AMD Ryzen Embedded 8845HS vs AMD Ryzen Embedded 9950X Comparison

AMD
AMD

AMD Ryzen Embedded 8845HS

CORE STATE Hawk Point
CORE SPECS 8 Cores / 16 Threads
CLOCK SPEED 3.8 Base / 5.1 GHz Turbo
CACHE 16 MB (shared)
MAX TDP 45W
ARCHITECTURE Zen 4
nm
PROCESS 4 nm
LAUNCH DATE 2024
VS
AMD
AMD

Ryzen Embedded 9950X

CORE STATE Granite Ridge
CORE SPECS 16 Cores / 32 Threads
CLOCK SPEED 4.3 Base / 5.7 GHz Turbo
CACHE 64 MB
MAX TDP 170W
ARCHITECTURE Granite Ridge
nm
PROCESS 4 nm
LAUNCH DATE 2025

Analysis: AMD Ryzen Embedded 8845HS vs AMD Ryzen Embedded 9950X

FAQ

Q: What are the core and thread counts for the AMD Ryzen Embedded 8845HS and the AMD Ryzen Embedded 9950X?

A: The 8845HS has 8 cores and 16 threads, while the 9950X has 16 cores and 32 threads.

Q: Which processor has the higher boost clock?

A: The 9950X boosts to 5.70 GHz, which is higher than the 8845HS boost of 5.10 GHz.

Q: Do both processors support ECC memory?

A: Yes, both the 8845HS and the 9950X support ECC memory.

Q: What is the PCIe generation difference between the two?

A: The 8845HS uses PCIe Gen 4 with 20 lanes, while the 9950X uses PCIe Gen 5 with 28 lanes.

Q: Are both processors built on the same process node?

A: Yes, both are fabricated by TSMC on a 4 nm process.

Q: Which processor has a larger L3 cache?

A: The 9950X has 64 MB of L3 cache, compared to 16 MB on the 8845HS.

Architecture Differences

The AMD Ryzen Embedded 8845HS belongs to the 8000 series and uses the Zen 4 architecture under the Hawk Point codename. The AMD Ryzen Embedded 9950X is part of the 9000 series and uses the Zen 5 architecture with the Granite Ridge codename. This generational shift brings notable microarchitectural changes, even though both processors are manufactured on the same 4 nm TSMC node.

The 8845HS is a monolithic design with a die size of 178 mm² and 25,000 million transistors. The 9950X uses a chiplet layout, described as 2x 70.6 mm², with a total of 16,630 million transistors. The smaller individual dies in the 9950X reflect a dual-CCX structure common to high-core-count desktop parts, whereas the 8845HS packs everything into a single die.

Cache hierarchies differ significantly. The 8845HS provides 64 KB of L1 cache per core, 1 MB of L2 cache per core, and 16 MB of shared L3 cache. The 9950X bumps the L1 to 80 KB per core, keeps 1 MB of L2 per core, and expands the shared L3 to 64 MB. The larger L3 on the 9950X is a major architectural advantage for workloads that repeatedly access large data sets.

Memory support is identical in type and channel count: both use DDR5 with a dual-channel memory bus and both deliver a memory bandwidth of 89.6 GB/s. Both processors also support ECC memory, which is important for embedded and reliability-focused deployments.

The integrated graphics differ. The 8845HS includes a Radeon 780M, while the 9950X includes a more generic Radeon Graphics solution. The 8845HS targets the mobile segment with a 45 W TDP and uses AMD Socket FP8. The 9950X is a desktop-class part with a 170 W TDP on AMD Socket AM5 and has an unlocked multiplier, allowing overclocking. The 8845HS does not have an unlocked multiplier.

The 9950X supports PCIe Gen 5 with 28 CPU lanes, while the 8845HS uses PCIe Gen 4 with 20 CPU lanes. This makes the 9950X the better choice for high-bandwidth expansion such as modern GPUs and NVMe storage. The 8845HS still provides adequate connectivity for mobile embedded systems but at a lower generation and lane count.

The 8845HS was released in April 2024, while the 9950X followed in October 2025. Both are listed as Active in production status.

The Verdict

The data points to a clear performance hierarchy. The AMD Ryzen Embedded 9950X doubles the core count and thread count of the 8845HS, offers a higher base clock of 4.30 GHz versus 3.80 GHz, and boosts to 5.70 GHz against 5.10 GHz. It also carries four times the L3 cache, 64 MB versus 16 MB, and uses the newer Zen 5 architecture. For multi-threaded workloads, CPU-bound compute, or any scenario where raw throughput matters, the 9950X is the obvious choice from the recorded specifications.

The 8845HS still has a role. Its 45 W TDP makes it suitable for power-constrained embedded systems, and its Radeon 780M integrated graphics are a more capable integrated solution than the generic Radeon Graphics in the 9950X. The mobile Socket FP8 platform and smaller physical footprint also favor the 8845HS in compact designs. The 8845HS uses PCIe Gen 4, which is sufficient for many embedded applications, and its 16 MB L3 cache is adequate for lighter workloads.

The 9950X is also the better option for systems that need the latest PCIe Gen 5 connectivity and the flexibility of an unlocked multiplier. Its chiplet design with two 70.6 mm² dies may offer better thermal distribution in a desktop chassis, though the 170 W TDP means the cooling solution must handle significantly more heat than the 8845HS.

Neither processor has benchmark scores or nearest rivals recorded in the database, so the comparison rests on architectural and specification differences. From those, the 9950X dominates in compute resources, cache capacity, and I/O generation. The 8845HS wins on power efficiency, integrated graphics quality, and platform fit for mobile or compact embedded designs.

Specification Differences

The two processors differ on almost every major specification field.

  • Cores: 8 on the 8845HS, 16 on the 9950X.
  • Threads: 16 on the 8845HS, 32 on the 9950X.
  • Base clock: 3.80 GHz on the 8845HS, 4.30 GHz on the 9950X.
  • Boost clock: 5.10 GHz on the 8845HS, 5.70 GHz on the 9950X.
  • TDP: 45 W on the 8845HS, 170 W on the 9950X.
  • Socket: AMD Socket FP8 on the 8845HS, AMD Socket AM5 on the 9950X.
  • Architecture: Zen 4 on the 8845HS, Zen 5 on the 9950X.
  • Codename: Hawk Point on the 8845HS, Granite Ridge on the 9950X.
  • Transistors: 25,000 million on the 8845HS, 16,630 million on the 9950X.
  • Die size: 178 mm² on the 8845HS, 2x 70.6 mm² on the 9950X.
  • L1 cache: 64 KB per core on the 8845HS, 80 KB per core on the 9950X.
  • L3 cache: 16 MB shared on the 8845HS, 64 MB on the 9950X.
  • PCIe: Gen 4 with 20 lanes on the 8845HS, Gen 5 with 28 lanes on the 9950X.
  • Integrated graphics: Radeon 780M on the 8845HS, Radeon Graphics on the 9950X.
  • Market segment: Mobile on the 8845HS, Desktop on the 9950X.
  • Multiplier unlocked: false on the 8845HS, true on the 9950X.
  • Release date: April 2024 for the 8845HS, October 2025 for the 9950X.
  • Part number: unknown for the 8845HS, 100-000001277E for the 9950X.

Fields that are identical include the manufacturer (AMD), process node (4 nm TSMC), foundry (TSMC), memory type (DDR5), memory bus (dual-channel), memory bandwidth (89.6 GB/s), ECC support (true), and production status (Active).

Head-to-Head Benchmarks

The database contains no recorded benchmark scores for either processor, and there are no head-to-head benchmark entries, wins, or nearest rival comparisons available. The analysis must therefore rely entirely on the specification and architecture data.

The biggest single advantage for the 9950X is the core count. It doubles the 8845HS from 8 cores to 16 cores and doubles the thread count from 16 to 32. In any multi-threaded workload, such as video encoding, software compilation, or server-side virtualization, the 9950X has the structural capacity to process roughly twice as many threads concurrently. The base clock advantage of 0.50 GHz and boost clock advantage of 0.60 GHz further widen the gap in single-threaded and lightly threaded tasks.

Cache capacity is another decisive margin. The 9950X has 64 MB of L3 cache versus 16 MB on the 8845HS, a fourfold increase. For workloads that fit within the L3 footprint, such as database query processing or scientific simulations with repeated data access, this can reduce memory latency and improve throughput substantially. The 8845HS also has smaller L1 caches at 64 KB per core versus 80 KB per core, so the 9950X leads at every level of the cache hierarchy except L2, where both provide 1 MB per core.

The 9950X also carries the newer Zen 5 microarchitecture. Combined with the higher clocks, this should provide a meaningful instructions-per-clock improvement over the Zen 4-based 8845HS. The exact percentage cannot be quantified from the database, but the architectural generation gap is a clear differentiator.

The 8845HS does hold advantages in specific areas. Its 45 W TDP is drastically lower than the 170 W TDP of the 9950X, meaning the 8845HS generates far less heat and requires a less substantial cooling solution. The Radeon 780M integrated graphics in the 8845HS are a more robust integrated GPU than the generic Radeon Graphics in the 9950X, so for embedded systems that need display output or light GPU compute without a discrete card, the 8845HS is better equipped.

PCIe connectivity favors the 9950X with Gen 5 and 28 lanes against Gen 4 and 20 lanes. This matters for systems with multiple high-speed NVMe drives, modern GPUs, or network adapters that can use the extra bandwidth. The 8845HS remains functional for moderate expansion needs but at half the lane count and one generation behind.

Memory bandwidth is identical at 89.6 GB/s, so neither processor gains a memory throughput edge. Both support DDR5 and dual-channel configurations, and both support ECC memory, making either viable for reliability-sensitive workloads.

In summary, the recorded data shows a lopsided contest in raw compute potential. The 9950X wins on cores, threads, clocks, cache, architecture generation, PCIe generation, and overclocking flexibility. The 8845HS wins on power draw, integrated graphics capability, and mobile platform fit. Without benchmark scores, the margins cannot be expressed as percentages, but the specification deltas are substantial and consistent across nearly every category.

DETAILED SPECIFICATIONS

SPECIFICATION
Embedded 8845HS
Embedded 9950X
Core Specs
Cores
8
16 +100.0%
Threads
16
32 +100.0%
Base Clock (GHz)
3.8
4.3 +13.2%
Boost Clock (GHz)
5.1
5.7 +11.8%
Frequency (GHz)
3.8
4.3 +13.2%
Turbo Clock (GHz)
5.1
5.7 +11.8%
Multiplier
38
43 +13.2%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
80 KB (per core)
L2 Cache
1 MB (per core)
1 MB (per core)
L3 Cache
16 MB (shared)
64 MB
Power
TDP (W)
45
170 +277.8%
PPT
—
230 W
Configurable TDP
35-54 W
—
Architecture
Architecture
Zen 4
—
Codename
Hawk Point
Granite Ridge
Generation
Ryzen Embedded (Zen 4 (Hawk Point))
Ryzen Embedded (Zen 5 (Granite Ridge))
Process Size
4 nm
4 nm
Transistors
25,000 million
16,630 million
Die Size
178 mm²
2x 70.6 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR5
DDR5
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
89.6 GB/s
89.6 GB/s
ECC Memory
Yes
Yes
Platform
Socket
AMD Socket FP8
AMD Socket AM5
Chipsets
—
X870E, X870, B850, B840, X670E, X670, B650E, B650, A620, X600¹
PCIe
Gen 4, 20 Lanes(CPU only)
Gen 5, 28 Lanes(CPU only)
AMD Multi-Die
IO Process Size
—
6 nm
AI/NPU
NPU
Yes / 16 TOPS
—
Graphics
Integrated Graphics
Radeon 780M
Radeon Graphics
Other
Market
Mobile
Desktop
Production Status
Active
Active
Part Number
unknown
100-000001277E
Package
FP8, FP7, FP7r2
FC-LGA1718
Tj Max
100°C
95°C
Bundled Cooler
—
None
View Ryzen Embedded 8845HS Details View Ryzen Embedded 9950X Details