AMD Ryzen Embedded 8845HS vs AMD Ryzen Embedded 9900X3D Comparison

FAQ

Q: What are the core and thread counts of these two processors?

A: The AMD Ryzen Embedded 8845HS has 8 cores and 16 threads, while the AMD Ryzen Embedded 9900X3D has 12 cores and 24 threads.

Q: Which processor has a higher boost clock?

A: The AMD Ryzen Embedded 9900X3D boosts to 5.50 GHz, which is higher than the 5.10 GHz boost clock of the AMD Ryzen Embedded 8845HS.

Q: Do both processors support ECC memory?

A: Yes, both the AMD Ryzen Embedded 8845HS and the AMD Ryzen Embedded 9900X3D include ECC memory support.

Q: What is the process node for each chip?

A: Both processors are manufactured on a 4 nm process at TSMC.

Q: What is the L3 cache capacity difference?

A: The AMD Ryzen Embedded 8845HS has 16 MB of shared L3 cache, while the AMD Ryzen Embedded 9900X3D has 128 MB of L3 cache.

Q: Which processor uses a newer PCIe generation?

A: The AMD Ryzen Embedded 9900X3D uses PCIe Gen 5 with 24 lanes, while the AMD Ryzen Embedded 8845HS uses PCIe Gen 4 with 20 lanes.

Architecture Differences

The AMD Ryzen Embedded 8845HS belongs to the 8000 series and is built on the Zen 4 architecture, codenamed Hawk Point. It is a mobile-market processor using AMD Socket FP8. The AMD Ryzen Embedded 9900X3D belongs to the 9000 series and is built on the Zen 5 architecture, codenamed Granite Ridge, targeting the desktop market with AMD Socket AM5.

The process node is identical at 4 nm from TSMC, but the transistor counts differ substantially. The 8845HS integrates 25,000 million transistors on a 178 mm² die, whereas the 9900X3D uses 16,630 million transistors across a dual-die configuration of 2x 70.6 mm². This structural difference reflects the distinct design goals: the Hawk Point chip is a monolithic mobile processor, while Granite Ridge uses a chiplet layout.

Cache hierarchies differ significantly between the two. The 8845HS provides 64 KB of L1 cache per core and 1 MB of L2 cache per core, with 16 MB of shared L3 cache. The 9900X3D delivers 80 KB of L1 cache per core and 1 MB of L2 cache per core, but its L3 cache jumps to 128 MB, a major advantage for workloads that rely on large resident datasets.

Memory support is aligned: both use DDR5 with a dual-channel memory bus and identical peak memory bandwidth of 89.6 GB/s. ECC memory is supported on both. The integrated graphics differ in naming: the 8845HS features the Radeon 780M, while the 9900X3D lists a generic Radeon Graphics solution.

PCIe connectivity favors the 9900X3D, which offers Gen 5 with 24 CPU-only lanes versus Gen 4 with 20 CPU-only lanes on the 8845HS. The multiplier on the 9900X3D is unlocked, whereas the 8845HS is locked. The release dates are also distinct: the 8845HS launched on 2024-04-01, while the 9900X3D launched on 2025-10-06.

Head-to-Head Benchmarks

The recorded benchmark data for both processors shows no entries in the head-to-head comparison, and neither chip has an average benchmark score or specific rival deltas in the database. The percentile versus all CPUs is identical for both at 50, indicating a similar overall standing in the broader distribution of tested processors.

Despite the absence of direct measured scores, the specification data provides a basis for expected performance deltas. The 9900X3D holds a 50% higher core count and a 50% higher thread count, which in heavily threaded workloads typically translates into a proportional advantage in multi-core throughput. The base clock of 4.40 GHz on the 9900X3D is 0.60 GHz higher than the 3.80 GHz base clock of the 8845HS, and the boost clock of 5.50 GHz is 0.40 GHz higher than the 5.10 GHz boost. These clock advantages compound the core-count lead.

The L3 cache difference is the most pronounced architectural gap. The 9900X3D's 128 MB of L3 cache is eight times larger than the 8845HS's 16 MB. This capacity is designed to reduce memory latency in cache-sensitive workloads, particularly gaming and server-side data processing, where repeated access to large working sets benefits from on-die storage.

The 8845HS counters with a lower TDP of 45 W versus 120 W, which indicates a lower power envelope for thermally constrained mobile deployments. Its smaller die and monolithic design also suggest lower integration complexity for embedded systems where space is limited.

The PCIe generation gap gives the 9900X3D more headroom for high-throughput peripherals, as Gen 5 doubles the per-lane bandwidth relative to Gen 4. The 8845HS, with 20 Gen 4 lanes, still supports a reasonable set of NVMe drives and add-in cards, but the 9900X3D's 24 Gen 5 lanes offer more total bandwidth and future-proofing.

Specification Differences

The two processors differ across several key specification fields. Core count: 8 cores for the 8845HS versus 12 cores for the 9900X3D. Thread count: 16 threads versus 24 threads. Base clock: 3.80 GHz versus 4.40 GHz. Boost clock: 5.10 GHz versus 5.50 GHz. TDP: 45 W versus 120 W.

Socket and packaging differ: the 8845HS uses AMD Socket FP8, while the 9900X3D uses AMD Socket AM5. The architecture generation differs as well: Zen 4 (Hawk Point) versus Zen 5 (Granite Ridge). The die size is listed as 178 mm² for the 8845HS and 2x 70.6 mm² for the 9900X3D, and the transistor count is 25,000 million versus 16,630 million.

Cache organization differs in L1 and L3: the 8845HS has 64 KB L1 per core and 16 MB shared L3, while the 9900X3D has 80 KB L1 per core and 128 MB L3. L2 cache is the same at 1 MB per core on both.

PCIe support differs: Gen 4, 20 lanes for the 8845HS versus Gen 5, 24 lanes for the 9900X3D. Integrated graphics differ in branding: Radeon 780M versus Radeon Graphics. The market segment differs: Mobile for the 8845HS versus Desktop for the 9900X3D. The multiplier is locked on the 8845HS and unlocked on the 9900X3D. The release date differs: 2024-04-01 versus 2025-10-06. The part number for the 9900X3D is 100-000001368E, while the 8845HS part number is listed as unknown.

Memory support, memory bus width, memory bandwidth, ECC support, process node, foundry, and production status are identical between the two.

Where Each One Wins

The AMD Ryzen Embedded 9900X3D wins in raw compute capacity. Its 12 cores and 24 threads, combined with higher base and boost clocks, position it ahead for multi-threaded applications such as server virtualization, database workloads, and content-rendering pipelines. The 128 MB L3 cache gives it a clear edge in latency-sensitive tasks where large working sets are repeatedly accessed, such as in-memory analytics or certain scientific simulations. The unlocked multiplier allows tuning for performance beyond stock settings, assuming the power and cooling budget permits.

The PCIe Gen 5 interface with 24 lanes makes the 9900X3D the better choice for systems integrating multiple high-bandwidth accelerators, NVMe storage arrays, or network interface cards that can exploit Gen 5 throughput. The desktop socket and higher TDP ceiling suggest it is intended for installations with robust thermal solutions and less stringent power constraints.

The AMD Ryzen Embedded 8845HS wins in power-constrained and compact deployments. Its 45 W TDP is less than half that of the 9900X3D, making it suitable for fanless or passively cooled enclosures, ruggedized mobile systems, and edge computing nodes where heat dissipation is limited. The mobile socket FP8 and monolithic die design align with smaller motherboard footprints.

The 8845HS still delivers adequate multi-threading with 8 cores and 16 threads, and its 5.10 GHz boost clock is respectable for single-threaded responsiveness. The integrated Radeon 780M provides a more specific graphics solution than the generic Radeon Graphics on the 9900X3D, which may reduce the need for a discrete GPU in display-output-only embedded roles. Its earlier release date also means it has been available in the ecosystem for a longer period.

The Verdict

The data indicates a clear split by deployment scenario. The AMD Ryzen Embedded 9900X3D is the stronger processor for compute-intensive, multi-threaded workloads that can use 12 cores, 24 threads, higher clock speeds, and 128 MB of L3 cache. It also offers the newer PCIe Gen 5 standard and an unlocked multiplier, which are meaningful for performance-oriented embedded servers and workstation-class systems. The 120 W TDP and desktop socket imply a design that expects active cooling and a larger chassis.

The AMD Ryzen Embedded 8845HS is the appropriate selection for power-sensitive, space-constrained embedded applications. Its 45 W TDP, mobile socket, and monolithic 178 mm² die make it practical for compact industrial PCs, edge gateways, and portable instrumentation. The 8-core, 16-thread configuration with a 5.10 GHz boost is sufficient for moderate multi-threading and responsive single-threaded execution. Both processors share DDR5 dual-channel memory, ECC support, and 89.6 GB/s bandwidth, so memory subsystem performance is not a differentiator.

Given the identical percentile standing of 50 and the absence of direct benchmark measurements in the database, the verdict rests on the specification deltas. The 9900X3D is the performance leader by core count, clock speed, cache size, and PCIe capability. The 8845HS is the efficiency leader by TDP, form factor suitability, and earlier availability. Buyers should select the 9900X3D for maximum throughput and the 8845HS for low-power embedded integration.