AMD Ryzen Embedded 8845HS vs Qualcomm Snapdragon X2E-88-100 Comparison

Where Each One Wins

The AMD Ryzen Embedded 8845HS and the Qualcomm Snapdragon X2E-88-100 target different workload profiles, and the recorded data supports a clear split. The AMD part uses 8 cores with 16 threads, a configuration that favors software that scales with simultaneous multithreading. The Qualcomm part uses 18 cores with 18 threads, meaning each core is a single thread and the processor relies on raw core count for parallel throughput.

For single-threaded responsiveness, the Qualcomm part has a higher base clock at 4.00 GHz compared to 3.80 GHz on the AMD chip. However, the AMD chip boosts higher, reaching 5.10 GHz versus 4.70 GHz on the Qualcomm. This suggests that the AMD part can sustain a higher peak frequency for short bursts, which typically benefits latency-sensitive operations such as interactive input handling or lightly threaded application logic.

For multi-threaded workloads, the Qualcomm part holds a structural advantage. It has 18 physical cores versus 8 on the AMD side, and while the AMD chip has 16 threads, the Qualcomm part has 18 threads. The thread count difference is small, but the core count difference is substantial. The Qualcomm die is larger at 220 mm² versus 178 mm² for AMD, and it uses a more advanced 3 nm process node compared to 4 nm, which allows more cores to fit in a comparable power envelope.

Memory bandwidth also favors the Qualcomm part. The Snapdragon X2E-88-100 supports LPDDR5X and delivers 152.4 GB/s of bandwidth, while the AMD chip uses DDR5 and provides 89.6 GB/s. This 70% bandwidth advantage matters for workloads that stream large datasets, such as media processing or data aggregation. The AMD part counters with ECC memory support, which the Qualcomm part lacks, making the AMD chip more suitable for error-sensitive embedded deployments.

The integrated graphics differ as well. AMD uses the Radeon 780M, while Qualcomm uses the Adreno X2-90. The database does not record a direct graphics benchmark comparison, but the memory bandwidth difference suggests the Qualcomm iGPU has more headroom for frame buffer access. The AMD chip’s lower bandwidth could limit its iGPU in high-resolution output scenarios.

Architecture Differences

The two processors come from different architectural lineages. The AMD Ryzen Embedded 8845HS is built on Zen 4, with the codename Hawk Point, and belongs to the 8000 series. It uses a 4 nm TSMC process and integrates 25,000 million transistors on a 178 mm² die. The Qualcomm Snapdragon X2E-88-100 uses a 3 nm TSMC process, has a 220 mm² die, and carries the codename Glymur under the Snapdragon X2 (Elite) generation. The database does not record a transistor count for the Qualcomm part.

Cache organization differs significantly. The AMD chip has 64 KB of L1 per core, 1 MB of L2 per core, and 16 MB of shared L3. The Qualcomm chip has 288 KB of L1 per core and 16 MB of L2 per module, with no recorded L3. The per-core L1 on the Qualcomm part is 4.5 times larger than the AMD L1, which can reduce memory latency for frequently accessed data. The L2 arrangement also differs: AMD gives each core its own 1 MB slice, while Qualcomm shares 16 MB per module, which likely groups multiple cores under one cache region.

The memory controllers are distinct. AMD supports DDR5 with dual-channel access and ECC enabled. Qualcomm supports LPDDR5X with dual-channel access and no ECC. The Qualcomm memory bandwidth of 152.4 GB/s is 70% higher than the AMD figure of 89.6 GB/s. PCIe connectivity also differs: AMD provides Gen 4 with 20 CPU lanes, while Qualcomm provides Gen 5 with 12 CPU lanes. The Qualcomm controller runs at a newer standard, but AMD offers more lanes for peripheral expansion.

The sockets are incompatible. AMD uses AMD Socket FP8, while Qualcomm uses Qualcomm BGA 2343. The AMD part has a 45 W TDP, while the database does not record a TDP for the Qualcomm part. The AMD chip is unlocked? No, the multiplier is not unlocked on either part. The Qualcomm part has a known part number, X2E88100, while the AMD part number is listed as unknown.

The release dates are far apart. The AMD chip was released in April 2024, while the Qualcomm chip is dated April 2026. Both are marked as Active in production status.

Head-to-Head Benchmarks

The database records no direct head-to-head benchmark results between the AMD Ryzen Embedded 8845HS and the Qualcomm Snapdragon X2E-88-100. The winsA and winsB fields are both zero, and the headToHeadBenchmarks array is empty. As such, the analysis below relies on the recorded architectural and specification data rather than measured performance deltas.

The largest structural gap is in core count. The Qualcomm part has 18 cores versus 8 on the AMD part, a 125% increase. Thread count is closer: 18 versus 16, a 12.5% increase. This means the Qualcomm part can run 18 independent threads simultaneously, while the AMD part can run 16 threads but with only 8 physical execution units. For workloads that do not benefit from SMT, the Qualcomm part has more true parallel execution slots.

Clock speeds show a trade-off. The AMD part has a 0.10 GHz lower base clock but a 0.40 GHz higher boost clock. The boost advantage is 8.5% over the Qualcomm part. For bursty single-thread tasks, the AMD chip can reach 5.10 GHz, while the Qualcomm chip tops out at 4.70 GHz. The Qualcomm base clock of 4.00 GHz is 5.3% higher than the AMD base clock, which suggests better sustained all-core frequency if power and thermals allow.

Memory bandwidth favors the Qualcomm part by 62.8 GB/s, which is a 70% advantage. This is the largest relative gap in the recorded data. The AMD chip’s 89.6 GB/s is sufficient for dual-channel DDR5, but the Qualcomm LPDDR5X implementation provides substantially more data movement capability. For workloads such as large matrix operations or video transcoding that are memory-bound, this gap could translate into meaningful performance differences.

Cache capacity differs by level. The AMD L1 is 64 KB per core, while the Qualcomm L1 is 288 KB per core. For an 8-core AMD chip, total L1 is 512 KB; for an 18-core Qualcomm chip, total L1 is 5,184 KB, over 10 times larger. The L2 arrangement is harder to compare directly because AMD uses per-core 1 MB slices while Qualcomm uses per-module 16 MB slices. The Qualcomm L2 per module is 16 times larger than the AMD per-core L2, but the number of modules is not specified in the database.

Die size and process node indicate different design priorities. The AMD die is smaller at 178 mm², while the Qualcomm die is 220 mm², a 23.6% larger area. The Qualcomm part uses a 3 nm process versus 4 nm, which typically allows higher transistor density and lower power per transistor. The database does not record a transistor count for Qualcomm, so density cannot be compared directly.

FAQ

Q: Which processor has more cores?

A: The Qualcomm Snapdragon X2E-88-100 has 18 cores, while the AMD Ryzen Embedded 8845HS has 8 cores.

Q: Which processor has a higher boost clock?

A: The AMD Ryzen Embedded 8845HS has a boost clock of 5.10 GHz, which is higher than the Qualcomm Snapdragon X2E-88-100’s 4.70 GHz.

Q: Does the AMD chip support ECC memory?

A: Yes, the AMD Ryzen Embedded 8845HS supports ECC memory. The Qualcomm Snapdragon X2E-88-100 does not.

Q: Which processor has higher memory bandwidth?

A: The Qualcomm Snapdragon X2E-88-100 has 152.4 GB/s of memory bandwidth, compared to 89.6 GB/s on the AMD Ryzen Embedded 8845HS.

Q: What process nodes do the two chips use?

A: The AMD Ryzen Embedded 8845HS uses a 4 nm TSMC process, while the Qualcomm Snapdragon X2E-88-100 uses a 3 nm TSMC process.

Q: Are the sockets the same?

A: No, the AMD Ryzen Embedded 8845HS uses AMD Socket FP8, while the Qualcomm Snapdragon X2E-88-100 uses Qualcomm BGA 2343.

Specification Differences

| Field | AMD Ryzen Embedded 8845HS | Qualcomm Snapdragon X2E-88-100 |

|-------|---------------------------|-------------------------------|

| Series | 8000 series | Not recorded |

| Manufacturer | AMD | Unknown |

| Cores | 8 | 18 |

| Threads | 16 | 18 |

| Base clock | 3.80 GHz | 4.00 GHz |

| Boost clock | 5.10 GHz | 4.70 GHz |

| TDP | 45 W | Not recorded |

| Socket | AMD Socket FP8 | Qualcomm BGA 2343 |

| Architecture | Zen 4 | Not recorded |

| Codename | Hawk Point | Glymur |

| Generation | Ryzen Embedded (Zen 4 (Hawk Point)) | Snapdragon X2 (Elite) |

| Process node | 4 nm | 3 nm |

| Foundry | TSMC | TSMC |

| Transistors | 25,000 million | Not recorded |

| Die size | 178 mm² | 220 mm² |

| L1 cache | 64 KB (per core) | 288 KB (per core) |

| L2 cache | 1 MB (per core) | 16 MB (per module) |

| L3 cache | 16 MB (shared) | Not recorded |

| Memory support | DDR5 | LPDDR5X |

| Memory bus | Dual-channel | Dual-channel |

| Memory bandwidth | 89.6 GB/s | 152.4 GB/s |

| ECC memory | Yes | No |

| PCIe | Gen 4, 20 Lanes (CPU only) | Gen 5, 12 Lanes (CPU only) |

| Integrated graphics | Radeon 780M | Adreno X2-90 |

| Market segment | Mobile | Mobile |

| Release date | April 2024 | April 2026 |

| Part number | Unknown | X2E88100 |

| Multiplier unlocked | No | No |

| Production status | Active | Active |