AMD Ryzen 7 PRO 8845HS vs Qualcomm Snapdragon X1P-42-100 Comparison
AMD Ryzen 7 PRO 8845HS
Snapdragon X1P-42-100
PERFORMANCE BENCHMARKS
Analysis: AMD Ryzen 7 PRO 8845HS vs Qualcomm Snapdragon X1P-42-100
FAQ
Q: How do the two processors compare in terms of thread count?
A: The AMD Ryzen 7 PRO 8845HS has 8 cores and 16 threads, while the Qualcomm Snapdragon X1P-42-100 has 8 cores and 8 threads. The AMD processor can process twice as many threads simultaneously, which typically benefits heavily parallel workloads.
Q: What is the clock speed difference between the two chips?
A: The AMD Ryzen 7 PRO 8845HS has a base clock of 3.80 GHz and a boost clock of 5.10 GHz. The Qualcomm Snapdragon X1P-42-100 has a base clock of 3.40 GHz and no recorded boost clock in the database.
Q: Which processor has a higher memory bandwidth?
A: The Qualcomm Snapdragon X1P-42-100 supports LPDDR5X memory with a bandwidth of 135.2 GB/s. The AMD Ryzen 7 PRO 8845HS supports DDR5 memory with a bandwidth of 89.6 GB/s, which is approximately 34% lower than the Qualcomm part.
Q: What are the TDP ratings for each processor?
A: The AMD Ryzen 7 PRO 8845HS has a TDP of 45 watts, while the Qualcomm Snapdragon X1P-42-100 has a TDP of 30 watts. The Qualcomm chip is rated for lower power consumption.
Q: How does the AMD processor rank among all CPUs in the database?
A: The AMD Ryzen 7 PRO 8845HS sits at the 86th percentile among all CPUs. The Qualcomm Snapdragon X1P-42-100 sits at the 50th percentile, indicating a substantial gap in overall recorded performance.
Q: Do both processors use the same manufacturing process?
A: Yes, both chips are manufactured by TSMC on a 4 nm process node. The AMD processor uses the Zen 4 architecture with the Hawk Point codename, while the Qualcomm part uses the Oryon codename.
Architecture Differences
The AMD Ryzen 7 PRO 8845HS and Qualcomm Snapdragon X1P-42-100 represent two fundamentally different design philosophies. The AMD chip is built on the Zen 4 architecture with the Hawk Point codename, part of the 8000 series, and belongs to the Ryzen 7 generation. It is manufactured on a 4 nm process by TSMC and contains 25,000 million transistors on a die size of 178 mm². The Qualcomm Snapdragon X1P-42-100 uses the Oryon codename and is part of the Snapdragon X (Plus) generation, also fabricated on a 4 nm process by TSMC, but the database records no transistor count or die size for this part.
Cache organization differs significantly between the two designs. The AMD chip allocates 64 KB of L1 cache per core, 1 MB of L2 cache per core, and 16 MB of shared L3 cache. The Qualcomm processor uses 288 KB of L1 cache per core, 12 MB of L2 cache per module, and 6 MB of shared L3 cache. This gives the AMD part a larger total L2 cache pool across 8 cores (8 MB versus the Qualcomm approach of 12 MB per module), while the AMD chip has substantially more L3 cache available.
Memory support diverges as well. The AMD processor uses DDR5 memory with dual-channel configuration, while the Qualcomm chip uses LPDDR5X memory also in dual-channel. The Qualcomm part supports ECC memory, but the AMD part does not. PCIe connectivity also differs: AMD provides Gen 4 with 20 lanes (CPU only), while Qualcomm provides Gen 4 with 12 lanes (CPU only). The integrated graphics are the Radeon 780M on the AMD side and the Adreno X1-45 on the Qualcomm side.
The AMD processor uses AMD Socket FP7, while the Qualcomm chip uses Qualcomm BGA 2073. Neither processor has an unlocked multiplier. The AMD chip was released on April 15, 2024, while the Qualcomm chip was released on August 27, 2024. The AMD part has two recorded part numbers (100-000001316 for FP7r2 and 100-000001387 for FP7), while the Qualcomm part has a single part number (X1P42100).
Head-to-Head Benchmarks
The database contains no direct head-to-head benchmark comparisons between the AMD Ryzen 7 PRO 8845HS and the Qualcomm Snapdragon X1P-42-100. The Qualcomm processor has no recorded benchmark scores in any test category, and its average benchmark score is recorded as zero. This absence of data makes direct numerical comparison impossible across the standard test suite.
However, the AMD processor has a comprehensive set of benchmark results recorded. In Cinebench R15, it scores 2476 points in multicore and 349 points in single-core. In Cinebench R20, it scores 10317 in multicore and 1456 in single-core. In Cinebench R23, it scores 24565 in multicore and 3468 in single-core. PassMark results include data compression at 343952, data encryption at 20487, extended instructions at 25434, prime number finding at 87, floating point math at 58965, integer math at 97625, multithread at 28572, physics at 1389, random string sorting at 41867, and single-thread at 3762.
The AMD processor achieves an average benchmark score of 39325, placing it at the 86th percentile among all CPUs in the database. Its nearest rivals include the AMD EPYC 4245P with an average score of 39215 (a 0.3% difference), the AMD Ryzen AI 7 450 with an average score of 39485 (a -0.4% difference), the AMD Ryzen 7 PRO 8840HS with an average score of 39603 (a -0.7% difference), and the Intel Core i7-13700F with an average score of 39009 (a 0.8% difference). These results show the AMD part performs within a narrow band of its closest competitors.
The Qualcomm Snapdragon X1P-42-100 has no nearest rivals recorded and no benchmark scores, making its relative performance impossible to quantify from the database. Its 50th percentile ranking indicates it sits at the median of all CPUs, but without specific test data, no direct comparison to the AMD part can be made.
Specification Differences
The two processors differ across multiple specification fields. The AMD Ryzen 7 PRO 8845HS has 16 threads compared to 8 threads on the Qualcomm Snapdragon X1P-42-100. The AMD base clock is 3.80 GHz versus 3.40 GHz on the Qualcomm part. The AMD chip has a boost clock of 5.10 GHz, while the Qualcomm chip has no boost clock recorded.
TDP differs by 15 watts: the AMD part is rated at 45 watts, the Qualcomm part at 30 watts. The AMD processor uses AMD Socket FP7, the Qualcomm uses Qualcomm BGA 2073. Architecture and codename differ: Zen 4 with Hawk Point for AMD, Oryon for Qualcomm. The AMD chip belongs to the 8000 series and Ryzen 7 generation; the Qualcomm chip has no series recorded and belongs to the Snapdragon X (Plus) generation.
Cache allocation differs across all three levels. L1 cache is 64 KB per core on AMD versus 288 KB per core on Qualcomm. L2 cache is 1 MB per core on AMD versus 12 MB per module on Qualcomm. L3 cache is 16 MB shared on AMD versus 6 MB shared on Qualcomm. The AMD part has ECC memory support, the Qualcomm part does not. PCIe lanes differ: 20 lanes on AMD versus 12 lanes on Qualcomm, both Gen 4.
Transistor count is recorded for AMD at 25,000 million, with no figure for Qualcomm. Die size is 178 mm² for AMD, with no figure for Qualcomm. Memory support is DDR5 for AMD and LPDDR5X for Qualcomm. Memory bandwidth is 89.6 GB/s for AMD and 135.2 GB/s for Qualcomm. Integrated graphics are Radeon 780M for AMD and Adreno X1-45 for Qualcomm. Release dates differ by roughly four months, with AMD launching on April 15, 2024 and Qualcomm on August 27, 2024. Both parts are active in production status.
The Verdict
The recorded data presents an uneven comparison. The AMD Ryzen 7 PRO 8845HS has extensive benchmark coverage and ranks at the 86th percentile among all CPUs, with an average benchmark score of 39325. Its nearest rivals show it trading places within a 0.8% range, indicating strong consistency against comparable x86 parts. The Qualcomm Snapdragon X1P-42-100 has no recorded benchmark scores, no nearest rivals, and an average benchmark score of zero, placing it at the 50th percentile by default rather than by demonstrated performance.
From the specification sheet alone, the AMD processor offers advantages in thread count (16 versus 8), base clock (3.80 GHz versus 3.40 GHz), boost clock (5.10 GHz versus none recorded), L3 cache (16 MB versus 6 MB), PCIe lanes (20 versus 12), and ECC memory support. The Qualcomm part counters with higher memory bandwidth (135.2 GB/s versus 89.6 GB/s), lower TDP (30 watts versus 45 watts), larger per-core L1 cache (288 KB versus 64 KB), and a larger L2 cache allocation per module (12 MB versus 1 MB per core).
The AMD processor is the only one of the two with measured performance data in the database. Its 86th percentile ranking and average score of 39325, supported by Cinebench and PassMark results, positions it as a competitive mobile processor. The Qualcomm chip, lacking any benchmark results, cannot be assessed for actual performance from the recorded data. Users requiring ECC memory support, higher thread counts, or more PCIe lanes would select the AMD part based on specifications. Users prioritizing memory bandwidth or lower power consumption would find the Qualcomm part attractive on paper, but its lack of measured results leaves its real-world performance unverified in this database.