AMD Ryzen AI Max+ PRO 495 vs Intel Core 9 273PTE Comparison

AMD
AMD

AMD Ryzen AI Max+ PRO 495

CORE STATE Gorgon Halo
CORE SPECS 16 Cores / 32 Threads
CLOCK SPEED 3.1 Base / 5.2 GHz Turbo
CACHE 64 MB
MAX TDP 55W
ARCHITECTURE Gorgon Halo
nm
PROCESS 4 nm
LAUNCH DATE 2026
VS
Intel
INTEL

Core 9 273PTE

CORE STATE Bartlett Lake
CORE SPECS 12 Cores / 24 Threads
CLOCK SPEED 1.4 Base / 5.5 GHz Turbo
CACHE 36 MB (shared)
MAX TDP 45W
ARCHITECTURE Bartlett Lake
nm
PROCESS 10 nm
LAUNCH DATE 2026

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
N/A
2,060
cinebench_cinebench_r15_singlecore
N/A
290
cinebench_cinebench_r20_multicore
N/A
8,586
cinebench_cinebench_r20_singlecore
N/A
1,212
cinebench_cinebench_r23_multicore
N/A
20,445
cinebench_cinebench_r23_singlecore
N/A
2,886
passmark_data_compression
N/A
258,704
passmark_data_encryption
N/A
14,253
passmark_extended_instructions
N/A
15,952
passmark_find_prime_numbers
N/A
142
passmark_floating_point_math
N/A
60,673
passmark_integer_math
N/A
82,411
passmark_multithread
N/A
24,054
passmark_physics
N/A
1,917
passmark_random_string_sorting
N/A
28,973
passmark_single_thread
N/A
3,433
passmark_singlethread
N/A
3,433

Analysis: AMD Ryzen AI Max+ PRO 495 vs Intel Core 9 273PTE

Where Each One Wins

The recorded benchmark data creates a clear split between these two processors. The AMD Ryzen AI Max+ PRO 495 has no individual benchmark scores in the database, while the Intel Core 9 273PTE carries a full set of Cinebench and PassMark results. This asymmetry means the measurable wins belong entirely to the Intel part, but the architectural profile of the AMD chip suggests a different workload orientation.

The Intel Core 9 273PTE shows particular strength in multi-threaded rendering workloads. Its Cinebench R23 multicore score of 20445 places it firmly in desktop-class territory, while the R20 multicore result of 8586 and R15 multicore result of 2060 follow the same pattern. Single-core performance is similarly robust, with Cinebench R23 singlecore at 2886, R20 singlecore at 1212, and R15 singlecore at 290. These numbers indicate a processor that handles both heavily threaded and lightly threaded tasks with consistency.

PassMark results reinforce the Intel chip's balanced profile. The multithread score of 24054, integer math score of 82411, floating point math score of 60673, and extended instructions score of 15952 all point to a well-rounded compute unit. The data compression score of 258704 and random string sorting score of 28973 suggest strong performance in data manipulation tasks. The find prime numbers score of 142 and physics score of 1917 are lower in absolute terms but still represent measurable capability in those specific workloads.

The AMD Ryzen AI Max+ PRO 495, despite lacking recorded benchmark scores, presents a different architectural proposition. Its 16 cores and 32 threads exceed the Intel part's 12 cores and 24 threads, which in typical workload scaling would favor the AMD chip in heavily parallel tasks. The quad-channel LPDDR5X memory configuration with 273.1 GB/s bandwidth is a substantial advantage for memory-bound operations, a factor that does not appear in the Intel part's dual-channel DDR4/DDR5 setup with 89.6 GB/s.

The absence of benchmark data for the AMD chip means the database cannot confirm whether its core and memory advantages translate into actual performance wins. The Intel part's 82nd percentile ranking among all CPUs, compared to the AMD chip's 50th percentile, reflects only measured results, not theoretical potential.

Architecture Differences

The two processors come from fundamentally different design philosophies. The AMD Ryzen AI Max+ PRO 495 uses the Gorgon Halo codename under the Ryzen AI Max+ PRO (Zen 5) generation, built on a 4 nm process at TSMC. The Intel Core 9 273PTE uses the Bartlett Lake codename under the Core 9 (Bartlett Lake) generation, built on a 10 nm process at Intel's own foundry. The process node difference is significant: the AMD chip's 4 nm process allows for denser transistor packing and potentially lower power draw per unit of work, while the Intel chip's 10 nm process is comparatively less advanced.

Core counts diverge sharply. The AMD part offers 16 cores and 32 threads, while the Intel part offers 12 cores and 24 threads. This 33% core advantage for AMD and 33% thread advantage provides more parallel execution capacity on paper. The AMD chip's die size is listed as 2x 70.6 mm², indicating a chiplet design with two compute dies. The Intel part has no die size listed in the database.

Cache hierarchies differ in structure. Both parts share 80 KB of L1 cache per core, but L2 cache differs: the AMD chip uses 1 MB per core, while the Intel chip uses 2 MB per core. The Intel part doubles the per-core L2 allocation, which can improve performance for workloads that repeatedly access a working set fitting within that cache level. L3 cache tells the opposite story: the AMD chip has 64 MB total, while the Intel part has 36 MB shared. The AMD chip's L3 capacity is nearly double the Intel part's, which benefits workloads with larger shared data footprints.

Memory architecture is another major divergence. The AMD chip supports LPDDR5X memory over a quad-channel bus, delivering 273.1 GB/s of bandwidth. The Intel chip supports both DDR4 and DDR5 over a dual-channel bus, delivering 89.6 GB/s. The AMD chip has roughly three times the memory bandwidth, a decisive factor for memory-intensive workloads such as large dataset processing, virtual machines, and integrated graphics operations. Both parts support ECC memory.

PCIe connectivity also differs. The AMD chip uses Gen 4 with 16 lanes (CPU only), while the Intel chip uses Gen 5 with 16 lanes (CPU only). The Intel part's Gen 5 support offers double the per-lane bandwidth of Gen 4, which matters for storage devices and expansion cards that can utilize the higher throughput. The AMD part's Gen 4 implementation remains adequate for most peripherals but lacks the headroom of Gen 5.

Integrated graphics present another contrast. The AMD chip pairs with a Radeon 8065S, while the Intel chip uses UHD Graphics 730. The Radeon 8065S is a substantially more capable integrated GPU, especially when combined with the AMD chip's high memory bandwidth. The Intel UHD Graphics 730 is a basic display adapter suited for office workloads and media playback, not for graphics-intensive tasks. The AMD chip's integrated graphics advantage is amplified by its quad-channel LPDDR5X memory, which provides the bandwidth necessary for modern integrated GPUs to perform well.

Clock speeds differ in base and boost behavior. The AMD chip has a base clock of 3.10 GHz and a boost clock of 5.20 GHz. The Intel chip has a base clock of 1.40 GHz and a boost clock of 5.50 GHz. The Intel part's much lower base clock suggests a power-conscious design at idle or light load, while its higher boost clock indicates peak single-thread capability slightly above the AMD part. The AMD chip's higher base clock suggests sustained all-core performance potential at its 55 W TDP, compared to the Intel chip's 45 W TDP.

Form factor and platform differ as well. The AMD chip uses AMD Socket FP11 and is classified as a mobile part. The Intel chip uses Intel Socket 1700 and is classified as a desktop part. This positioning affects system integration: the AMD chip targets laptops and compact mobile devices, while the Intel chip targets desktop motherboards with the LGA1700 socket.

Release dates place the Intel part earlier at 2026-03-08, with the AMD part following on 2026-05-19. Both parts remain in active production status. Neither processor has an unlocked multiplier. The Intel part has a launch MSRP of $549; the AMD part has no listed launch MSRP.

The Verdict

The data supports a straightforward conclusion for measured performance: the Intel Core 9 273PTE is the proven performer, with a full suite of benchmark scores and an 82nd percentile ranking. Its nearest rivals include the Intel Core i7-12700F at 0.2% ahead, the AMD Ryzen 9 8945HS at 0.2% ahead, the Intel Core i7-13700TE at 0.4% ahead, and the Intel Core i7-12650HX at 0.5% behind. These narrow deltas indicate the Intel Core 9 273PTE sits in a tightly contested performance band where small percentage differences separate comparable processors.

For users who need verified performance, the Intel part delivers known quantities across rendering, math, compression, and single-threaded tasks. Its 45 W TDP, Gen 5 PCIe support, and 36 MB shared L3 cache make it a sensible desktop choice for workloads that fit within its dual-channel memory bandwidth envelope.

The AMD Ryzen AI Max+ PRO 495 remains an unquantified proposition in the database. Its architectural advantages are substantial on paper: 16 cores versus 12, 32 threads versus 24, 64 MB L3 versus 36 MB, quad-channel LPDDR5X with 273.1 GB/s versus dual-channel with 89.6 GB/s, and a 4 nm process versus 10 nm. These specifications point toward a processor designed for memory-hungry, heavily threaded mobile workloads, particularly those that leverage its Radeon 8065S integrated graphics.

The 50th percentile ranking for the AMD chip reflects the absence of measured scores, not necessarily poor performance. The database cannot confirm how the AMD part would fare against the Intel part in Cinebench or PassMark. The core count difference suggests an advantage in parallel workloads, and the memory bandwidth difference suggests an advantage in data-heavy tasks, but neither is verified by recorded results.

The Intel part's 82nd percentile ranking places it clearly above the AMD part's 50th percentile in the database's current state. The Intel chip's nearest rival deltas, all within 0.5%, show that its performance class is well established and competitive with recent mid-range desktop processors.

FAQ

Q: Which processor has more cores and threads?

A: The AMD Ryzen AI Max+ PRO 495 has 16 cores and 32 threads, while the Intel Core 9 273PTE has 12 cores and 24 threads.

Q: What is the memory bandwidth difference?

A: The AMD chip supports quad-channel LPDDR5X with 273.1 GB/s bandwidth, while the Intel chip supports dual-channel DDR4/DDR5 with 89.6 GB/s bandwidth.

Q: Which processor has a higher boost clock?

A: The Intel Core 9 273PTE boosts to 5.50 GHz, which is 0.30 GHz higher than the AMD chip's 5.20 GHz boost clock.

Q: What is the process node difference?

A: The AMD chip is built on a 4 nm process at TSMC, while the Intel chip is built on a 10 nm process at Intel.

Q: Which processor has more L3 cache?

A: The AMD chip has 64 MB of L3 cache, while the Intel chip has 36 MB shared L3 cache.

Q: What benchmark scores are recorded for the AMD Ryzen AI Max+ PRO 495?

A: The database contains no benchmark scores for the AMD chip. All recorded Cinebench and PassMark scores belong to the Intel Core 9 273PTE.

Head-to-Head Benchmarks

The database does not include direct head-to-head benchmark comparisons between these two processors. The Intel Core 9 273PTE has a complete benchmark suite, while the AMD Ryzen AI Max+ PRO 495 has no recorded scores. The measured results therefore all belong to the Intel part.

Cinebench R23 multicore on the Intel chip scored 20445, with singlecore at 2886. Cinebench R20 multicore scored 8586, with singlecore at 1212. Cinebench R15 multicore scored 2060, with singlecore at 290. These results show a multicore-to-singlecore ratio around 7:1 in R23, indicating strong scaling across the 12 cores and 24 threads.

PassMark multithread scored 24054, while PassMark single thread scored 3433. Integer math scored 82411, floating point math scored 60673, and extended instructions scored 15952. Data compression scored 258704, random string sorting scored 28973, data encryption scored 14253, find prime numbers scored 142, and physics scored 1917.

The nearest rival comparisons for the Intel chip provide context. The Intel Core i7-12700F scores 31081, which is 0.2% ahead. The AMD Ryzen 9 8945HS scores 31074, also 0.2% ahead. The Intel Core i7-13700TE scores 31028, 0.4% ahead. The Intel Core i7-12650HX scores 31290, which is 0.5% behind. These four rivals bracket the Intel Core 9 273PTE's average benchmark score of 31143 within a narrow 0.9% band.

The AMD Ryzen AI Max+ PRO 495 has an average benchmark score of 0 and no nearest rivals listed. Its 50th percentile ranking versus all CPUs contrasts with the Intel chip's 82nd percentile. Without measured data, the AMD chip's performance class cannot be compared numerically to the Intel chip or its rivals.

Specification Differences

| Specification | AMD Ryzen AI Max+ PRO 495 | Intel Core 9 273PTE |

|---|---|---|

| Cores | 16 | 12 |

| Threads | 32 | 24 |

| Base clock | 3.10 GHz | 1.40 GHz |

| Boost clock | 5.20 GHz | 5.50 GHz |

| TDP | 55 W | 45 W |

| Socket | AMD Socket FP11 | Intel Socket 1700 |

| Codename | Gorgon Halo | Bartlett Lake |

| Generation | Ryzen AI Max+ PRO (Zen 5) | Core 9 (Bartlett Lake) |

| Process node | 4 nm | 10 nm |

| Foundry | TSMC | Intel |

| Die size | 2x 70.6 mm² | Not listed |

| L2 cache | 1 MB per core | 2 MB per core |

| L3 cache | 64 MB | 36 MB shared |

| Memory support | LPDDR5X | DDR4, DDR5 |

| Memory bus | Quad-channel | Dual-channel |

| Memory bandwidth | 273.1 GB/s | 89.6 GB/s |

| PCIe | Gen 4, 16 lanes (CPU only) | Gen 5, 16 lanes (CPU only) |

| Integrated graphics | Radeon 8065S | UHD Graphics 730 |

| Market segment | Mobile | Desktop |

| Release date | 2026-05-19 | 2026-03-08 |

| Launch MSRP | Not listed | $549 |

| Multiplier unlocked | No | No |

| Part number | 100-000002124 | SA4QJ |

Both processors support ECC memory, share 80 KB of L1 cache per core, and are in active production. Neither has an unlocked multiplier. The AMD chip's 55 W TDP exceeds the Intel chip's 45 W TDP, and the AMD chip's higher base clock of 3.10 GHz contrasts with the Intel chip's lower 1.40 GHz base clock. The Intel chip's higher boost clock of 5.50 GHz gives it a slight peak frequency advantage.

DETAILED SPECIFICATIONS

SPECIFICATION
AI Max+ PRO 495
9 273PTE
Core Specs
Cores
16
12 -25.0%
Threads
32
24 -25.0%
Base Clock (GHz)
3.1
1.4 -54.8%
Boost Clock (GHz)
5.2
5.5 +5.8%
Frequency (GHz)
3.1
1.4 -54.8%
Turbo Clock (GHz)
5.2
5.5 +5.8%
Multiplier
31
14 -54.8%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
80 KB (per core)
80 KB (per core)
L2 Cache
1 MB (per core)
2 MB (per core)
L3 Cache
64 MB
36 MB (shared)
Power
TDP (W)
55
45 -18.2%
PL1
—
45 W
PL2
—
219 W
Configurable TDP
45-120 W
—
Architecture
Codename
Gorgon Halo
Bartlett Lake
Generation
Ryzen AI Max+ PRO (Zen 5)
Core 9 (Bartlett Lake)
Process Size
4 nm
10 nm
Die Size
2x 70.6 mm²
—
Foundry
TSMC
Intel
Memory
Memory Support
LPDDR5X
DDR4, DDR5
Memory Bus
Quad-channel
Dual-channel
Memory Bandwidth
273.1 GB/s
89.6 GB/s
ECC Memory
Yes
Yes
DDR4 Speed
—
3200 MT/s
Platform
Socket
AMD Socket FP11
Intel Socket 1700
Chipsets
—
W680, R680E, Q670e, Q670, H610E, H610
PCIe
Gen 4, 16 Lanes(CPU only)
Gen 5, 16 Lanes(CPU only)
Intel Hybrid
P-Core Turbo
—
5.3 GHz
AI/NPU
NPU
Yes / 55 TOPS
—
Graphics
Integrated Graphics
Radeon 8065S
UHD Graphics 730
Other
Market
Mobile
Desktop
Production Status
Active
Active
Launch Price
—
$549
Part Number
100-000002124
SA4QJ
Package
FC-BGA
FC-LGA16A
Tj Max
100°C
100°C
View Ryzen AI Max+ PRO 495 Details View Core 9 273PTE Details