AMD Ryzen Embedded 8845HS vs Intel Arc G3 Comparison

Head-to-Head Benchmarks

The recorded database contains no direct benchmark scores for either the AMD Ryzen Embedded 8845HS or the Intel Arc G3. Both processors have an average benchmark score of zero, and the head-to-head benchmark array is empty. The win counts for each processor are also zero, meaning neither part has a measurable performance advantage in the current dataset. This absence of scores does not indicate parity; it simply reflects that no validated performance measurements have been entered for these two mobile processors. Without recorded data, no direct performance deltas, percentile comparisons, or speedup ratios can be derived between the two parts. The percentile rank against all CPUs in the database is identical for both at 50, which is the median value and does not provide a meaningful differentiation in the absence of actual scores. The benchmark database will require populated test results before any head-to-head performance conclusion can be drawn.

Architecture Differences

The two processors diverge sharply in architectural design, manufacturing process, and feature set. The AMD Ryzen Embedded 8845HS belongs to the 8000 series and uses the Zen 4 architecture under the Hawk Point codename. It is built on a 4 nm process at TSMC, with a die size of 178 mm² and 25,000 million transistors. The Intel Arc G3, by contrast, is built on a 3 nm process at Intel foundries, with no transistor count or die size recorded in the database. The Intel part uses the Panther Lake codename and is classified under the Arc G3 generation. This process node difference is significant: the Intel part uses a smaller 3 nm node compared to the AMD part's 4 nm node, which typically allows for higher transistor density, though no transistor count is available for the Intel chip to confirm that.

Core and thread configurations differ substantially. The AMD processor has 8 cores and 16 threads, while the Intel processor has 14 cores and 14 threads. The Intel part has more physical cores but no hyperthreading or equivalent simultaneous multithreading, so thread counts match core counts. The AMD part uses simultaneous multithreading to double its thread count to 16. Clock speeds show a different tradeoff. The AMD chip has a base clock of 3.80 GHz and a boost clock of 5.10 GHz, while the Intel chip has a much lower base clock of 1.90 GHz and a boost clock of 4.60 GHz. The AMD part therefore holds a 1.90 GHz advantage at base and a 0.50 GHz advantage at boost. Power envelopes differ as well: the AMD processor has a TDP of 45 watts, while the Intel processor has a TDP of 25 watts, making the Intel part the lower-power option by 20 watts.

Cache hierarchies are structured differently. The AMD chip has 64 KB of L1 cache per core, 1 MB of L2 cache per core, and 16 MB of shared L3 cache. The Intel chip has 192 KB of L1 cache per core, 2.5 MB of L2 cache per core, and 18 MB of shared L3 cache. The Intel part has larger per-core L1 and L2 caches and a larger shared L3 pool, though the AMD part's smaller per-core caches are paired with simultaneous multithreading. Memory support also differs. The AMD processor supports DDR5 memory over a dual-channel bus with a peak bandwidth of 89.6 GB/s and includes ECC memory support. The Intel processor supports LPDDR5X memory over a dual-channel bus with a peak bandwidth of 136.5 GB/s, which is 46.9 GB/s higher than the AMD part, but it does not support ECC memory. The AMD chip uses PCIe Gen 4 with 20 lanes from the CPU, while the Intel chip uses PCIe Gen 5 with 4 lanes from the CPU. The Intel part has a newer PCIe generation but far fewer CPU-attached lanes.

Integrated graphics differ as well. The AMD processor uses the Radeon 780M, while the Intel processor uses the Arc B370. Sockets are incompatible: the AMD chip uses AMD Socket FP8, and the Intel chip uses Intel BGA 2540. The AMD processor was released on April 1, 2024, while the Intel processor was released on May 27, 2026, a gap of roughly two years. Both parts are listed as Active in production status, both target the mobile market segment, and neither has an unlocked multiplier. The AMD part has no part number recorded, while the Intel part has the part number SA4QZ. The Intel part is notably absent of a recorded architecture field, though its codename and generation are documented as Panther Lake and Arc G3. The AMD part does not list a series beyond the 8000 series, while the Intel part has no series entry at all.

FAQ

Q: Which processor has more cores and threads?

A: The Intel Arc G3 has 14 cores and 14 threads, while the AMD Ryzen Embedded 8845HS has 8 cores and 16 threads. The AMD part has more threads due to simultaneous multithreading, but the Intel part has more physical cores.

Q: What are the clock speed differences between the two?

A: The AMD processor has a base clock of 3.80 GHz and a boost clock of 5.10 GHz. The Intel processor has a base clock of 1.90 GHz and a boost clock of 4.60 GHz. The AMD part is faster at both base and boost.

Q: How do the power envelopes compare?

A: The AMD Ryzen Embedded 8845HS has a TDP of 45 watts, while the Intel Arc G3 has a TDP of 25 watts. The Intel part draws 20 watts less under its rated thermal design power.

Q: Which processor supports ECC memory?

A: The AMD Ryzen Embedded 8845HS supports ECC memory. The Intel Arc G3 does not support ECC memory.

Q: What are the memory bandwidth figures for each processor?

A: The AMD processor supports DDR5 with a peak bandwidth of 89.6 GB/s. The Intel processor supports LPDDR5X with a peak bandwidth of 136.5 GB/s, which is higher by 46.9 GB/s.

Q: What PCIe generations and lane counts do the two parts use?

A: The AMD processor uses PCIe Gen 4 with 20 lanes from the CPU. The Intel processor uses PCIe Gen 5 with 4 lanes from the CPU. The AMD part offers more CPU-attached lanes, while the Intel part uses a newer PCIe generation.

The Verdict

The recorded data does not support a performance verdict between the AMD Ryzen Embedded 8845HS and the Intel Arc G3, as no benchmark scores exist for either processor. What the data does support is a feature-level distinction. The AMD part is the choice for workloads requiring high single-thread clock rates, with a 5.10 GHz boost clock versus 4.60 GHz on the Intel part, and for applications that need ECC memory support. The AMD part also provides more CPU-attached PCIe lanes at 20 Gen 4 lanes, which matters for systems with multiple peripheral devices. Its 45 watt TDP and 8-core, 16-thread configuration position it as a higher-power part with simultaneous multithreading.

The Intel part suits scenarios where lower power consumption is the priority, with a 25 watt TDP that is 20 watts lower than the AMD chip. Its 14 physical cores exceed the AMD part's 8 physical cores, and its 18 MB of shared L3 cache is larger than the AMD part's 16 MB. The Intel chip also delivers higher memory bandwidth at 136.5 GB/s versus 89.6 GB/s, and it uses a newer 3 nm process node compared to the AMD part's 4 nm node. The Intel part's lack of ECC support and its limited 4 PCIe Gen 5 lanes are notable constraints. The release dates differ by more than two years, with the AMD part launching on April 1, 2024, and the Intel part on May 27, 2026. Neither processor has an unlocked multiplier, and both are listed as Active in production. The database shows two mobile processors with complementary strengths, but without benchmark results, any choice must rest on the architectural and feature differences documented above.

Specification Differences

| Field | AMD Ryzen Embedded 8845HS | Intel Arc G3 |

|---|---|---|

| Cores | 8 | 14 |

| Threads | 16 | 14 |

| Base Clock | 3.80 GHz | 1.90 GHz |

| Boost Clock | 5.10 GHz | 4.60 GHz |

| TDP | 45 W | 25 W |

| Socket | AMD Socket FP8 | Intel BGA 2540 |

| Codename | Hawk Point | Panther Lake |

| Generation | Ryzen Embedded (Zen 4 (Hawk Point)) | Arc G3 (Panther Lake) |

| Process Node | 4 nm | 3 nm |

| Foundry | TSMC | Intel |

| Transistors | 25,000 million | Not recorded |

| Die Size | 178 mm² | Not recorded |

| L1 Cache | 64 KB (per core) | 192 KB (per core) |

| L2 Cache | 1 MB (per core) | 2.5 MB (per core) |

| L3 Cache | 16 MB (shared) | 18 MB (shared) |

| Memory Support | DDR5 | LPDDR5X |

| Memory Bus | Dual-channel | Dual-channel |

| Memory Bandwidth | 89.6 GB/s | 136.5 GB/s |

| ECC Memory | Yes | No |

| PCIe | Gen 4, 20 Lanes (CPU only) | Gen 5, 4 Lanes (CPU only) |

| Integrated Graphics | Radeon 780M | Arc B370 |

| Market Segment | Mobile | Mobile |

| Production Status | Active | Active |

| Release Date | 2024-04-01 | 2026-05-27 |

| Multiplier Unlocked | No | No |

| Part Number | Unknown | SA4QZ |

| Percentile vs All CPUs | 50 | 50 |

| Average Benchmark Score | 0 | 0 |