AMD Ryzen Embedded 8845HS vs Qualcomm Snapdragon X1E-84-100 Comparison

The Verdict

The AMD Ryzen Embedded 8845HS and Qualcomm Snapdragon X1E-84-100 target different priorities within the mobile embedded space, and the recorded data clarifies where each part belongs. The AMD chip uses 8 cores with 16 threads, a Zen 4 architecture, and a boost clock of 5.10 GHz, while the Qualcomm part fields 12 cores with 12 threads, an Oryon design, and a 4.20 GHz boost. For workloads that scale with thread count, the AMD processor offers simultaneous multithreading, which the Qualcomm part lacks entirely. The Qualcomm Snapdragon counters with a higher memory bandwidth of 135.2 GB/s compared to 89.6 GB/s, plus a larger per-core L1 cache of 288 KB versus 64 KB.

The thermal envelope separates them further. The AMD Ryzen Embedded 8845HS carries a 45 W TDP, while the Snapdragon X1E-84-100 operates at 35 W. That difference suggests the Qualcomm part fits into thermally constrained designs, but the AMD chip provides a higher boost clock, which matters for bursty single-thread workloads. The AMD processor also supports ECC memory, a feature absent from the Qualcomm part, making it the more appropriate choice for reliability-sensitive embedded applications. The Qualcomm Snapdragon uses LPDDR5X memory, while the AMD chip uses DDR5, so platform memory choices will diverge accordingly.

The production status for both is Active, and both use a 4 nm TSMC process node. Neither CPU has an unlocked multiplier, so overclocking is not part of the equation. The AMD part offers 20 PCIe Gen 4 lanes, while the Qualcomm part offers 12, giving the AMD chip more room for expansion devices. The Qualcomm part integrates the Adreno X1-85 GPU, whereas the AMD chip uses the Radeon 780M, so graphics capability will vary by workload and driver ecosystem. In short, the AMD Ryzen Embedded 8845HS suits systems that need higher boost clocks, ECC memory, and more PCIe lanes, while the Snapdragon X1E-84-100 suits designs that prioritize lower TDP and higher memory bandwidth.

FAQ

Q: Which processor has more cores and threads?

A: The Qualcomm Snapdragon X1E-84-100 has 12 cores and 12 threads, while the AMD Ryzen Embedded 8845HS has 8 cores and 16 threads. The AMD chip uses simultaneous multithreading, giving it more threads than cores.

Q: What are the boost clock differences?

A: The AMD Ryzen Embedded 8845HS boosts to 5.10 GHz, while the Qualcomm Snapdragon X1E-84-100 boosts to 4.20 GHz. Their base clocks are identical at 3.80 GHz.

Q: How does memory support differ?

A: The AMD Ryzen Embedded 8845HS supports DDR5 memory with dual-channel layout and 89.6 GB/s bandwidth, plus ECC memory support. The Qualcomm Snapdragon X1E-84-100 supports LPDDR5X memory with dual-channel layout and 135.2 GB/s bandwidth, but it does not support ECC memory.

Q: Which chip has the larger cache?

A: The Qualcomm Snapdragon X1E-84-100 has 288 KB L1 cache per core, 12 MB L2 cache per module, and 6 MB shared L3 cache. The AMD Ryzen Embedded 8845HS has 64 KB L1 cache per core, 1 MB L2 cache per core, and 16 MB shared L3 cache. The Qualcomm part has a larger L1 and L2 allocation per core, while the AMD part has a larger L3 pool.

Q: What are the platform differences?

A: The AMD Ryzen Embedded 8845HS uses AMD Socket FP8 and provides 20 PCIe Gen 4 lanes. The Qualcomm Snapdragon X1E-84-100 uses Qualcomm BGA 2073 and provides 12 PCIe Gen 4 lanes. The AMD chip also uses a 45 W TDP, while the Qualcomm chip uses 35 W.

Q: Are both chips currently in production?

A: Yes, both the AMD Ryzen Embedded 8845HS and the Qualcomm Snapdragon X1E-84-100 have Active production status. The AMD release date is 2024-04-01, and the Qualcomm release date is 2024-04-23.

Architecture Differences

The AMD Ryzen Embedded 8845HS belongs to the 8000 series and uses the Zen 4 architecture under the codename Hawk Point. The Qualcomm Snapdragon X1E-84-100 uses the Oryon codename and is part of the Snapdragon X (Elite) generation. Both chips are fabricated on a 4 nm process at TSMC, which places them on the same manufacturing node. The AMD chip has a die size of 178 mm² and contains 25,000 million transistors, while the Snapdragon does not have recorded die size or transistor data in the database.

The core layouts differ substantially. The AMD processor implements 8 cores and 16 threads, meaning each core supports two threads. The Qualcomm processor implements 12 cores and 12 threads, so each core supports a single thread. This structural difference affects how the two processors handle parallel workloads, with the AMD part able to present more logical processors to the operating system.

Cache hierarchies also separate the two designs. The AMD chip allocates 64 KB of L1 cache per core and 1 MB of L2 cache per core, with 16 MB of shared L3 cache. The Qualcomm chip allocates 288 KB of L1 cache per core and 12 MB of L2 cache per module, with 6 MB of shared L3 cache. The Qualcomm design clearly favors larger per-core and per-module cache allocations, while the AMD design relies on a larger shared L3 pool. The L2 organization also differs: AMD uses a per-core L2, while Qualcomm groups cores into modules with a shared L2 allocation per module.

Memory architecture adds another layer of distinction. The AMD Ryzen Embedded 8845HS supports DDR5 memory with a dual-channel bus and a recorded bandwidth of 89.6 GB/s, and it includes ECC memory support. The Qualcomm Snapdragon X1E-84-100 supports LPDDR5X memory with a dual-channel bus and a recorded bandwidth of 135.2 GB/s, but it lacks ECC memory support. The Qualcomm part delivers 45.6 GB/s more memory bandwidth, which can benefit memory-bound tasks, but the AMD part offers the reliability feature of ECC.

PCIe connectivity differs as well. The AMD chip provides 20 PCIe Gen 4 lanes from the CPU, while the Qualcomm chip provides 12 PCIe Gen 4 lanes from the CPU. That gives the AMD platform more headroom for storage controllers, network interfaces, or other expansion devices. The integrated graphics also differ: AMD pairs the CPU with the Radeon 780M, while Qualcomm pairs its CPU with the Adreno X1-85. Both are mobile parts, but their GPU driver and feature sets will follow different paths.

Specification Differences

The two processors differ across several specification fields. The AMD Ryzen Embedded 8845HS has 8 cores and 16 threads, while the Qualcomm Snapdragon X1E-84-100 has 12 cores and 12 threads. Their base clocks match at 3.80 GHz, but the boost clocks diverge: 5.10 GHz for the AMD part and 4.20 GHz for the Qualcomm part. The TDP also differs, with the AMD chip rated at 45 W and the Qualcomm chip at 35 W.

Sockets are not interchangeable. The AMD processor uses AMD Socket FP8, while the Qualcomm processor uses Qualcomm BGA 2073. The architecture field lists Zen 4 for the AMD chip, while the Qualcomm chip does not have a listed architecture, though its codename is Oryon. The process node is the same for both: 4 nm at TSMC. The AMD chip has a recorded die size of 178 mm² and 25,000 million transistors, while the Qualcomm chip has no die size or transistor count recorded.

Cache specifications differ across all levels. The AMD chip has 64 KB L1 per core, 1 MB L2 per core, and 16 MB shared L3. The Qualcomm chip has 288 KB L1 per core, 12 MB L2 per module, and 6 MB shared L3. Memory support differs by type: DDR5 for AMD and LPDDR5X for Qualcomm. Both use a dual-channel memory bus, but bandwidth is 89.6 GB/s for AMD and 135.2 GB/s for Qualcomm. ECC memory is supported only on the AMD part.

PCIe lane counts differ: 20 lanes for AMD versus 12 lanes for Qualcomm, both Gen 4. The integrated graphics are the Radeon 780M for AMD and the Adreno X1-85 for Qualcomm. The AMD chip belongs to the 8000 series, while the Qualcomm chip does not have a series recorded. Both have Active production status and unlocked multipliers set to false. The Qualcomm part number is X1E84100, while the AMD part number is unknown. Release dates are close: 2024-04-01 for AMD and 2024-04-23 for Qualcomm.

Head-to-Head Benchmarks

The recorded database does not include direct benchmark scores or nearest rival comparisons for either processor, so the analysis must rely on the specification-level data to project relative strengths. That said, the specification differences point to clear advantages in distinct workload categories.

The AMD Ryzen Embedded 8845HS holds the threading advantage. With 8 cores and 16 threads, it presents 16 logical processors to the scheduler, while the Qualcomm Snapdragon X1E-84-100 presents 12 logical processors. In multi-threaded workloads that can use more than 12 threads, the AMD part has additional scheduling headroom. The AMD chip also boosts to 5.10 GHz, which is 0.90 GHz higher than the Qualcomm part's 4.20 GHz boost. For single-threaded and lightly threaded tasks where clock speed dominates, the AMD processor should deliver higher peak performance.

The Qualcomm Snapdragon X1E-84-100 counters with a wider core count. Its 12 cores exceed the AMD part's 8 cores, which can benefit workloads that scale linearly with physical cores but do not use simultaneous multithreading effectively. The Qualcomm chip also has a larger L1 cache per core at 288 KB versus 64 KB, and a larger L2 allocation per module at 12 MB versus 1 MB per core. This cache structure could reduce memory latency for working sets that fit within the larger per-core cache.

Memory bandwidth clearly favors Qualcomm. The Snapdragon X1E-84-100 delivers 135.2 GB/s, which is 45.6 GB/s more than the AMD Ryzen Embedded 8845HS at 89.6 GB/s. Applications that stream large datasets, such as certain analytics or media workloads, could see a measurable benefit from the higher bandwidth. The AMD part, however, offers ECC memory support, which can be decisive for embedded systems that require data integrity over raw throughput.

Power efficiency leans toward Qualcomm based on the recorded TDP. The Snapdragon operates at 35 W, while the AMD part operates at 45 W. That 10 W difference gives the Qualcomm part a lower thermal ceiling, which can matter in compact embedded chassis or fanless designs. The AMD part uses its higher power budget to sustain a higher boost clock and more PCIe lanes.

PCIe expansion favors AMD. The Ryzen Embedded 8845HS provides 20 Gen 4 lanes, while the Snapdragon X1E-84-100 provides 12 Gen 4 lanes. Systems that need multiple NVMe drives, high-speed network adapters, or accelerators will find more headroom on the AMD platform. The integrated GPU choice also differs: the Radeon 780M for AMD and the Adreno X1-85 for Qualcomm, though no benchmark data is available to compare their graphics output directly.

The release timeline places both chips within the same month, with AMD launching on 2024-04-01 and Qualcomm on 2024-04-23. Both remain in Active production, so neither is a legacy part. The percentile versus all CPUs is 50 for both, indicating they sit at the median of the database's CPU distribution, though no average benchmark score is recorded for either. In the absence of direct benchmark numbers, the specification data shows two distinct design philosophies: AMD emphasizes high boost clocks, thread count, ECC, and PCIe expansion, while Qualcomm emphasizes core count, cache capacity, memory bandwidth, and lower TDP.