AMD Ryzen AI Max+ PRO 495 vs Intel Processor N250 Comparison

AMD
AMD

AMD Ryzen AI Max+ PRO 495

CORE STATE Gorgon Halo
CORE SPECS 16 Cores / 32 Threads
CLOCK SPEED 3.1 Base / 5.2 GHz Turbo
CACHE 64 MB
MAX TDP 55W
ARCHITECTURE Gorgon Halo
nm
PROCESS 4 nm
LAUNCH DATE 2026
VS
Intel
INTEL

Processor N250

CORE STATE Twin Lake
CORE SPECS 4 Cores / 4 Threads
CLOCK SPEED 0.1 Base / 3.8 GHz Turbo
CACHE 6 MB (shared)
MAX TDP 6W
ARCHITECTURE Twin Lake
nm
PROCESS 10 nm
LAUNCH DATE 2025

Analysis: AMD Ryzen AI Max+ PRO 495 vs Intel Processor N250

Head-to-Head Benchmarks

The database contains no direct head-to-head benchmark scores for the AMD Ryzen AI Max+ PRO 495 against the Intel Processor N250. There are no recorded wins for either part in this comparison, and no average benchmark scores are listed for either CPU. The percentile ranking for both processors is identical at 50, which places them at the midpoint of all CPUs tracked in the database, but this is a general placement rather than a measure of relative performance between the two.

Without measured benchmark deltas, the comparison relies entirely on the specification data. The raw resource disparity is substantial. The AMD part provides 16 cores and 32 threads, while the Intel part provides 4 cores and 4 threads. That is a 4x difference in core count and an 8x difference in thread count. The AMD boost clock reaches 5.20 GHz, while the Intel boost clock tops out at 3.80 GHz. The AMD base clock is 3.10 GHz, which is notably higher than the Intel base clock of 0.10 GHz, an unusually low idle-oriented figure.

Cache allocation tells a similar story. The AMD processor carries 64 MB of L3 cache, while the Intel processor carries 6 MB of shared L3. The L2 configuration differs as well: the AMD part uses 1 MB per core, while the Intel part uses 2 MB shared across all cores. The L1 cache is 80 KB per core on the AMD side and 96 KB per core on the Intel side, a minor point in favor of Intel per core, but the aggregate cache capacity is overwhelmingly in AMD's favor.

Memory bandwidth is another area of massive separation. The AMD platform supports quad-channel LPDDR5X with 273.1 GB/s of bandwidth. The Intel platform supports single-channel DDR4, DDR5, and LPDDR5 with 38.4 GB/s. The AMD part offers roughly 7.1 times the memory bandwidth of the Intel part, which directly impacts any workload that streams data through the CPU.

Where Each One Wins

The AMD Ryzen AI Max+ PRO 495 wins in every throughput-oriented category that the database records. Multi-threaded workloads benefit from the 32 threads, the 5.20 GHz boost clock, and the 64 MB L3 cache. The quad-channel memory bus at 273.1 GB/s gives it a clear advantage in memory-bound tasks such as large dataset manipulation, compilation, rendering, and any workload that moves substantial data between DRAM and compute units. The integrated Radeon 8065S graphics also position it for graphics and compute tasks that the Intel UHD Graphics 730 cannot approach, though no benchmark scores are recorded to quantify that gap.

The Intel Processor N250 wins in power efficiency and platform simplicity. Its 6 W TDP is drastically lower than the 55 W TDP of the AMD part, which makes it suitable for passively cooled or fanless designs where heat output and battery life matter more than raw throughput. The single-channel memory configuration and 38.4 GB/s bandwidth are sufficient for lightweight productivity, web browsing, and media playback. The 0.10 GHz base clock suggests an aggressive low-power idle state, which aligns with always-on or battery-constrained devices.

For single-threaded responsiveness, the Intel boost clock of 3.80 GHz is respectable, but the AMD boost clock of 5.20 GHz is higher. The database does not include single-thread benchmark scores for either part, so no definitive claim can be made beyond the clock figures. The AMD part also supports ECC memory, which the Intel part does not, giving it an edge in reliability-sensitive environments.

Architecture Differences

The AMD Ryzen AI Max+ PRO 495 uses the Gorgon Halo codename and belongs to the Ryzen AI Max+ PRO generation built on Zen 5. It is manufactured by TSMC on a 4 nm process. The die is composed of two 70.6 mm² chiplets. It uses the AMD Socket FP11 and supports LPDDR5X memory in a quad-channel configuration. PCIe support is Gen 4 with 16 lanes from the CPU. The integrated graphics are Radeon 8065S. The part number is 100-000002124.

The Intel Processor N250 uses the Twin Lake architecture and codename, and it belongs to the Intel Processor generation, which the database associates with Alder Lake-N. It is manufactured by Intel on a 10 nm process. It uses the Intel BGA 1264 socket and supports DDR4, DDR5, and LPDDR5 memory, but only in a single-channel configuration. PCIe support is Gen 3 with 9 lanes from the CPU. The integrated graphics are UHD Graphics 730. The part number is SRPNS.

The process node gap is significant: 4 nm versus 10 nm. That difference contributes to the transistor density and power characteristics, though the database does not list transistor counts for either part. The AMD part uses a chiplet design with two dies, while the Intel part uses a monolithic design, indicated by the absence of a die size listing for Intel. The AMD part supports ECC memory; the Intel part does not. Neither processor has an unlocked multiplier, so overclocking is not an option on either platform.

The memory controller differences are substantial. AMD uses quad-channel LPDDR5X with 273.1 GB/s. Intel uses single-channel DDR4, DDR5, or LPDDR5 with 38.4 GB/s. The AMD platform also has 16 PCIe Gen 4 lanes versus 9 PCIe Gen 3 lanes on the Intel platform. The cache hierarchy differs in organization: AMD uses per-core L1 and L2 with a shared 64 MB L3, while Intel uses per-core L1 with a shared 2 MB L2 and a shared 6 MB L3.

FAQ

Q: Which processor has more cores and threads?

A: The AMD Ryzen AI Max+ PRO 495 has 16 cores and 32 threads. The Intel Processor N250 has 4 cores and 4 threads. The AMD part provides 4 times the core count and 8 times the thread count.

Q: What are the boost clock speeds?

A: The AMD Ryzen AI Max+ PRO 495 boosts to 5.20 GHz. The Intel Processor N250 boosts to 3.80 GHz. The AMD part also has a base clock of 3.10 GHz, while the Intel part has a base clock of 0.10 GHz.

Q: How do the cache sizes compare?

A: The AMD part has 80 KB of L1 per core, 1 MB of L2 per core, and 64 MB of shared L3. The Intel part has 96 KB of L1 per core, 2 MB of shared L2, and 6 MB of shared L3. The AMD L3 cache is more than 10 times larger.

Q: Which processor supports ECC memory?

A: The AMD Ryzen AI Max+ PRO 495 supports ECC memory. The Intel Processor N250 does not list ECC support in the database.

Q: What memory types are supported?

A: The AMD part supports LPDDR5X in a quad-channel configuration with 273.1 GB/s of bandwidth. The Intel part supports DDR4, DDR5, and LPDDR5 in a single-channel configuration with 38.4 GB/s of bandwidth.

Q: What are the TDP ratings?

A: The AMD Ryzen AI Max+ PRO 495 has a 55 W TDP. The Intel Processor N250 has a 6 W TDP. The Intel part consumes substantially less power.

The Verdict

The AMD Ryzen AI Max+ PRO 495 is the clear choice for compute-heavy mobile workloads. The 16 cores, 32 threads, 5.20 GHz boost clock, 64 MB L3 cache, and 273.1 GB/s memory bandwidth position it as a high-end mobile processor for tasks that demand parallel throughput and fast data movement. The 55 W TDP reflects that performance target. ECC memory support adds reliability for data-integrity-sensitive use cases. The Radeon 8065S integrated graphics provide a capable graphics solution without a discrete GPU.

The Intel Processor N250 is the choice for low-power, basic computing. The 6 W TDP and 0.10 GHz base clock indicate a design focused on minimal power draw. The 4 cores and 4 threads handle light workloads, and the 3.80 GHz boost clock provides acceptable responsiveness when needed. The single-channel memory and 38.4 GB/s bandwidth are adequate for simple tasks. The UHD Graphics 730 covers basic display output and media playback.

The database records no head-to-head benchmark scores, so the verdict rests on the specification sheet. The performance gulf between the two is wide, but so is the power gulf. Each processor serves a different market segment: the AMD part targets performance-oriented mobile systems, while the Intel part targets efficiency-oriented devices where power consumption is the primary constraint.

Specification Differences

| Specification | AMD Ryzen AI Max+ PRO 495 | Intel Processor N250 |

|----------------|---------------------------|----------------------|

| Cores | 16 | 4 |

| Threads | 32 | 4 |

| Base Clock | 3.10 GHz | 0.10 GHz |

| Boost Clock | 5.20 GHz | 3.80 GHz |

| TDP | 55 W | 6 W |

| Socket | AMD Socket FP11 | Intel BGA 1264 |

| Codename | Gorgon Halo | Twin Lake |

| Generation | Ryzen AI Max+ PRO (Zen 5) | Intel Processor (Alder Lake-N) |

| Process Node | 4 nm | 10 nm |

| Foundry | TSMC | Intel |

| Die Size | 2x 70.6 mm² | Not listed |

| L1 Cache | 80 KB (per core) | 96 KB (per core) |

| L2 Cache | 1 MB (per core) | 2 MB (shared) |

| L3 Cache | 64 MB | 6 MB (shared) |

| Memory Support | LPDDR5X | DDR4, DDR5, LPDDR5 |

| Memory Bus | Quad-channel | Single-channel |

| Memory Bandwidth | 273.1 GB/s | 38.4 GB/s |

| ECC Memory | Yes | No |

| PCIe | Gen 4, 16 Lanes (CPU only) | Gen 3, 9 Lanes (CPU only) |

| Integrated Graphics | Radeon 8065S | UHD Graphics 730 |

| Release Date | 2026-05-19 | 2025-01-06 |

| Multiplier Unlocked | No | No |

| Part Number | 100-000002124 | SRPNS |

DETAILED SPECIFICATIONS

SPECIFICATION
AI Max+ PRO 495
Processor N250
Core Specs
Cores
16
4 -75.0%
Threads
32
4 -87.5%
Base Clock (GHz)
3.1
0.1 -96.8%
Boost Clock (GHz)
5.2
3.8 -26.9%
Frequency (GHz)
3.1
0.1 -96.8%
Turbo Clock (GHz)
5.2
3.8 -26.9%
Multiplier
31
1 -96.8%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
80 KB (per core)
96 KB (per core)
L2 Cache
1 MB (per core)
2 MB (shared)
L3 Cache
64 MB
6 MB (shared)
Power
TDP (W)
55
6 -89.1%
Configurable TDP
45-120 W
Architecture
Architecture
Twin Lake
Codename
Gorgon Halo
Twin Lake
Generation
Ryzen AI Max+ PRO (Zen 5)
Intel Processor (Alder Lake-N)
Process Size
4 nm
10 nm
Die Size
2x 70.6 mm²
Foundry
TSMC
Intel
Memory
Memory Support
LPDDR5X
DDR4, DDR5, LPDDR5
Memory Bus
Quad-channel
Single-channel
Memory Bandwidth
273.1 GB/s
38.4 GB/s
ECC Memory
Yes
No
DDR4 Speed
3200 MT/s
Platform
Socket
AMD Socket FP11
Intel BGA 1264
PCIe
Gen 4, 16 Lanes(CPU only)
Gen 3, 9 Lanes(CPU only)
AI/NPU
NPU
Yes / 55 TOPS
Graphics
Integrated Graphics
Radeon 8065S
UHD Graphics 730
Other
Market
Mobile
Mobile
Production Status
Active
Active
Part Number
100-000002124
SRPNS
Package
FC-BGA
FC-BGA16F
Tj Max
100°C
105°C
View Ryzen AI Max+ PRO 495 Details View Processor N250 Details