AMD Ryzen Embedded 8845HS vs Qualcomm Snapdragon X1E-80-100 Comparison

Head-to-Head Benchmarks

The recorded database contains no direct head-to-head benchmark entries for the AMD Ryzen Embedded 8845HS versus the Qualcomm Snapdragon X1E-80-100. Both processors carry an identical percentile ranking of 50 against all CPUs in the database, and both show an average benchmark score of 0. This absence of measured results means the comparison must rely on architectural specifications, core configurations, and platform capabilities rather than raw performance deltas.

The AMD part fields 8 cores and 16 threads, while the Qualcomm part offers 12 cores but only 12 threads, indicating no simultaneous multithreading on the Snapdragon side. The AMD chip operates with a base clock of 3.80 GHz and a boost clock of 5.10 GHz, whereas the Qualcomm chip runs at a base of 3.40 GHz and boosts to 4.00 GHz. The AMD processor carries a 45 W TDP rating, compared to 35 W for the Snapdragon. These clock and TDP figures suggest the AMD chip is positioned for higher sustained performance in power-tolerant designs, while the Qualcomm part targets efficiency with a lower thermal envelope.

Memory bandwidth shows a clear divergence: the AMD Ryzen Embedded 8845HS supports DDR5 across a dual-channel bus with a peak bandwidth of 89.6 GB/s, while the Snapdragon X1E-80-100 uses LPDDR5X on a dual-channel interface delivering 135.2 GB/s. The Qualcomm part holds a 51% advantage in theoretical memory bandwidth, a meaningful gap for workloads that saturate memory subsystems.

The AMD processor integrates Radeon 780M graphics, while the Snapdragon uses Adreno X1-85. The database does not include graphics benchmark scores, so the comparison remains limited to architectural positioning. The AMD chip provides 20 PCIe Gen 4 lanes from the CPU, whereas the Qualcomm part supplies 12 PCIe Gen 4 lanes. This gives the AMD platform more headroom for expansion devices, storage, or discrete accelerators.

The AMD Ryzen Embedded 8845HS supports ECC memory, a feature absent from the Snapdragon X1E-80-100. ECC capability positions the AMD part for reliability-sensitive deployments such as embedded controllers, network appliances, or edge servers. The Qualcomm chip does not offer ECC, which narrows its suitability in those environments.

Both processors are fabricated on a 4 nm process at TSMC, so the underlying transistor geometry is identical. The AMD chip uses a die size of 178 mm² and contains 25,000 million transistors, while the database records no die size or transistor count for the Qualcomm part. The AMD architecture is Zen 4 under the Hawk Point codename, while the Qualcomm architecture is listed as Oryon under the Snapdragon X Elite generation.

Where Each One Wins

The AMD Ryzen Embedded 8845HS shows advantages in several categories that matter for embedded and workstation-style workloads. Its 8-core, 16-thread configuration with simultaneous multithreading allows the operating system to schedule twice as many threads as physical cores, which benefits heavily threaded software such as virtualization hosts, database transactions, and compilation pipelines. The boost clock of 5.10 GHz is the highest frequency recorded in this comparison, giving the AMD part a raw single-thread speed advantage that translates to faster response in latency-sensitive tasks. The 45 W TDP rating indicates the processor is designed to sustain higher power draw, which typically correlates with longer sustained performance under load.

The AMD chip also wins on platform flexibility. Its 20 PCIe Gen 4 lanes provide a wider interface for peripherals compared to the Snapdragon's 12 lanes. ECC memory support makes the AMD processor suitable for applications where data integrity is critical, including financial processing, scientific computing, and industrial control systems. The AMD part uses a standard DDR5 memory interface, which allows system designers to select memory modules based on capacity and cost requirements rather than being locked into a specific on-package memory configuration.

The Qualcomm Snapdragon X1E-80-100 wins on core count with 12 physical cores, though it lacks multithreading. For workloads that scale across independent cores without needing thread duplication, such as certain parallel rendering tasks or multi-instance container workloads, the higher physical core count can deliver more aggregate throughput. The Snapdragon's memory bandwidth of 135.2 GB/s is substantially higher, which benefits memory-bound workloads like large data set analytics, media encoding with large frame buffers, and certain AI inference tasks that move significant data between compute units and memory.

The Snapdragon's 35 W TDP is lower than the AMD part's 45 W, indicating the Qualcomm design targets thermally constrained mobile form factors. The LPDDR5X memory support suggests a more integrated memory design, typically used in thin-and-light laptops where board space is at a premium. The Snapdragon's L1 cache is listed at 288 KB per core, which is larger than the AMD's 64 KB per core, potentially improving performance for workloads with high temporal locality in frequently accessed data.

The Qualcomm part also delivers a higher total cache allocation across levels when accounting for the per-core L1 and per-module L2 figures, though the AMD part offers a larger shared L3 cache at 16 MB compared to the Snapdragon's 6 MB shared L3. The AMD's L3 advantage benefits workloads with shared data across cores, such as relational databases and multi-threaded web servers.

Architecture Differences

The AMD Ryzen Embedded 8845HS uses the Zen 4 architecture under the Hawk Point codename, part of the 8000 series. It is built on a 4 nm process at TSMC with a die size of 178 mm² and 25,000 million transistors. The core configuration is 8 cores with 16 threads, each core having 64 KB of L1 cache and 1 MB of L2 cache, plus a shared 16 MB L3 cache. The processor uses an AMD Socket FP8 and supports DDR5 memory across a dual-channel bus with a peak bandwidth of 89.6 GB/s. ECC memory is supported. The integrated graphics is Radeon 780M. The PCIe interface provides 20 Gen 4 lanes from the CPU. The part was released on April 1, 2024, and is in active production.

The Qualcomm Snapdragon X1E-80-100 uses the Oryon codename under the Snapdragon X Elite generation. It is also fabricated on a 4 nm process at TSMC, but the database records no die size or transistor count. The core configuration is 12 cores with 12 threads, meaning each core runs a single thread without hyperthreading. Each core has 288 KB of L1 cache, and the L2 cache is organized as 12 MB per module, with a shared 6 MB L3 cache. The processor uses a Qualcomm BGA 2073 socket and supports LPDDR5X memory across a dual-channel bus with a peak bandwidth of 135.2 GB/s. ECC memory is not supported. The integrated graphics is Adreno X1-85. The PCIe interface provides 12 Gen 4 lanes from the CPU. The part number is X1E80100, released on April 23, 2024, with active production status.

The cache architecture differs fundamentally. The AMD part uses a conventional hierarchy with per-core L1 and L2, topped by a large shared L3. The Qualcomm part allocates a much larger per-core L1, a module-level L2 of 12 MB, and a smaller shared L3 of 6 MB. The larger L1 on the Snapdragon suggests a design optimized for single-threaded performance with high cache hit rates on frequently accessed data, while the AMD design leans toward shared cache for multi-threaded coordination.

The memory controller differences are significant. The AMD processor supports DDR5, which is a modular memory standard allowing socketed DIMMs or soldered modules with flexible capacity. The Snapdragon supports LPDDR5X, a low-power memory standard typically soldered directly to the system board. This affects serviceability and upgrade paths, though the database does not record module availability.

The TDP ratings reflect different power strategies. The AMD part carries a 45 W TDP, while the Snapdragon is rated at 35 W. The AMD chip's higher clock ceiling of 5.10 GHz requires more power headroom, while the Snapdragon's 4.00 GHz boost clock aligns with a lower thermal budget.

The PCIe lane counts indicate different expansion philosophies. The AMD processor provides 20 Gen 4 lanes, suitable for multiple NVMe drives, high-speed networking cards, or a discrete GPU. The Snapdragon provides 12 Gen 4 lanes, which covers basic storage and connectivity but offers less expansion headroom.

FAQ

Q: Which processor has more cores?

A: The Qualcomm Snapdragon X1E-80-100 has 12 cores, while the AMD Ryzen Embedded 8845HS has 8 cores. However, the AMD chip supports 16 threads through simultaneous multithreading, while the Snapdragon has 12 threads with no multithreading.

Q: What are the clock speed differences?

A: The AMD Ryzen Embedded 8845HS runs at a base clock of 3.80 GHz and a boost clock of 5.10 GHz. The Qualcomm Snapdragon X1E-80-100 runs at a base clock of 3.40 GHz and a boost clock of 4.00 GHz.

Q: Which processor supports ECC memory?

A: Only the AMD Ryzen Embedded 8845HS supports ECC memory. The Qualcomm Snapdragon X1E-80-100 does not list ECC support.

Q: How do the memory bandwidth figures compare?

A: The AMD processor delivers 89.6 GB/s over a dual-channel DDR5 bus. The Qualcomm processor delivers 135.2 GB/s over a dual-channel LPDDR5X bus, giving it a higher theoretical bandwidth.

Q: What are the TDP ratings for each chip?

A: The AMD Ryzen Embedded 8845HS is rated at 45 W TDP. The Qualcomm Snapdragon X1E-80-100 is rated at 35 W TDP.

Q: Which processor has more PCIe lanes?

A: The AMD Ryzen Embedded 8845HS provides 20 PCIe Gen 4 lanes from the CPU. The Qualcomm Snapdragon X1E-80-100 provides 12 PCIe Gen 4 lanes.

The Verdict

The AMD Ryzen Embedded 8845HS is the appropriate choice for workloads requiring high single-thread performance, multithreading capability, ECC memory support, and extensive PCIe expansion. Its 5.10 GHz boost clock is the highest recorded in this comparison, and the 8-core, 16-thread configuration with a 16 MB shared L3 cache suits heavily threaded server-like tasks. The 45 W TDP indicates a willingness to consume more power for sustained performance, and the 20 PCIe Gen 4 lanes allow connectivity for multiple high-speed devices. The DDR5 memory interface with ECC support makes this part suitable for embedded systems, edge computing, and reliability-critical applications.

The Qualcomm Snapdragon X1E-80-100 is the appropriate choice for power-constrained mobile designs where memory bandwidth and physical core count are priorities. Its 12 physical cores provide parallel throughput for workloads that scale across independent cores, and its 135.2 GB/s memory bandwidth is the highest in this comparison. The 35 W TDP supports thinner thermal solutions, and the LPDDR5X memory integration fits compact form factors. The larger per-core L1 cache of 288 KB may improve performance for single-threaded code with high cache locality.

Benchmark data from the database shows no measured performance differences between these two processors, as both hold an average benchmark score of 0 and a percentile ranking of 50. The decision between them therefore rests on platform requirements rather than recorded performance deltas. The AMD part offers more threads, higher clock speeds, ECC memory, and greater PCIe expansion. The Qualcomm part offers more physical cores, higher memory bandwidth, and a lower TDP. Each processor serves a distinct segment: the AMD Ryzen Embedded 8845HS for embedded compute platforms with expansion needs, and the Qualcomm Snapdragon X1E-80-100 for efficient mobile systems with high memory throughput.