AMD Ryzen AI Max+ PRO 495 vs Intel Core 3 201TE Comparison

AMD
AMD

AMD Ryzen AI Max+ PRO 495

CORE STATE Gorgon Halo
CORE SPECS 16 Cores / 32 Threads
CLOCK SPEED 3.1 Base / 5.2 GHz Turbo
CACHE 64 MB
MAX TDP 55W
ARCHITECTURE Gorgon Halo
nm
PROCESS 4 nm
LAUNCH DATE 2026
VS
Intel
INTEL

Core 3 201TE

CORE STATE Bartlett Lake
CORE SPECS 4 Cores / 8 Threads
CLOCK SPEED 2.9 Base / 4.6 GHz Turbo
CACHE 12 MB (shared)
MAX TDP 45W
ARCHITECTURE Bartlett Lake
nm
PROCESS 10 nm
LAUNCH DATE 2025

Analysis: AMD Ryzen AI Max+ PRO 495 vs Intel Core 3 201TE

FAQ

Q: What are the core and thread counts of the AMD Ryzen AI Max+ PRO 495 and the Intel Core 3 201TE?

A: The AMD Ryzen AI Max+ PRO 495 has 16 cores and 32 threads. The Intel Core 3 201TE has 4 cores and 8 threads.

Q: Which processor has a higher boost clock speed?

A: The AMD Ryzen AI Max+ PRO 495 boosts up to 5.20 GHz, while the Intel Core 3 201TE reaches a maximum boost of 4.60 GHz.

Q: What type of memory does each processor support?

A: The AMD Ryzen AI Max+ PRO 495 supports LPDDR5X memory with a quad-channel bus. The Intel Core 3 201TE supports both DDR4 and DDR5 memory through a dual-channel bus.

Q: How much L3 cache does each processor have?

A: The AMD Ryzen AI Max+ PRO 495 has 64 MB of L3 cache. The Intel Core 3 201TE has 12 MB of shared L3 cache.

Q: Which processor uses a smaller manufacturing process node?

A: The AMD Ryzen AI Max+ PRO 495 uses a 4 nm process node from TSMC. The Intel Core 3 201TE uses a 10 nm process node from Intel.

Q: Do both processors support ECC memory?

A: Yes, both the AMD Ryzen AI Max+ PRO 495 and the Intel Core 3 201TE have ECC memory support enabled.

Architecture Differences

The AMD Ryzen AI Max+ PRO 495 and Intel Core 3 201TE represent fundamentally different design approaches. The AMD part uses the Gorgon Halo codename and belongs to the Ryzen AI Max+ PRO generation built on Zen 5 architecture. It is fabricated on a 4 nm process at TSMC. The Intel processor uses the Bartlett Lake codename, belongs to the Core 3 generation, and is built on a 10 nm process at Intel's own foundry.

The core layout differs sharply. AMD provides 16 physical cores with simultaneous multithreading, yielding 32 threads. Intel provides 4 physical cores with 8 threads. The AMD chip has a dual-die design with a die size of 2x 70.6 mm², while the Intel chip uses a single die measuring 163 mm².

Cache hierarchies also diverge. Both processors use 80 KB of L1 cache per core. The AMD processor has 1 MB of L2 cache per core, while the Intel processor has 1.25 MB per core. The L3 cache allocation is substantially different: AMD provides 64 MB, Intel provides 12 MB shared.

Memory architecture is another major split. The AMD processor uses LPDDR5X memory with a quad-channel bus, delivering 273.1 GB/s of memory bandwidth. The Intel processor supports both DDR4 and DDR5 memory through a dual-channel bus, providing 76.8 GB/s of memory bandwidth. Both support ECC.

PCIe connectivity differs as well. The AMD processor uses PCIe Gen 4 with 16 lanes from the CPU. The Intel processor uses PCIe Gen 5 with 16 lanes from the CPU.

Integrated graphics are present on both. AMD includes the Radeon 8065S, while Intel includes the UHD Graphics 730.

The socket and market segment diverge. AMD uses its Socket FP11 and targets the mobile segment. Intel uses Socket 1700 and targets the desktop segment. The AMD part has a 55 W TDP, the Intel part a 45 W TDP.

The release dates differ. The Intel Core 3 201TE was released on 2025-01-12, and the AMD Ryzen AI Max+ PRO 495 was released on 2026-05-19. The Intel part has a launch MSRP of $134. The AMD part has no listed launch MSRP.

Head-to-Head Benchmarks

The recorded data does not contain direct benchmark scores for either processor. The database shows an average benchmark score of 0 for both the AMD Ryzen AI Max+ PRO 495 and the Intel Core 3 201TE. There are no head-to-head benchmark entries, and neither processor has wins recorded in the comparison.

Without measured benchmark results, the analysis must rely on architectural and specification differences. The AMD processor has 4 times the core count and 4 times the thread count of the Intel processor. The AMD boost clock of 5.20 GHz is 0.60 GHz higher than the Intel boost clock of 4.60 GHz. The AMD base clock of 3.10 GHz is 0.20 GHz higher than the Intel base clock of 2.90 GHz.

The L3 cache difference is stark: 64 MB versus 12 MB. The memory bandwidth difference is also large: 273.1 GB/s versus 76.8 GB/s.

The manufacturing process gives AMD an advantage in density and efficiency potential. A 4 nm process versus a 10 nm process indicates a generational gap in transistor geometry. The AMD processor uses a smaller die area across two dies, suggesting a more complex but potentially more capable design.

The Intel processor has a higher per-core L2 cache allocation: 1.25 MB per core versus 1 MB per core. This could benefit workloads that rely on per-core cache locality.

PCIe generation differs. Intel supports PCIe Gen 5, which is newer than AMD's PCIe Gen 4. Both provide 16 lanes from the CPU. For storage or GPU connectivity, Intel's interface is newer, though the actual throughput depends on device support.

The memory type flexibility favors Intel. The Intel processor supports both DDR4 and DDR5, giving system builders more options for memory configuration. The AMD processor is limited to LPDDR5X, which is typically soldered or integrated on mobile platforms.

The market segments differ. AMD targets mobile with Socket FP11, while Intel targets desktop with Socket 1700. This affects cooling solutions, form factors, and upgrade paths.

The TDP values are close: 55 W for AMD versus 45 W for Intel. The AMD processor draws slightly more power, which aligns with its higher core count and clock speeds.

The production status for both processors is active. Both are multiplier-unlocked, but neither has an unlocked multiplier for overclocking.

The Verdict

The data indicates the AMD Ryzen AI Max+ PRO 495 is designed for high-core-count, high-bandwidth workloads in a mobile form factor. Its 16 cores, 32 threads, 64 MB L3 cache, and 273.1 GB/s memory bandwidth position it for parallel processing and memory-intensive tasks.

The Intel Core 3 201TE is a desktop processor with 4 cores and 8 threads, 12 MB L3 cache, and 76.8 GB/s memory bandwidth. It suits lighter workloads where per-core cache and newer PCIe generation matter.

For users selecting between these two, the choice depends on platform and workload. The AMD processor offers 4 times the core count and more than 3 times the memory bandwidth. The Intel processor offers a lower TDP, a desktop socket, and support for both DDR4 and DDR5 memory.

The database shows no benchmark results, so performance conclusions cannot be drawn from measured data. The architectural specifications provide a clear directional view. AMD leads in core count, thread count, cache capacity, memory bandwidth, and process node. Intel leads in per-core L2 cache and PCIe generation.

The launch MSRP of the Intel processor is $134. The AMD processor has no listed launch MSRP.

Specification Differences

The two processors differ across nearly every major specification field.

  • Cores: AMD 16, Intel 4
  • Threads: AMD 32, Intel 8
  • Base clock: AMD 3.10 GHz, Intel 2.90 GHz
  • Boost clock: AMD 5.20 GHz, Intel 4.60 GHz
  • TDP: AMD 55 W, Intel 45 W
  • Socket: AMD Socket FP11, Intel Socket 1700
  • Codename: AMD Gorgon Halo, Intel Bartlett Lake
  • Generation: AMD Ryzen AI Max+ PRO (Zen 5), Intel Core 3 (Bartlett Lake)
  • Process node: AMD 4 nm, Intel 10 nm
  • Foundry: AMD TSMC, Intel Intel
  • Die size: AMD 2x 70.6 mm², Intel 163 mm²
  • L2 cache per core: AMD 1 MB, Intel 1.25 MB
  • L3 cache: AMD 64 MB, Intel 12 MB shared
  • Memory support: AMD LPDDR5X, Intel DDR4 and DDR5
  • Memory bus: AMD Quad-channel, Intel Dual-channel
  • Memory bandwidth: AMD 273.1 GB/s, Intel 76.8 GB/s
  • PCIe: AMD Gen 4, 16 lanes, Intel Gen 5, 16 lanes
  • Integrated graphics: AMD Radeon 8065S, Intel UHD Graphics 730
  • Market segment: AMD Mobile, Intel Desktop
  • Release date: AMD 2026-05-19, Intel 2025-01-12
  • Part number: AMD 100-000002124, Intel SRPKDQ5CK

Both processors have ECC memory support enabled. Both have a production status of Active. Neither has an unlocked multiplier.

Where Each One Wins

The AMD Ryzen AI Max+ PRO 495 wins in scenarios that demand parallel processing. The 16 cores and 32 threads provide 4 times the thread count of the Intel part. Workloads such as video rendering, 3D simulation, scientific computing, and heavy multitasking would benefit from the higher core count.

The AMD processor also wins on memory bandwidth. The 273.1 GB/s figure is more than 3.5 times the Intel's 76.8 GB/s. Applications that stream large datasets, such as data analytics, machine learning inference, or high-resolution media editing, would see advantages from the quad-channel LPDDR5X configuration.

The larger L3 cache of 64 MB gives AMD an edge in workloads with large working sets that need frequent data reuse. The 4 nm process node suggests better power efficiency per transistor, which matters for sustained mobile operation.

The Intel Core 3 201TE wins in scenarios that favor a desktop platform. The Socket 1700 is a desktop socket, allowing for standard desktop cooling, expansion, and upgrade options. The dual-channel support for both DDR4 and DDR5 gives builders memory flexibility that the AMD mobile part does not offer.

Intel wins on per-core L2 cache allocation. The 1.25 MB per core versus 1 MB per core could help single-threaded or lightly threaded applications that rely on fast local cache access.

Intel wins on PCIe generation. PCIe Gen 5 support is newer than PCIe Gen 4, which matters for users with next-generation GPUs or NVMe storage devices that can use the additional bandwidth.

The Intel processor has a lower TDP of 45 W versus 55 W, which translates to lower power draw in a desktop context. For always-on systems or small form factor desktops with limited cooling, that difference could be relevant.

The Intel processor was released earlier, on 2025-01-12, compared to the AMD release on 2026-05-19. This means Intel has a longer market presence, which could affect availability and ecosystem maturity.

The launch MSRP of $134 for the Intel processor provides a fixed reference point, though the AMD processor has no comparable listed figure.

DETAILED SPECIFICATIONS

SPECIFICATION
AI Max+ PRO 495
3 201TE
Core Specs
Cores
16
4 -75.0%
Threads
32
8 -75.0%
Base Clock (GHz)
3.1
2.9 -6.5%
Boost Clock (GHz)
5.2
4.6 -11.5%
Frequency (GHz)
3.1
2.9 -6.5%
Turbo Clock (GHz)
5.2
4.6 -11.5%
Multiplier
31
29 -6.5%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
80 KB (per core)
80 KB (per core)
L2 Cache
1 MB (per core)
1.25 MB (per core)
L3 Cache
64 MB
12 MB (shared)
Power
TDP (W)
55
45 -18.2%
PL1
—
45 W
PL2
—
106 W
Configurable TDP
45-120 W
—
Architecture
Codename
Gorgon Halo
Bartlett Lake
Generation
Ryzen AI Max+ PRO (Zen 5)
Core 3 (Bartlett Lake)
Process Size
4 nm
10 nm
Die Size
2x 70.6 mm²
163 mm²
Foundry
TSMC
Intel
Memory
Memory Support
LPDDR5X
DDR4, DDR5
Memory Bus
Quad-channel
Dual-channel
Memory Bandwidth
273.1 GB/s
76.8 GB/s
ECC Memory
Yes
Yes
DDR4 Speed
—
3200 MT/s
Platform
Socket
AMD Socket FP11
Intel Socket 1700
Chipsets
—
W680, R680E, Q670e, Q670, H610E, H610
PCIe
Gen 4, 16 Lanes(CPU only)
Gen 5, 16 Lanes(CPU only)
AI/NPU
NPU
Yes / 55 TOPS
—
Graphics
Integrated Graphics
Radeon 8065S
UHD Graphics 730
Other
Market
Mobile
Desktop
Production Status
Active
Active
Launch Price
—
$134
Part Number
100-000002124
SRPKDQ5CK
Package
FC-BGA
FC-LGA16A
Tj Max
100°C
100°C
View Ryzen AI Max+ PRO 495 Details View Core 3 201TE Details