So the real workload split is: single-thread responsiveness gets the benefit of 3.60 GHz, while multi-thread throughput is capped by 8 threads and a single memory channel.

How It Compares

The nearestRivals list for the x7809C is empty. There are no rival names, rival scores, or percentage deltas in the record. The only comparative position is percentileVsAllCpus, set to 50.

A value of 50 in a percentile field denotes the midpoint of the database's all-CPU distribution. The x7809C is therefore represented as a median part rather than a high- or low-end outlier. That mid-pack position makes sense for an 8-thread, 25 W mobile processor, but without rival entries, the database does not show which parts sit immediately above or below it.

Because no nearest rivals are defined, there are no rival-specific comparison paragraphs for this CPU. The comparison story is limited to the percentile value and the empty benchmark record.

Benchmark Performance

The benchmarks array is empty, and the average benchmark score is 0. There are no measured scores for the x7809C in this dataset, so exact percentage deltas cannot be computed. The database has not recorded any workload result that would allow a percentage comparison.

The percentileVsAllCpus field is 50. This is a rank, not a score. It places the part at the midpoint of the database's CPU population, but it does not measure operations per second, per-thread speed, or multi-core throughput. Without a nonzero average benchmark score, the percentile cannot be independently checked against a measured result.

Benchmark results indicate that no workload measurements are currently available. A reader can view the x7809C as a mid-tier mobile processor based on its percentile and specification, but no statement about relative speed by a certain percentage is supported by the data.

The specification profile can be summed up as: 2.00 GHz base, 3.60 GHz boost, 8 cores, 8 threads, 25 W TDP, 38.4 GB/s single-channel memory bandwidth, 9 PCIe Gen 3 lanes, and a 50th percentile rank. The performance picture is therefore one of a compact low-power part with a strong boost clock and a modest multi-thread ceiling.