AMD Ryzen Embedded 8845HS vs Qualcomm Snapdragon X2E-96-100 Comparison

Head-to-Head Benchmarks

The database records no direct head-to-head benchmark entries for the AMD Ryzen Embedded 8845HS versus the Qualcomm Snapdragon X2E-96-100. Both processors hold a 50th percentile ranking among all CPUs in the database, and both carry an average benchmark score of zero. The absence of measured performance data means the comparison must rely entirely on architectural specifications and cache, memory, and interface characteristics recorded in the database.

The AMD Ryzen Embedded 8845HS delivers a maximum boost clock of 5.10 GHz, which is 0.10 GHz higher than the Snapdragon X2E-96-100's top boost of 5.00 GHz. However, the Snapdragon starts from a much higher base clock of 4.45 GHz versus the AMD part's 3.80 GHz base. The Snapdragon also fields 18 cores and 18 threads, while the Ryzen Embedded uses 8 cores and 16 threads. The Snapdragon's thread count equals its core count, indicating no simultaneous multithreading, whereas the Ryzen part doubles its thread count over physical cores.

Memory bandwidth shows a stark difference. The Snapdragon X2E-96-100 supports a triple-channel LPDDR5X memory bus with a recorded bandwidth of 228.6 GB/s. The AMD Ryzen Embedded 8845HS uses a dual-channel DDR5 bus with 89.6 GB/s of bandwidth. That puts the Snapdragon at roughly 2.55 times the memory bandwidth of the AMD part, a substantial margin for memory-intensive workloads.

Cache hierarchies also differ sharply. The Snapdragon allocates 288 KB of L1 cache per core, 16 MB of L2 cache per module, and 9 MB of shared L3 cache. The AMD part uses 64 KB of L1 per core, 1 MB of L2 per core, and 16 MB of shared L3. With 18 cores, the Snapdragon's per-core L1 is more than four times larger than the AMD's per-core L1. The AMD chip's shared L3 is nearly double the Snapdragon's shared L3, though the Snapdragon's per-module L2 arrangement complicates a direct total comparison.

Where Each One Wins

The AMD Ryzen Embedded 8845HS wins on raw clock headroom. Its 5.10 GHz boost clock exceeds the Snapdragon's 5.00 GHz peak, and with 16 threads from 8 cores, it offers simultaneous multithreading that the Snapdragon lacks. For workloads that scale with thread count and respond to high per-core frequency, the AMD part has a structural advantage. Its 16 MB shared L3 cache also provides a larger unified last-level cache, which can benefit workloads with moderate working sets that fit within that pool.

The Qualcomm Snapdragon X2E-96-100 wins on core count and memory throughput. With 18 physical cores versus the AMD's 8, the Snapdragon presents a clear lead in parallel execution capacity, assuming software can utilize all 18 cores. The triple-channel LPDDR5X interface delivering 228.6 GB/s gives the Snapdragon a massive bandwidth advantage, useful for data streaming, large dataset processing, and integrated graphics memory sharing. The Snapdragon also uses a newer 3 nm process node from TSMC versus the AMD's 4 nm node, which suggests improved power efficiency per transistor, though the database does not record a TDP for the Snapdragon to confirm actual power behavior.

The AMD part supports ECC memory, a feature absent from the Snapdragon. That makes the Ryzen Embedded 8845HS the only one of the two suitable for error-tolerant computing environments where data integrity is critical. The AMD chip also uses PCIe Gen 4 with 20 CPU lanes, while the Snapdragon uses PCIe Gen 5 with 12 CPU lanes. The newer PCIe standard on the Snapdragon offers higher per-lane bandwidth, but the AMD part provides more lanes for multi-device expansion.

The Snapdragon's integrated graphics, the Adreno X2-90, and the AMD's Radeon 780M differ in architecture, but the database records no benchmark scores for either GPU, so relative graphics performance cannot be quantified.

Architecture Differences

The two processors come from different design philosophies. The AMD Ryzen Embedded 8845HS belongs to the 8000 series, uses the Zen 4 architecture under the Hawk Point codename, and is built on a 4 nm process at TSMC with 25,000 million transistors on a 178 mm² die. The Snapdragon X2E-96-100 carries the Glymur codename, belongs to the Snapdragon X2 Elite generation, and uses a 3 nm TSMC process with a 220 mm² die. The database does not list a transistor count for the Snapdragon.

The AMD part uses AMD Socket FP8, while the Snapdragon uses Qualcomm BGA 2343. Both are mobile market segment parts with active production status. The AMD chip has a recorded TDP of 45 watts; the Snapdragon's TDP is not recorded in the database. The AMD part's release date is April 1, 2024, while the Snapdragon's release date is April 5, 2026, making the Snapdragon a later product by two years.

Memory support diverges: the AMD part uses DDR5 dual-channel with 89.6 GB/s, and the Snapdragon uses LPDDR5X triple-channel with 228.6 GB/s. ECC memory is supported by the AMD chip only. PCIe connectivity also differs: the AMD part offers Gen 4 with 20 lanes, while the Snapdragon offers Gen 5 with 12 lanes.

The AMD part's cache hierarchy uses 64 KB L1 per core, 1 MB L2 per core, and 16 MB shared L3. The Snapdragon uses 288 KB L1 per core, 16 MB L2 per module, and 9 MB shared L3. The core count difference (8 versus 18) and thread count difference (16 versus 18) reflect fundamentally different approaches: the AMD chip uses fewer, higher-frequency cores with SMT, while the Snapdragon uses more physical cores without SMT. Neither processor has an unlocked multiplier, so overclocking is not supported for either.

The Snapdragon's part number is recorded as X2E96100, while the AMD part's part number is listed as unknown. The AMD chip's generation is listed as "Ryzen Embedded (Zen 4 (Hawk Point))", and the Snapdragon's generation is "Snapdragon X2 (Elite)". The AMD chip's series is 8000 series, while the Snapdragon has no series entry.

The Verdict

The data indicates two processors aimed at different workload profiles. The AMD Ryzen Embedded 8845HS suits applications that need high single-thread boost clocks, simultaneous multithreading, ECC memory support, and a larger shared L3 cache. Its 5.10 GHz boost, 16 threads, and 16 MB L3 make it a strong candidate for latency-sensitive tasks and lightly threaded software that benefits from high per-core frequency. The 45 W TDP gives a concrete power envelope, which the database does not provide for the Snapdragon.

The Qualcomm Snapdragon X2E-96-100 suits throughput-oriented workloads that can use 18 physical cores. Its 228.6 GB/s memory bandwidth, triple-channel interface, and 3 nm process node indicate a design focused on parallel data movement and energy-efficient multi-core scaling. The larger L1 and per-module L2 caches suggest the architecture anticipates high concurrency with localized data reuse. The newer PCIe Gen 5 interface also provides forward-looking connectivity for high-speed peripherals, though with fewer lanes than the AMD part.

For users who prioritize ECC memory, SMT, or a higher boost clock, the AMD Ryzen Embedded 8845HS is the only option with those features. For users who need maximum core count, maximum memory bandwidth, or the latest process node, the Snapdragon X2E-96-100 leads. The lack of recorded benchmark scores means neither processor demonstrates measured performance superiority in the database; the decision rests on the architectural trade-offs listed above.

FAQ

Q: Which processor has more cores?

A: The Qualcomm Snapdragon X2E-96-100 has 18 cores, while the AMD Ryzen Embedded 8845HS has 8 cores.

Q: Does either processor support ECC memory?

A: Only the AMD Ryzen Embedded 8845HS supports ECC memory. The Qualcomm Snapdragon X2E-96-100 does not.

Q: What is the memory bandwidth difference?

A: The Snapdragon X2E-96-100 delivers 228.6 GB/s over a triple-channel LPDDR5X bus, while the AMD Ryzen Embedded 8845HS delivers 89.6 GB/s over a dual-channel DDR5 bus.

Q: Which processor has a higher boost clock?

A: The AMD Ryzen Embedded 8845HS boosts to 5.10 GHz, which is 0.10 GHz higher than the Snapdragon X2E-96-100's 5.00 GHz boost.

Q: What process nodes do the two chips use?

A: The AMD Ryzen Embedded 8845HS uses a 4 nm TSMC process, while the Qualcomm Snapdragon X2E-96-100 uses a 3 nm TSMC process.

Q: Which processor has more PCIe lanes?

A: The AMD Ryzen Embedded 8845HS provides PCIe Gen 4 with 20 CPU lanes, while the Snapdragon X2E-96-100 provides PCIe Gen 5 with 12 CPU lanes.