AMD Ryzen Embedded 8845HS vs Intel Core 5 223PTE Comparison

AMD
AMD

AMD Ryzen Embedded 8845HS

CORE STATE Hawk Point
CORE SPECS 8 Cores / 16 Threads
CLOCK SPEED 3.8 Base / 5.1 GHz Turbo
CACHE 16 MB (shared)
MAX TDP 45W
ARCHITECTURE Zen 4
nm
PROCESS 4 nm
LAUNCH DATE 2024
VS
Intel
INTEL

Core 5 223PTE

CORE STATE Bartlett Lake
CORE SPECS 8 Cores / 16 Threads
CLOCK SPEED 2.3 Base / 5.4 GHz Turbo
CACHE 24 MB (shared)
MAX TDP 45W
ARCHITECTURE Bartlett Lake
nm
PROCESS 10 nm
LAUNCH DATE 2026

Analysis: AMD Ryzen Embedded 8845HS vs Intel Core 5 223PTE

The Verdict

The recorded database entries for the AMD Ryzen Embedded 8845HS and the Intel Core 5 223PTE show two distinct design philosophies aimed at different deployment targets. Both processors feature 8 cores and 16 threads, placing them in the same computational tier for parallel workloads, and both carry a 45 W TDP, meaning thermal management requirements are comparable. The AMD part targets the mobile embedded space with a 4 nm TSMC process and Radeon 780M integrated graphics, while the Intel part is a desktop-oriented chip built on Intel's 10 nm node with UHD Graphics 770 and support for both DDR4 and DDR5 memory. The data suggests the AMD chip is optimized for power efficiency and modern process technology, whereas the Intel chip emphasizes raw boost clocks and PCIe Gen 5 connectivity. For workloads that depend on single-thread burst performance, the Intel Core 5 223PTE has the nominal advantage with a 5.40 GHz boost clock versus the AMD's 5.10 GHz. For sustained multi-threaded throughput in thermally constrained embedded chassis, the AMD Ryzen Embedded 8845HS offers a higher base clock of 3.80 GHz and a smaller 178 mm² die. The database records no benchmark scores for either part, so the verdict rests on architectural specifications and feature sets rather than measured performance deltas.

Architecture Differences

The AMD Ryzen Embedded 8845HS uses the Zen 4 architecture under the Hawk Point codename, fabricated by TSMC on a 4 nm process. It integrates 25,000 million transistors on a 178 mm² die, which indicates a dense design that balances compute and integrated graphics in a mobile package. The Intel Core 5 223PTE uses the Bartlett Lake codename, fabricated by Intel on a 10 nm process, with no transistor count or die size recorded in the database. The process node difference is substantial: 4 nm versus 10 nm, which typically translates into different power density and thermal characteristics, though the database does not quantify those effects here. Both parts are 8-core, 16-thread designs, so thread-level parallelism is identical on paper.

Cache hierarchies differ noticeably. The AMD chip provides 64 KB of L1 per core, 1 MB of L2 per core, and 16 MB of shared L3. The Intel chip provides 80 KB of L1 per core, 2 MB of L2 per core, and 24 MB of shared L3. The Intel part thus holds a cache capacity advantage at every level: 25% more L1 per core, double the L2 per core, and 50% more L3 overall. For workloads that repeatedly access a working set larger than 16 MB, the Intel chip's larger L3 could reduce memory traffic, though the database does not include measured hit-rate data to confirm this.

Memory support also diverges. The AMD Ryzen Embedded 8845HS supports DDR5 only, with dual-channel configuration and a recorded memory bandwidth of 89.6 GB/s. The Intel Core 5 223PTE supports both DDR4 and DDR5, also dual-channel, with the same recorded memory bandwidth of 89.6 GB/s. Both support ECC memory, which matters for embedded reliability scenarios. The Intel part's DDR4 compatibility offers flexibility for existing systems, while the AMD part's DDR5-only path aligns with newer memory generations.

PCIe capabilities differ significantly. The AMD chip provides PCIe Gen 4 with 20 lanes from the CPU. The Intel chip provides PCIe Gen 5 with 16 lanes from the CPU. Gen 5 doubles the per-lane bandwidth of Gen 4, so the Intel part can deliver more raw I/O throughput per lane, but the AMD part offers four additional lanes. Systems needing many simultaneous Gen 4 devices may prefer the AMD layout, while systems needing maximum bandwidth to a single device, such as a high-end accelerator or NVMe drive, may prefer the Intel Gen 5 implementation.

The integrated graphics differ in branding and likely capability. AMD uses the Radeon 780M, which is part of its modern mobile GPU lineup. Intel uses UHD Graphics 770, a desktop-class iGPU. The database does not include iGPU benchmark scores, so relative graphical performance cannot be quantified here. The AMD part is classified as a mobile segment processor on AMD Socket FP8, released on 2024-04-01. The Intel part is classified as a desktop segment processor on Intel Socket 1700, with a release date of 2026-03-08 and a launch MSRP of $232. Both are listed as active production parts with locked multipliers.

Where Each One Wins

The Intel Core 5 223PTE wins on raw clock ceiling. Its 5.40 GHz boost clock exceeds the AMD's 5.10 GHz boost by 300 MHz, which typically favors lightly threaded workloads that depend on single-core burst speed. The Intel part also carries more cache at every level, which can benefit latency-sensitive applications that repeatedly access moderately sized data structures. Its PCIe Gen 5 support gives it a connectivity edge for high-bandwidth peripherals. The Intel chip supports both DDR4 and DDR5, making it adaptable to either new or existing memory infrastructure in desktop embedded systems.

The AMD Ryzen Embedded 8845HS wins on base clock and process efficiency. Its 3.80 GHz base clock is 1.50 GHz higher than the Intel's 2.30 GHz base clock, which indicates that the AMD part sustains higher frequency under all-core loads without relying on boost headroom. This is relevant for embedded applications that run continuous, predictable workloads where sustained throughput matters more than peak burst. The AMD chip's 4 nm TSMC process versus Intel's 10 nm node suggests better power efficiency per transistor, though the database does not record measured power draw. The AMD part's 20 PCIe Gen 4 lanes support more concurrent devices than the Intel's 16 lanes, which matters for systems with multiple controllers. The AMD chip also has a smaller die at 178 mm², which can simplify thermal design in compact embedded enclosures.

The mobile versus desktop market segmentation further differentiates the intended use cases. The AMD Ryzen Embedded 8845HS targets mobile and space-constrained embedded platforms with its FP8 socket. The Intel Core 5 223PTE targets desktop embedded systems with the LGA 1700 socket. The AMD part's release in April 2024 gives it a longer field history, while the Intel part's March 2026 release is more recent, suggesting a more current design cycle for the Intel chip in terms of launch timing.

FAQ

Q: Which processor has the higher boost clock?

A: The Intel Core 5 223PTE has a boost clock of 5.40 GHz, while the AMD Ryzen Embedded 8845HS boosts to 5.10 GHz. The Intel part leads by 300 MHz.

Q: Do both processors support ECC memory?

A: Yes. Both the AMD Ryzen Embedded 8845HS and the Intel Core 5 223PTE have ECC memory support enabled.

Q: What memory types does each processor support?

A: The AMD Ryzen Embedded 8845HS supports DDR5 only. The Intel Core 5 223PTE supports both DDR4 and DDR5. Both use dual-channel memory buses with a recorded bandwidth of 89.6 GB/s.

Q: How do the cache sizes compare?

A: The Intel Core 5 223PTE has larger caches at all levels: 80 KB L1 per core versus 64 KB, 2 MB L2 per core versus 1 MB, and 24 MB shared L3 versus 16 MB.

Q: Which processor has more PCIe lanes?

A: The AMD Ryzen Embedded 8845HS has 20 PCIe Gen 4 lanes. The Intel Core 5 223PTE has 16 PCIe Gen 5 lanes. AMD offers more lanes, while Intel offers a newer PCIe generation.

Q: What is the process node for each chip?

A: The AMD Ryzen Embedded 8845HS is fabricated on a 4 nm process by TSMC. The Intel Core 5 223PTE is fabricated on a 10 nm process by Intel.

Head-to-Head Benchmarks

The database contains no recorded benchmark scores for either the AMD Ryzen Embedded 8845HS or the Intel Core 5 223PTE. The head-to-head benchmark array is empty, and the average benchmark score for both parts is 0. The percentile versus all CPUs is 50 for both, indicating a median standing in the overall distribution, but this is a placement metric rather than a measured performance result. Without benchmark data, the analysis must rely on the architectural specifications recorded in the database.

The most significant clock-based comparison is the boost clock differential. The Intel Core 5 223PTE's 5.40 GHz boost exceeds the AMD Ryzen Embedded 8845HS's 5.10 GHz boost. In single-threaded workloads that scale with frequency, this 300 MHz advantage suggests the Intel chip can complete latency-bound tasks faster, assuming identical IPC. However, the database does not include IPC measurements, so this remains a nominal comparison rather than a verified performance delta.

The base clock comparison favors AMD decisively. The AMD chip's 3.80 GHz base clock is 65% higher than the Intel chip's 2.30 GHz base clock. This matters for sustained all-core workloads where boost frequencies cannot be maintained indefinitely due to thermal or power limits. The AMD part is likely to sustain higher throughput over long-running parallel tasks, though the database does not record thermal throttling behavior to confirm this.

Cache capacity differences are substantial. The Intel chip's L3 cache is 24 MB, which is 50% larger than the AMD chip's 16 MB L3. The Intel chip's L2 cache is 2 MB per core, double the AMD's 1 MB per core. The Intel chip's L1 cache is 80 KB per core, 25% larger than the AMD's 64 KB per core. For workloads with high cache reuse, the Intel part holds a structural advantage that could reduce memory latency and improve throughput, but no benchmark scores exist to quantify the real-world impact.

Memory bandwidth is identical at 89.6 GB/s for both parts, so memory-bound workloads that saturate the bus will see no difference in peak bandwidth. The AMD part is limited to DDR5, while the Intel part can use either DDR4 or DDR5. In a DDR5 configuration, both should achieve the same theoretical bandwidth, but the database does not record latency figures for either memory type.

PCIe connectivity presents a trade-off. The AMD chip's 20 Gen 4 lanes provide more total lanes, while the Intel chip's 16 Gen 5 lanes provide higher per-lane bandwidth. A system with four Gen 4 NVMe drives would use all 20 AMD lanes but only 16 Intel lanes. A system with a single Gen 5 storage device would achieve higher bandwidth on the Intel platform. The database does not include measured I/O throughput, so the practical impact depends on the specific peripheral configuration.

The integrated graphics comparison is limited to product names. The AMD Radeon 780M and Intel UHD Graphics 770 are both recorded, but no iGPU benchmarks exist in the database. The AMD part's mobile heritage and modern process node suggest a more capable iGPU for general display output and light compute, but this is inference from positioning rather than measured data.

The transistor count difference is notable: the AMD chip integrates 25,000 million transistors on a 178 mm² die, while the Intel chip has no recorded transistor count or die size. The AMD transistor density works out to roughly 140 million transistors per square millimeter, which reflects the 4 nm process. The Intel 10 nm process would typically yield lower density, but without recorded figures, no quantitative comparison is possible.

Socket and form factor differences define platform compatibility. The AMD Ryzen Embedded 8845HS uses AMD Socket FP8 and is classified as a mobile processor. The Intel Core 5 223PTE uses Intel Socket 1700 and is classified as a desktop processor. These are not interchangeable platforms, so the choice of chip effectively determines the entire system architecture.

Release timing differs by nearly two years. The AMD part launched on 2024-04-01, while the Intel part launched on 2026-03-08. The Intel part is the newer design by release date, which may matter for systems that require the most recent platform support. The AMD part's earlier release means it has been available longer in the embedded market.

The Intel Core 5 223PTE has a recorded launch MSRP of $232 and a part number of SA4QL. The AMD Ryzen Embedded 8845HS has no launch MSRP recorded and an unknown part number. Both processors are listed as active production parts with locked multipliers, meaning neither supports unlocked overclocking. The database records no wins for either part in the head-to-head comparison, as the benchmark arrays are empty. The verdict from the recorded data is that the Intel chip leads in clock ceiling, cache capacity, and PCIe generation, while the AMD chip leads in base clock, process node, lane count, and transistor integration. The absence of benchmark scores means these are specification-based conclusions, not measured performance conclusions.

DETAILED SPECIFICATIONS

SPECIFICATION
Embedded 8845HS
5 223PTE
Core Specs
Cores
8
8 0.0%
Threads
16
16 0.0%
Base Clock (GHz)
3.8
2.3 -39.5%
Boost Clock (GHz)
5.1
5.4 +5.9%
Frequency (GHz)
3.8
2.3 -39.5%
Turbo Clock (GHz)
5.1
5.4 +5.9%
Multiplier
38
23 -39.5%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
80 KB (per core)
L2 Cache
1 MB (per core)
2 MB (per core)
L3 Cache
16 MB (shared)
24 MB (shared)
Power
TDP (W)
45
45 0.0%
PL1
45 W
PL2
219 W
Configurable TDP
35-54 W
Architecture
Architecture
Zen 4
Codename
Hawk Point
Bartlett Lake
Generation
Ryzen Embedded (Zen 4 (Hawk Point))
Core 5 (Bartlett Lake)
Process Size
4 nm
10 nm
Transistors
25,000 million
Die Size
178 mm²
Foundry
TSMC
Intel
Memory
Memory Support
DDR5
DDR4, DDR5
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
89.6 GB/s
89.6 GB/s
ECC Memory
Yes
Yes
DDR4 Speed
3200 MT/s
Platform
Socket
AMD Socket FP8
Intel Socket 1700
Chipsets
W680, R680E, Q670e, Q670, H610E, H610
PCIe
Gen 4, 20 Lanes(CPU only)
Gen 5, 16 Lanes(CPU only)
AI/NPU
NPU
Yes / 16 TOPS
Graphics
Integrated Graphics
Radeon 780M
UHD Graphics 770
Other
Market
Mobile
Desktop
Production Status
Active
Active
Launch Price
$232
Part Number
unknown
SA4QL
Package
FP8, FP7, FP7r2
FC-LGA16A
Tj Max
100°C
100°C
View Ryzen Embedded 8845HS Details View Core 5 223PTE Details