AMD Ryzen AI Max+ PRO 495 vs Intel Processor 300T Comparison

AMD
AMD

AMD Ryzen AI Max+ PRO 495

CORE STATE Gorgon Halo
CORE SPECS 16 Cores / 32 Threads
CLOCK SPEED 3.1 Base / 5.2 GHz Turbo
CACHE 64 MB
MAX TDP 55W
ARCHITECTURE Gorgon Halo
nm
PROCESS 4 nm
LAUNCH DATE 2026
VS
Intel
INTEL

Processor 300T

CORE STATE Raptor Lake-S
CORE SPECS 2 Cores / 4 Threads
CLOCK SPEED 3.4 Base
CACHE 6 MB (shared)
MAX TDP 35W
ARCHITECTURE Raptor Lake
nm
PROCESS 10 nm
LAUNCH DATE 2024

Analysis: AMD Ryzen AI Max+ PRO 495 vs Intel Processor 300T

FAQ

Q: What are the core and thread counts for the AMD Ryzen AI Max+ PRO 495 and the Intel Processor 300T?

A: The AMD Ryzen AI Max+ PRO 495 has 16 cores and 32 threads. The Intel Processor 300T has 2 cores and 4 threads.

Q: What are the base clock speeds of the two processors?

A: The AMD Ryzen AI Max+ PRO 495 has a base clock of 3.10 GHz. The Intel Processor 300T has a base clock of 3.40 GHz.

Q: Which processor has a higher boost clock?

A: The AMD Ryzen AI Max+ PRO 495 has a boost clock of 5.20 GHz, while the Intel Processor 300T has no listed boost clock.

Q: What are the process nodes used by each processor?

A: The AMD Ryzen AI Max+ PRO 495 uses a 4 nm process node from TSMC. The Intel Processor 300T uses a 10 nm process node from Intel.

Q: What memory types do the two processors support?

A: The AMD Ryzen AI Max+ PRO 495 supports LPDDR5X memory. The Intel Processor 300T supports DDR4 and DDR5 memory.

Q: Do both processors support ECC memory?

A: The AMD Ryzen AI Max+ PRO 495 supports ECC memory. The Intel Processor 300T does not support ECC memory.

Where Each One Wins

The AMD Ryzen AI Max+ PRO 495 and the Intel Processor 300T occupy distinct positions in the market. The AMD part is a mobile processor with a 16-core, 32-thread configuration, which gives it a massive parallel workload advantage. It is built for heavily threaded applications, content creation, and any scenario where multiple cores can be utilized simultaneously. The Intel Processor 300T is a desktop part with 2 cores and 4 threads, which places it in a different performance class entirely.

The Intel Processor 300T wins on base clock speed. It runs at 3.40 GHz compared to the AMD's 3.10 GHz. This higher base clock can benefit lightly threaded tasks where single-core performance is the bottleneck. However, the Intel part lacks a boost clock, so its maximum frequency is effectively its base clock. The AMD part can boost up to 5.20 GHz, which is a substantial advantage in burst workloads.

The Intel Processor 300T also has a lower TDP at 35 W compared to the AMD's 55 W. This makes the Intel part more power-efficient in absolute terms, which could matter for systems with strict thermal or power budgets. The AMD part, despite its higher TDP, uses a much smaller process node at 4 nm versus Intel's 10 nm, which indicates a more advanced manufacturing technology.

The AMD Ryzen AI Max+ PRO 495 has a significant cache advantage. It features 64 MB of L3 cache, while the Intel Processor 300T has only 6 MB of shared L3 cache. The AMD part also has a larger die area with 2x 70.6 mm², suggesting a more complex design with more integrated components.

Architecture Differences

The AMD Ryzen AI Max+ PRO 495 is based on the Zen 5 architecture under the codename Gorgon Halo. It uses a 4 nm process node fabricated by TSMC. The processor has 16 cores and 32 threads, with a die size of 2x 70.6 mm². Its cache hierarchy includes 80 KB of L1 cache per core, 1 MB of L2 cache per core, and 64 MB of L3 cache. The memory subsystem uses LPDDR5X with a quad-channel bus, delivering a memory bandwidth of 273.1 GB/s. It supports ECC memory and uses PCIe Gen 4 with 16 lanes for the CPU.

The Intel Processor 300T is based on the Raptor Lake architecture with the codename Raptor Lake-S. It uses a 10 nm process node fabricated by Intel. The processor has 2 cores and 4 threads, with a die size of 163 mm². Its cache hierarchy includes 80 KB of L1 cache per core, 1.25 MB of L2 cache per core, and 6 MB of shared L3 cache. The memory subsystem supports both DDR4 and DDR5 with a dual-channel bus. It does not support ECC memory and uses PCIe Gen 5 with 16 lanes for the CPU.

The architectural differences are substantial. The AMD part uses a chiplet design with two dies, each measuring 70.6 mm², while the Intel part uses a monolithic die at 163 mm². The AMD design integrates a more advanced memory controller with quad-channel LPDDR5X support, while the Intel part uses a simpler dual-channel design that supports both DDR4 and DDR5. The PCIe generation also differs, with Intel offering Gen 5 and AMD offering Gen 4.

The integrated graphics differ as well. The AMD Ryzen AI Max+ PRO 495 includes a Radeon 8065S GPU, while the Intel Processor 300T includes UHD Graphics 710. This indicates the AMD part is designed for more demanding graphics workloads, while the Intel part is suited for basic display output.

Specification Differences

| Specification | AMD Ryzen AI Max+ PRO 495 | Intel Processor 300T |

|----------------|---------------------------|----------------------|

| Cores | 16 | 2 |

| Threads | 32 | 4 |

| Base Clock | 3.10 GHz | 3.40 GHz |

| Boost Clock | 5.20 GHz | None |

| TDP | 55 W | 35 W |

| Socket | AMD Socket FP11 | Intel Socket 1700 |

| Codename | Gorgon Halo | Raptor Lake-S |

| Generation | Ryzen AI Max+ PRO (Zen 5) | Intel Processor (Raptor Lake) |

| Process Node | 4 nm | 10 nm |

| Foundry | TSMC | Intel |

| Die Size | 2x 70.6 mm² | 163 mm² |

| L2 Cache | 1 MB (per core) | 1.25 MB (per core) |

| L3 Cache | 64 MB | 6 MB (shared) |

| Memory Support | LPDDR5X | DDR4, DDR5 |

| Memory Bus | Quad-channel | Dual-channel |

| Memory Bandwidth | 273.1 GB/s | None |

| ECC Memory | Yes | No |

| PCIe | Gen 4, 16 Lanes (CPU only) | Gen 5, 16 Lanes (CPU only) |

| Integrated Graphics | Radeon 8065S | UHD Graphics 710 |

| Market Segment | Mobile | Desktop |

| Release Date | 2026-05-19 | 2024-01-07 |

| Launch MSRP | None | $82 |

The AMD part has a significantly higher core and thread count, larger L3 cache, higher memory bandwidth, and a more advanced process node. The Intel part has a higher base clock, lower TDP, and newer PCIe generation.

Head-to-Head Benchmarks

The recorded benchmark data shows no direct head-to-head benchmark results between the AMD Ryzen AI Max+ PRO 495 and the Intel Processor 300T. The database lists zero wins for each processor in direct comparisons, and the benchmark arrays are empty for both parts. The percentile versus all CPUs is identical at 50 for both processors, indicating they sit at the median of the database's recorded CPUs.

Despite the lack of direct benchmark scores, the specification data provides a clear picture of relative performance. The AMD Ryzen AI Max+ PRO 495 has 8 times the core count and 8 times the thread count of the Intel Processor 300T. In heavily threaded workloads, this core advantage translates into a massive performance delta. The AMD part also has more than 10 times the L3 cache, which improves performance in workloads that benefit from large data sets being held on-chip.

The Intel Processor 300T has a base clock advantage of 0.30 GHz, which is approximately 9.7% higher than the AMD part's base clock. This can provide a small lead in single-threaded tasks that do not scale with core count. However, the AMD part's boost clock of 5.20 GHz is substantially higher than the Intel part's fixed 3.40 GHz, which means the AMD processor can reach much higher frequencies during burst workloads.

The memory subsystem differences are also significant. The AMD Ryzen AI Max+ PRO 495 offers 273.1 GB/s of memory bandwidth through its quad-channel LPDDR5X interface. The Intel Processor 300T has no listed memory bandwidth figure, but its dual-channel DDR4/DDR5 interface will provide considerably lower bandwidth. This affects the AMD part's performance in memory-intensive applications such as data compression, scientific computing, and large database operations.

The process node difference is another factor. The AMD part uses a 4 nm process from TSMC, while the Intel part uses a 10 nm process from Intel. This smaller node allows the AMD processor to pack more transistors into a smaller area, which contributes to its higher core count and larger cache while maintaining a reasonable TDP. The Intel part's larger 163 mm² die with only 2 cores indicates a less dense design.

The Intel Processor 300T has a lower TDP of 35 W, which makes it suitable for compact desktop systems with limited cooling. The AMD Ryzen AI Max+ PRO 495 has a TDP of 55 W, but it also targets the mobile segment, where power management is more dynamic. The AMD part's release date of 2026-05-19 is later than the Intel part's 2024-01-07, reflecting the more recent design.

The launch MSRP for the Intel Processor 300T is $82. The AMD Ryzen AI Max+ PRO 495 has no listed launch MSRP. The Intel part also uses a different socket, Intel Socket 1700, compared to the AMD Socket FP11, which means they are not interchangeable in any system.

DETAILED SPECIFICATIONS

SPECIFICATION
AI Max+ PRO 495
Processor 300T
Core Specs
Cores
16
2 -87.5%
Threads
32
4 -87.5%
Base Clock (GHz)
3.1
3.4 +9.7%
Boost Clock (GHz)
5.2
Frequency (GHz)
3.1
3.4 +9.7%
Turbo Clock (GHz)
5.2
Multiplier
31
34 +9.7%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
80 KB (per core)
80 KB (per core)
L2 Cache
1 MB (per core)
1.25 MB (per core)
L3 Cache
64 MB
6 MB (shared)
Power
TDP (W)
55
35 -36.4%
PL1
35 W
PL2
35 W
Configurable TDP
45-120 W
Architecture
Architecture
Raptor Lake
Codename
Gorgon Halo
Raptor Lake-S
Generation
Ryzen AI Max+ PRO (Zen 5)
Intel Processor (Raptor Lake)
Process Size
4 nm
10 nm
Die Size
2x 70.6 mm²
163 mm²
Foundry
TSMC
Intel
Memory
Memory Support
LPDDR5X
DDR4, DDR5
Memory Bus
Quad-channel
Dual-channel
Memory Bandwidth
273.1 GB/s
ECC Memory
Yes
No
DDR4 Speed
3200 MT/s
DDR5 Speed
4800 MT/s
Platform
Socket
AMD Socket FP11
Intel Socket 1700
Chipsets
Intel 600 Series, Intel 700 Series
PCIe
Gen 4, 16 Lanes(CPU only)
Gen 5, 16 Lanes(CPU only)
AI/NPU
NPU
Yes / 55 TOPS
Graphics
Integrated Graphics
Radeon 8065S
UHD Graphics 710
Other
Market
Mobile
Desktop
Production Status
Active
Active
Launch Price
$82
Part Number
100-000002124
SRN3K
Package
FC-BGA
FC-LGA16A
Tj Max
100°C
100°C
View Ryzen AI Max+ PRO 495 Details View Processor 300T Details