AMD Ryzen Embedded 8845HS vs Qualcomm Snapdragon X1E-78-100 Comparison

Head-to-Head Benchmarks

The database contains no recorded benchmark scores for either the AMD Ryzen Embedded 8845HS or the Qualcomm Snapdragon X1E-78-100. Both processors have an average benchmark score of zero, and the head-to-head benchmark list is empty. Consequently, the win counts for both parts are zero, and no direct performance comparison can be derived from measured results at this time. The absence of data means that any statement about relative performance between these two chips would be speculative rather than evidence-based.

Both processors occupy the 50th percentile among all CPUs in the database, which indicates that neither has an established performance record that differentiates it from the other. The percentile field is a relative ranking, and with identical percentile values, the database currently treats them as statistically indistinguishable in overall standing. Without individual benchmark entries, there are no multi-core scores, single-core scores, or application-specific results to analyze.

The lack of recorded measurements is notable given that both parts are marked as Active in production status. The AMD part was released on 2024-04-01, and the Qualcomm part was released on 2024-04-23, so both are recent entries in the database. The database may not have accumulated sufficient test runs for these processors, or the testing methodology may not yet have been applied to them. Either way, the head-to-head comparison section must remain empty of numeric results until such measurements are recorded.

Architecture Differences

The architectural split between these two processors is substantial. The AMD Ryzen Embedded 8845HS uses the Zen 4 architecture with the Hawk Point codename, while the Qualcomm Snapdragon X1E-78-100 uses the Oryon codename from the Snapdragon X Elite generation. AMD lists the architecture explicitly as Zen 4; Qualcomm does not list an architecture field, only the Oryon codename and the Snapdragon X Elite generation name.

The process nodes are identical: both are built on a 4 nm process at TSMC. This is the only major manufacturing similarity. The transistor count and die size are listed only for AMD: 25,000 million transistors on a 178 mm² die. Qualcomm has no recorded transistor count or die size, so those fields cannot be compared directly.

Core and thread configurations differ sharply. AMD provides 8 cores and 16 threads, meaning simultaneous multithreading is enabled. Qualcomm provides 12 cores and 12 threads, meaning no multithreading per core; each core maps to one thread. This is a fundamental design divergence: AMD uses fewer physical cores but doubles thread count, while Qualcomm uses more physical cores with a one-to-one thread mapping.

Cache hierarchies are also structured differently. AMD allocates 64 KB of L1 cache per core, 1 MB of L2 cache per core, and 16 MB of shared L3 cache. Qualcomm allocates 288 KB of L1 cache per core, 12 MB of L2 cache per module, and 6 MB of shared L3 cache. The per-core L1 figures are not directly comparable because the Qualcomm number is substantially larger per core, likely reflecting a different cache architecture with wider or differently organized arrays. The L2 configuration also differs: AMD uses per-core L2, while Qualcomm uses per-module L2, which suggests a clustered core layout.

Memory support diverges completely. AMD supports DDR5 memory on a dual-channel bus with a recorded bandwidth of 89.6 GB/s and includes ECC memory support. Qualcomm supports LPDDR5X memory on a dual-channel bus with a recorded bandwidth of 135.2 GB/s and does not support ECC memory. The Qualcomm memory bandwidth is 45.6 GB/s higher than the AMD bandwidth, a meaningful difference for memory-bound workloads.

PCIe lane counts differ as well. AMD provides Gen 4 with 20 lanes (CPU only), while Qualcomm provides Gen 4 with 12 lanes (CPU only). AMD offers 8 additional Gen 4 lanes, which matters for external device connectivity in embedded or mobile platforms.

The integrated graphics units are different products. AMD integrates the Radeon 780M, while Qualcomm integrates the Adreno X1-85. The database does not include graphics benchmark scores, so the relative graphical performance cannot be quantified here.

Clock behavior differs in an important way. AMD lists a base clock of 3.80 GHz and a boost clock of 5.10 GHz. Qualcomm lists a base clock of 3.40 GHz but has no recorded boost clock field. The AMD base clock is 0.40 GHz higher than the Qualcomm base clock, and AMD has a documented boost capability that Qualcomm lacks in the record.

The socket types are entirely different: AMD uses AMD Socket FP8, while Qualcomm uses Qualcomm BGA 2073. These are physically incompatible platforms. The TDP values also differ: AMD is rated at 45 watts, while Qualcomm is rated at 35 watts. The AMD part draws 10 watts more at its rated TDP.

The AMD part belongs to the 8000 series and the Ryzen Embedded product line, with the generation recorded as Ryzen Embedded (Zen 4 (Hawk Point)). Qualcomm belongs to the Snapdragon X Elite generation with the Oryon codename. The Qualcomm part has a part number of X1E78100; the AMD part number is unknown.

Neither processor has an unlocked multiplier. Both are locked parts, so overclocking via multiplier adjustment is not an option for either. The production status for both is Active, meaning both are currently available in the market.

Where Each One Wins

Without benchmark results, the win analysis rests on architectural and specification differences from the database record. The AMD Ryzen Embedded 8845HS shows advantages in several measurable areas. It provides 16 threads versus 12 threads, a 4-thread advantage that benefits heavily threaded workloads when thread count exceeds physical core count. The AMD boost clock of 5.10 GHz is not matched by Qualcomm, which has no recorded boost clock, so the AMD part has a documented peak frequency advantage. The AMD part also provides 20 PCIe Gen 4 lanes versus 12 lanes for Qualcomm, an 8-lane advantage for expansion and peripheral connectivity. ECC memory support is present on AMD and absent on Qualcomm, which matters for reliability-sensitive embedded applications.

The AMD L3 cache is 16 MB shared, while Qualcomm has 6 MB shared L3. That is a 10 MB difference in favor of AMD for the final-level cache. However, Qualcomm counters with a larger L1 allocation per core (288 KB versus 64 KB) and a larger L2 allocation per module (12 MB versus 1 MB per core). The Qualcomm memory bandwidth is 135.2 GB/s versus 89.6 GB/s for AMD, a 45.6 GB/s advantage that favors memory-intensive operations. Qualcomm also has more physical cores: 12 versus 8, which can help in workloads that scale with core count and do not benefit from simultaneous multithreading.

The Qualcomm TDP is 35 watts versus 45 watts for AMD, so the Qualcomm part has a lower rated thermal envelope. In thermally constrained mobile chassis, that difference can be decisive. The release dates are close, with AMD at 2024-04-01 and Qualcomm at 2024-04-23, a 22-day gap that is unlikely to matter for procurement decisions.

For use cases, the AMD part appears better suited to workloads that require high single-thread frequency, higher thread count for parallel tasks, more PCIe expansion, or ECC reliability. The Qualcomm part appears better suited to workloads that require high memory bandwidth, more physical cores, lower power draw, or the specific Snapdragon X Elite platform features. Because no benchmark scores exist, these are inference-based conclusions from the recorded specifications, not measured performance results.

Specification Differences

The following fields differ between the two processors in the database record:

• Cores: AMD 8, Qualcomm 12
• Threads: AMD 16, Qualcomm 12
• Base clock: AMD 3.80 GHz, Qualcomm 3.40 GHz
• Boost clock: AMD 5.10 GHz, Qualcomm not recorded
• TDP: AMD 45 watts, Qualcomm 35 watts
• Socket: AMD Socket FP8, Qualcomm BGA 2073
• Architecture: AMD Zen 4, Qualcomm not recorded
• Codename: AMD Hawk Point, Qualcomm Oryon
• Generation: AMD Ryzen Embedded (Zen 4 (Hawk Point)), Qualcomm Snapdragon X (Elite)
• Process node: both 4 nm, no difference
• Foundry: both TSMC, no difference
• Transistors: AMD 25,000 million, Qualcomm not recorded
• Die size: AMD 178 mm², Qualcomm not recorded
• L1 cache: AMD 64 KB per core, Qualcomm 288 KB per core
• L2 cache: AMD 1 MB per core, Qualcomm 12 MB per module
• L3 cache: AMD 16 MB shared, Qualcomm 6 MB shared
• Memory support: AMD DDR5, Qualcomm LPDDR5X
• Memory bus: both dual-channel, no difference
• Memory bandwidth: AMD 89.6 GB/s, Qualcomm 135.2 GB/s
• ECC memory: AMD true, Qualcomm false
• PCIe: AMD Gen 4, 20 lanes, Qualcomm Gen 4, 12 lanes
• Integrated graphics: AMD Radeon 780M, Qualcomm Adreno X1-85
• Release date: AMD 2024-04-01, Qualcomm 2024-04-23
• Part number: AMD unknown, Qualcomm X1E78100
• Multiplier unlocked: both false, no difference
• Production status: both Active, no difference
• Market segment: both Mobile, no difference
• Series: AMD 8000 series, Qualcomm not recorded
• Manufacturer: AMD, Qualcomm manufacturer recorded as unknown
• Launch MSRP: neither has a recorded value

FAQ

Q: Which processor has more cores?

A: The Qualcomm Snapdragon X1E-78-100 has 12 cores, while the AMD Ryzen Embedded 8845HS has 8 cores. The Qualcomm part has 4 more physical cores.

Q: Which processor has more threads?

A: The AMD Ryzen Embedded 8845HS has 16 threads, while the Qualcomm Snapdragon X1E-78-100 has 12 threads. The AMD part has 4 more threads despite having fewer cores, because it supports simultaneous multithreading.

Q: What are the memory bandwidth differences?

A: The Qualcomm Snapdragon X1E-78-100 has a memory bandwidth of 135.2 GB/s using LPDDR5X memory. The AMD Ryzen Embedded 8845HS has a memory bandwidth of 89.6 GB/s using DDR5 memory. The Qualcomm part has 45.6 GB/s more bandwidth.

Q: Does either processor support ECC memory?

A: The AMD Ryzen Embedded 8845HS supports ECC memory. The Qualcomm Snapdragon X1E-78-100 does not support ECC memory.

Q: What are the thermal design power ratings?

A: The AMD Ryzen Embedded 8845HS has a TDP of 45 watts. The Qualcomm Snapdragon X1E-78-100 has a TDP of 35 watts. The Qualcomm part is rated for 10 watts lower power draw.

Q: What process node are both processors built on?

A: Both the AMD Ryzen Embedded 8845HS and the Qualcomm Snapdragon X1E-78-100 are built on a 4 nm process at TSMC. The manufacturing process is identical for both parts.

Q: What are the boost clock frequencies?

A: The AMD Ryzen Embedded 8845HS has a boost clock of 5.10 GHz. The Qualcomm Snapdragon X1E-78-100 has no recorded boost clock in the database.

Q: Which processor has more PCIe lanes?

A: The AMD Ryzen Embedded 8845HS provides 20 Gen 4 PCIe lanes (CPU only). The Qualcomm Snapdragon X1E-78-100 provides 12 Gen 4 PCIe lanes (CPU only). The AMD part has 8 more PCIe lanes.