AMD Ryzen AI Max PRO 490 vs AMD Ryzen Embedded 8845HS Comparison

FAQ

Q: What are the core and thread counts of the AMD Ryzen AI Max PRO 490 and the AMD Ryzen Embedded 8845HS?

A: The Ryzen AI Max PRO 490 uses 12 cores and 24 threads, while the Ryzen Embedded 8845HS uses 8 cores and 16 threads.

Q: How do the boost clocks compare between the two processors?

A: The Ryzen Embedded 8845HS has a slightly higher boost clock at 5.10 GHz, compared to the Ryzen AI Max PRO 490 at 5.00 GHz.

Q: Which processor supports more memory channels and what is the memory bandwidth difference?

A: The Ryzen AI Max PRO 490 supports quad-channel LPDDR5X memory with 273.1 GB/s of bandwidth, whereas the Ryzen Embedded 8845HS supports dual-channel DDR5 with 89.6 GB/s.

Q: What process node is used by both chips?

A: Both processors are manufactured on a 4 nm process node by TSMC.

Q: Do both processors support ECC memory?

A: Yes, both the Ryzen AI Max PRO 490 and the Ryzen Embedded 8845HS include support for ECC memory.

Q: What is the TDP for each processor?

A: The Ryzen AI Max PRO 490 has a TDP of 55 watts, while the Ryzen Embedded 8845HS has a TDP of 45 watts.

Architecture Differences

The AMD Ryzen AI Max PRO 490 is built on the Gorgon Halo package, using the Zen 5 microarchitecture, and belongs to the Ryzen AI Max PRO generation. The AMD Ryzen Embedded 8845HS is a Hawk Point part using the Zen 4 architecture and belongs to the Ryzen Embedded 8000 series. Both chips are fabricated by TSMC on a 4 nm process, but the die layouts differ substantially. The Ryzen AI Max PRO 490 reports a die size of 2x 70.6 mm², indicating a chiplet design with two separate compute dies. The Ryzen Embedded 8845HS uses a monolithic die measuring 178 mm², with 25,000 million transistors.

The cache hierarchies reflect the generational gap. The Ryzen AI Max PRO 490 provides 80 KB of L1 per core and 1 MB of L2 per core, with a large 64 MB shared L3 cache. The Ryzen Embedded 8845HS provides 64 KB of L1 per core and 1 MB of L2 per core, but only 16 MB of shared L3. This fourfold difference in L3 capacity is a major architectural separation, giving the Zen 5 part significantly more on-chip data capacity for workloads that reuse large working sets.

Memory architecture also diverges. The Ryzen AI Max PRO 490 uses quad-channel LPDDR5X with a memory bandwidth of 273.1 GB/s, which is more than three times the 89.6 GB/s of the Ryzen Embedded 8845HS, which runs dual-channel DDR5. Both processors support ECC memory, a feature that positions them for reliability-oriented tasks. The integrated graphics differ as well: the Ryzen AI Max PRO 490 carries a Radeon 8050S, while the Ryzen Embedded 8845HS carries a Radeon 780M.

The socket and platform details are distinct. The Ryzen AI Max PRO 490 uses AMD Socket FP11, while the Ryzen Embedded 8845HS uses AMD Socket FP8. PCIe lane counts also differ: the Ryzen AI Max PRO 490 provides Gen 4 with 16 CPU lanes, whereas the Ryzen Embedded 8845HS provides Gen 4 with 20 CPU lanes. The extra PCIe lanes on the embedded part give it more headroom for direct peripheral connectivity, while the AI Max PRO part compensates with higher memory bandwidth and more compute cores.

The Verdict

The recorded data indicates a clear split in intended use. The AMD Ryzen AI Max PRO 490 delivers 12 cores, 24 threads, a 64 MB L3 cache, and 273.1 GB/s of memory bandwidth, which positions it for throughput-heavy mobile workloads such as large data processing, virtualization, and integrated graphics tasks. The extra 4 cores and 8 threads, combined with the much larger cache and higher memory bandwidth, make it the stronger choice for parallel compute and memory-bound applications.

The AMD Ryzen Embedded 8845HS, with 8 cores, 16 threads, and 45 watts TDP, is more conservative in power envelope and physical footprint. It uses a single 178 mm² die, which simplifies integration, and offers 20 PCIe Gen 4 lanes, which is 4 more lanes than the Ryzen AI Max PRO 490. For embedded systems requiring direct device attachment and lower power draw, the 8845HS is the practical pick. The Ryzen AI Max PRO 490 carries a 55 watt TDP, 10 watts higher, and uses a dual-die package, which may influence board design and cooling requirements.

The boost clock difference is minor: 5.10 GHz for the 8845HS versus 5.00 GHz for the AI Max PRO. The base clock is the opposite, with the AI Max PRO at 3.20 GHz and the 8845HS at 3.80 GHz. Neither chip has an unlocked multiplier, so overclocking is not part of the expected usage model. Both processors hold the same percentile ranking against all CPUs in the database, suggesting that despite different architectural approaches, their overall performance distribution is comparable in aggregate, but that aggregate hides the very different workload profiles each chip targets.

Specification Differences

| Specification | AMD Ryzen AI Max PRO 490 | AMD Ryzen Embedded 8845HS |

| --- | --- | --- |

| Series | None listed | 8000 series |

| Cores | 12 | 8 |

| Threads | 24 | 16 |

| Base Clock | 3.20 GHz | 3.80 GHz |

| Boost Clock | 5.00 GHz | 5.10 GHz |

| TDP | 55 W | 45 W |

| Socket | AMD Socket FP11 | AMD Socket FP8 |

| Codename | Gorgon Halo | Hawk Point |

| Generation | Ryzen AI Max PRO (Zen 5) | Ryzen Embedded (Zen 4 (Hawk Point)) |

| Die Size | 2x 70.6 mm² | 178 mm² |

| Transistors | Not listed | 25,000 million |

| L1 Cache | 80 KB per core | 64 KB per core |

| L3 Cache | 64 MB | 16 MB (shared) |

| Memory Support | LPDDR5X | DDR5 |

| Memory Bus | Quad-channel | Dual-channel |

| Memory Bandwidth | 273.1 GB/s | 89.6 GB/s |

| PCIe | Gen 4, 16 Lanes (CPU only) | Gen 4, 20 Lanes (CPU only) |

| Integrated Graphics | Radeon 8050S | Radeon 780M |

| Part Number | 100-000002141 | unknown |

The two chips share the same 4 nm TSMC process node, 1 MB per core L2 cache, ECC memory support, active production status, and mobile market segment. The Ryzen AI Max PRO 490 has no listed launch MSRP, and the Ryzen Embedded 8845HS also has no listed launch MSRP.

Head-to-Head Benchmarks

No benchmark scores are recorded in the database for either processor, so the comparison relies on the architectural and specification data available. The largest single advantage for the AMD Ryzen AI Max PRO 490 is its memory bandwidth: 273.1 GB/s versus 89.6 GB/s for the Ryzen Embedded 8845HS. That represents a difference of 183.5 GB/s, or roughly three times the bandwidth. For workloads that stream data from memory, such as large matrix operations, database scans, or integrated graphics rendering, this advantage dominates the comparison.

The core count difference gives the Ryzen AI Max PRO 490 a 50% increase in cores and threads over the 8845HS: 12 versus 8 cores, and 24 versus 16 threads. In multi-threaded synthetic workloads that scale linearly, this would translate to a proportional throughput advantage, though real-world scaling depends on memory and cache behavior. The L3 cache difference reinforces this, with 64 MB on the AI Max PRO versus 16 MB on the embedded part, a 48 MB gap that reduces memory traffic for repeated data access.

The Ryzen Embedded 8845HS fights back with a higher base clock of 3.80 GHz versus 3.20 GHz, a 0.60 GHz advantage, and a higher boost clock of 5.10 GHz versus 5.00 GHz, a 0.10 GHz advantage. For single-threaded latency-sensitive tasks that fit within a small cache footprint, the 8845HS can deliver quicker response per core. Its higher base clock also suggests better sustained performance under moderate loads within its 45 watt TDP envelope.

PCIe connectivity favors the embedded chip. The Ryzen Embedded 8845HS exposes 20 Gen 4 lanes, while the Ryzen AI Max PRO 490 exposes 16 Gen 4 lanes. For systems that attach multiple NVMe drives, network cards, or custom accelerators, the extra 4 lanes reduce the need for switching logic. However, the AI Max PRO part compensates with its integrated Radeon 8050S graphics, which is paired with quad-channel memory, giving it a far more capable memory subsystem for graphics workloads than the Radeon 780M in the 8845HS with dual-channel memory.

The transistor count of 25,000 million on the 8845HS is listed, while the AI Max PRO 490 has no transistor figure in the database. The die size comparison shows the 8845HS at 178 mm² on a single die, while the AI Max PRO uses two dies of 70.6 mm² each, for a combined 141.2 mm². The dual-die approach on the AI Max PRO uses roughly 37 mm² less total silicon area while providing 12 cores and a 64 MB L3 cache, indicating the Zen 5 design achieves higher density per area. The smaller aggregate die area also suggests the AI Max PRO can be more efficient in terms of silicon cost per core, though the database does not provide pricing data.

Both processors support ECC memory, which is critical for embedded and workstation reliability. The AI Max PRO 490 has a release date of 2026-05-19, while the 8845HS has a release date of 2024-04-01. The gap in release timing reflects the newer Zen 5 design versus the earlier Zen 4 part. The 8845HS benefits from a longer period of ecosystem maturity, while the AI Max PRO 490 brings a newer feature set to the mobile platform.

In summary, the recorded data shows the Ryzen AI Max PRO 490 leads in core count, thread count, L3 cache size, memory bandwidth, and memory channel width. The Ryzen Embedded 8845HS leads in base clock, boost clock, PCIe lane count, and lower TDP. The integrated graphics differ, with the Radeon 8050S on the AI Max PRO and the Radeon 780M on the 8845HS, and the memory subsystem of the AI Max PRO provides substantially more bandwidth to feed either GPU. For workloads dominated by parallel execution and large data movement, the Ryzen AI Max PRO 490 is the stronger part. For embedded deployments prioritizing lower power, direct PCIe connectivity, and higher per-core clock rates, the Ryzen Embedded 8845HS is the appropriate selection.