AMD Ryzen AI Max+ PRO 495 vs Intel Core 3 100UL Comparison

AMD
AMD

AMD Ryzen AI Max+ PRO 495

CORE STATE Gorgon Halo
CORE SPECS 16 Cores / 32 Threads
CLOCK SPEED 3.1 Base / 5.2 GHz Turbo
CACHE 64 MB
MAX TDP 55W
ARCHITECTURE Gorgon Halo
nm
PROCESS 4 nm
LAUNCH DATE 2026
VS
Intel
INTEL

Core 3 100UL

CORE STATE Raptor Lake-PS
CORE SPECS 6 Cores / 8 Threads
CLOCK SPEED 1.2 Base / 4.5 GHz Turbo
CACHE 10 MB (shared)
MAX TDP 15W
ARCHITECTURE Raptor Lake
nm
PROCESS 10 nm
LAUNCH DATE 2024

Analysis: AMD Ryzen AI Max+ PRO 495 vs Intel Core 3 100UL

Head-to-Head Benchmarks

The recorded data shows no direct head-to-head benchmark results between the AMD Ryzen AI Max+ PRO 495 and the Intel Core 3 100UL. Neither processor has any benchmark entries in the database, and the win counts for both sides are zero. This means the comparison rests entirely on architectural and specification-based differences rather than measured performance scores.

The AMD part carries 16 cores and 32 threads, while the Intel part carries 6 cores and 8 threads. That is a 10-core and 24-thread gap in favor of AMD. The boost clock on the AMD chip reaches 5.20 GHz, which is 0.70 GHz higher than the Intel chip's 4.50 GHz boost. The base clock difference is even larger: 3.10 GHz versus 1.20 GHz, a 1.90 GHz gap.

The Intel Core 3 100UL operates at a 15 W TDP, while the AMD Ryzen AI Max+ PRO 495 operates at a 55 W TDP. The AMD chip uses nearly four times the power envelope, which aligns with its higher core count and clock speeds. The database places both processors at the 50th percentile among all CPUs, but that percentile reflects the absence of benchmark data rather than any measured equivalence in performance.

Because no benchmark scores exist, the head-to-head section must rely on what the specification data indicates. The AMD chip has more cores, more threads, higher clocks, and a larger L3 cache. The Intel chip has a lower power draw and a smaller physical footprint in terms of cores. The data does not support any claim of a performance win for either part in any specific workload category.

Architecture Differences

The AMD Ryzen AI Max+ PRO 495 uses the Gorgon Halo codename and belongs to the Ryzen AI Max+ PRO generation built on Zen 5. The process node is 4 nm, fabricated by TSMC. The die size is listed as 2x 70.6 mm², indicating a dual-die configuration. The L3 cache totals 64 MB, with L1 cache at 80 KB per core and L2 cache at 1 MB per core. The integrated graphics are Radeon 8065S.

The Intel Core 3 100UL uses the Raptor Lake-PS codename and belongs to the Core 3 generation built on Raptor Lake architecture. The process node is 10 nm, fabricated by Intel. No die size is recorded. The L3 cache is 10 MB shared, with L1 cache at 80 KB per core and L2 cache at 1.25 MB per core. The integrated graphics are UHD Graphics 64EU.

The memory support differs substantially. The AMD chip uses LPDDR5X memory with a quad-channel bus and a recorded memory bandwidth of 273.1 GB/s. It also supports ECC memory. The Intel chip uses DDR4 and DDR5 memory with a dual-channel bus, no recorded memory bandwidth figure, and no ECC support.

The socket types are different: AMD uses Socket FP11, while Intel uses Socket 1700. The PCIe configuration also differs: the AMD chip provides Gen 4 with 16 lanes (CPU only), while the Intel chip provides Gen 4 with 8 lanes (CPU only). The AMD part has double the PCIe lanes of the Intel part.

The release dates show a two-year separation. The Intel Core 3 100UL was released on 2024-04-07, while the AMD Ryzen AI Max+ PRO 495 was released on 2026-05-19. Both parts are marked as Active in production status. Neither has an unlocked multiplier, and neither has a recorded launch MSRP.

Where Each One Wins

The AMD Ryzen AI Max+ PRO 495 wins on raw thread count by a wide margin. With 32 threads versus 8 threads, the AMD chip can handle four times the concurrent threads. This matters for heavily parallel workloads such as compiling, rendering, and virtualization. The 64 MB L3 cache also exceeds the Intel chip's 10 MB by a factor of 6.4, which benefits workloads that repeatedly access large datasets.

The AMD chip wins on memory bandwidth. The recorded 273.1 GB/s is a quad-channel LPDDR5X configuration. The Intel chip has no recorded bandwidth figure and uses a dual-channel bus with DDR4 or DDR5. The ECC support on the AMD side also gives it an advantage in error-sensitive compute tasks.

The AMD chip wins on clock speeds. The 5.20 GHz boost clock is 0.70 GHz higher than the Intel chip's 4.50 GHz boost. The base clock of 3.10 GHz is 1.90 GHz higher than the Intel chip's 1.20 GHz base. For single-threaded bursts, the AMD chip has a clock advantage, though the architecture differences prevent a direct performance equivalence.

The Intel Core 3 100UL wins on power efficiency. The 15 W TDP is 40 W lower than the AMD chip's 55 W TDP. This makes the Intel part suitable for fanless or low-power designs where thermal output and battery life take priority over compute throughput. The Intel chip also uses a desktop socket (Socket 1700), which may fit into existing desktop platforms, while the AMD chip uses a mobile socket (FP11).

The Intel chip has a larger L2 cache per core at 1.25 MB versus 1 MB on the AMD side. This per-core cache advantage could benefit workloads that fit within a single core's L2 footprint, though the overall L3 disparity heavily favors AMD.

Specification Differences

The two processors differ in every major specification category recorded in the database.

  • Cores: 16 (AMD) versus 6 (Intel)
  • Threads: 32 (AMD) versus 8 (Intel)
  • Base clock: 3.10 GHz (AMD) versus 1.20 GHz (Intel)
  • Boost clock: 5.20 GHz (AMD) versus 4.50 GHz (Intel)
  • TDP: 55 W (AMD) versus 15 W (Intel)
  • Socket: AMD Socket FP11 versus Intel Socket 1700
  • Codename: Gorgon Halo versus Raptor Lake-PS
  • Generation: Ryzen AI Max+ PRO (Zen 5) versus Core 3 (Raptor Lake-PS)
  • Process node: 4 nm (AMD) versus 10 nm (Intel)
  • Foundry: TSMC versus Intel
  • Die size: 2x 70.6 mm² versus no recorded value
  • L1 cache: 80 KB per core on both
  • L2 cache: 1 MB per core (AMD) versus 1.25 MB per core (Intel)
  • L3 cache: 64 MB (AMD) versus 10 MB shared (Intel)
  • Memory support: LPDDR5X (AMD) versus DDR4, DDR5 (Intel)
  • Memory bus: Quad-channel (AMD) versus Dual-channel (Intel)
  • Memory bandwidth: 273.1 GB/s (AMD) versus no recorded value (Intel)
  • ECC memory: true (AMD) versus false (Intel)
  • PCIe: Gen 4, 16 lanes (AMD) versus Gen 4, 8 lanes (Intel)
  • Integrated graphics: Radeon 8065S (AMD) versus UHD Graphics 64EU (Intel)
  • Market segment: Mobile (AMD) versus Desktop (Intel)
  • Release date: 2026-05-19 (AMD) versus 2024-04-07 (Intel)
  • Part number: 100-000002124 (AMD) versus unknown (Intel)

Both parts share a locked multiplier, Active production status, and a 50th percentile ranking among all CPUs. Neither has a recorded launch MSRP.

FAQ

Q: Which processor has more cores and threads?

A: The AMD Ryzen AI Max+ PRO 495 has 16 cores and 32 threads. The Intel Core 3 100UL has 6 cores and 8 threads.

Q: What is the boost clock difference between the two?

A: The AMD chip boosts to 5.20 GHz, while the Intel chip boosts to 4.50 GHz. The AMD chip has a 0.70 GHz higher boost clock.

Q: Which processor supports ECC memory?

A: The AMD Ryzen AI Max+ PRO 495 supports ECC memory. The Intel Core 3 100UL does not support ECC memory.

Q: How does the memory bandwidth compare?

A: The AMD chip has a recorded memory bandwidth of 273.1 GB/s using quad-channel LPDDR5X. The Intel chip uses dual-channel DDR4 or DDR5 with no recorded bandwidth figure.

Q: What are the TDP values for each processor?

A: The AMD Ryzen AI Max+ PRO 495 has a TDP of 55 W. The Intel Core 3 100UL has a TDP of 15 W.

Q: Which processor was released earlier?

A: The Intel Core 3 100UL was released on 2024-04-07. The AMD Ryzen AI Max+ PRO 495 was released on 2026-05-19.

Q: What are the integrated graphics on each chip?

A: The AMD chip uses Radeon 8065S graphics. The Intel chip uses UHD Graphics 64EU.

The Verdict

The AMD Ryzen AI Max+ PRO 495 is the clear choice for compute-heavy workloads. The data shows 16 cores, 32 threads, a 5.20 GHz boost clock, 64 MB of L3 cache, 273.1 GB/s of memory bandwidth, and ECC support. These specifications point toward multi-threaded rendering, large-scale data processing, and memory-intensive applications. The 55 W TDP and mobile socket indicate a high-performance mobile platform designed for maximum throughput in a laptop form factor.

The Intel Core 3 100UL is the appropriate choice for low-power desktop applications. The data shows 6 cores, 8 threads, a 4.50 GHz boost clock, 10 MB of shared L3 cache, and a 15 W TDP. The dual-channel memory bus and lack of ECC support position it as a mainstream desktop part. The desktop socket (Socket 1700) and 2024 release date make it a fit for existing desktop platforms where power draw is a primary constraint.

The database shows no benchmark scores for either part, so the verdict rests on specification analysis. The AMD chip dominates in core count, thread count, clocks, cache size, memory bandwidth, and PCIe lane count. The Intel chip wins only in per-core L2 cache size (1.25 MB versus 1 MB) and power efficiency (15 W versus 55 W).

Users who need maximum parallel throughput and large memory bandwidth should select the AMD Ryzen AI Max+ PRO 495. Users who prioritize low power consumption and desktop socket compatibility should select the Intel Core 3 100UL. The two-year gap in release dates also matters: the AMD chip is newer by design, while the Intel chip is an established desktop option. Neither part has an unlocked multiplier, so overclocking is not a differentiating factor. The production status for both is Active, meaning both remain available in the market.

DETAILED SPECIFICATIONS

SPECIFICATION
AI Max+ PRO 495
3 100UL
Core Specs
Cores
16
6 -62.5%
Threads
32
8 -75.0%
Base Clock (GHz)
3.1
1.2 -61.3%
Boost Clock (GHz)
5.2
4.5 -13.5%
Frequency (GHz)
3.1
1.2 -61.3%
Turbo Clock (GHz)
5.2
4.5 -13.5%
Multiplier
31
12 -61.3%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
80 KB (per core)
80 KB (per core)
L2 Cache
1 MB (per core)
1.25 MB (per core)
L3 Cache
64 MB
10 MB (shared)
Power
TDP (W)
55
15 -72.7%
PL1
—
15 W
PL2
—
55 W
Configurable TDP
45-120 W
—
Architecture
Architecture
—
Raptor Lake
Codename
Gorgon Halo
Raptor Lake-PS
Generation
Ryzen AI Max+ PRO (Zen 5)
Core 3 (Raptor Lake-PS)
Process Size
4 nm
10 nm
Die Size
2x 70.6 mm²
—
Foundry
TSMC
Intel
Memory
Memory Support
LPDDR5X
DDR4, DDR5
Memory Bus
Quad-channel
Dual-channel
Memory Bandwidth
273.1 GB/s
—
ECC Memory
Yes
No
DDR4 Speed
—
3200 MT/s
DDR5 Speed
—
5200 MT/s
Platform
Socket
AMD Socket FP11
Intel Socket 1700
PCIe
Gen 4, 16 Lanes(CPU only)
Gen 4, 8 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
—
P-Cores: 2 E-Cores: 4
E-Core Frequency
—
900 MHz up to 3.3 GHz
AI/NPU
NPU
Yes / 55 TOPS
—
Graphics
Integrated Graphics
Radeon 8065S
UHD Graphics 64EU
Other
Market
Mobile
Desktop
Production Status
Active
Active
Part Number
100-000002124
unknown
Package
FC-BGA
FC-LGA16A
Tj Max
100°C
100°C
View Ryzen AI Max+ PRO 495 Details View Core 3 100UL Details