AMD Ryzen AI Embedded P174 vs Intel Core 7 150HL Comparison

Head-to-Head Benchmarks

The recorded data contains no direct head-to-head benchmark entries for the AMD Ryzen AI Embedded P174 versus the Intel Core 7 150HL. The benchmark database shows zero wins for either processor in this matchup, and no average benchmark scores are available for comparison. Both processors sit at the 50th percentile among all CPUs tracked in the database, indicating they occupy similar performance tiers despite their architectural differences.

Without direct measurement data, the comparison must rely on the structural specifications recorded in the database. The AMD processor uses a 10-core, 20-thread configuration with a base clock of 2.00 GHz and a boost clock of 5.00 GHz. The Intel processor uses a 14-core, 20-thread configuration with a base clock of 2.40 GHz and a boost clock of 5.00 GHz. The thread counts match at 20, which means both processors can handle the same number of concurrent software threads, but the core distribution differs significantly.

The Intel part has four more physical cores, which in workloads that scale with core count could provide an advantage in parallel processing scenarios. However, the AMD part uses a hybrid Zen 5 / Zen 5c core design, where the Zen 5c cores are optimized for density and efficiency rather than raw clock speed. The database does not record how many of each core type are present, but the architecture designation suggests a mix of performance and efficiency cores.

The boost clocks are identical at 5.00 GHz, so single-threaded peak performance potential is nominally equal. The base clock difference, 2.00 GHz versus 2.40 GHz, indicates the Intel processor sustains a higher minimum frequency under load, which could translate to better all-core performance at lower power states. The AMD processor compensates with a lower thermal design power of 28 watts versus the Intel part's 45 watts, suggesting the AMD design targets efficiency-constrained environments.

FAQ

Q: Which processor has more cores?

A: The Intel Core 7 150HL has 14 cores, while the AMD Ryzen AI Embedded P174 has 10 cores. Both processors have 20 threads.

Q: Do both processors boost to the same clock speed?

A: Yes, both processors have a maximum boost clock of 5.00 GHz. The Intel processor has a higher base clock at 2.40 GHz compared to the AMD processor's 2.00 GHz.

Q: Which processor uses a smaller manufacturing process?

A: The AMD Ryzen AI Embedded P174 is fabricated on a 4 nm process at TSMC, while the Intel Core 7 150HL uses a 10 nm process at Intel.

Q: What are the cache configurations for each processor?

A: Both processors have 80 KB of L1 cache per core. The AMD processor has 1 MB of L2 cache per core and 16 MB of L3 cache. The Intel processor has 2 MB of L2 cache per core and 24 MB of shared L3 cache.

Q: Do both processors support ECC memory?

A: No. The AMD Ryzen AI Embedded P174 supports ECC memory, while the Intel Core 7 150HL does not.

Q: Which processor has a higher thermal design power?

A: The Intel Core 7 150HL has a TDP of 45 watts, which is higher than the AMD Ryzen AI Embedded P174's 28 watts.

Architecture Differences

The AMD Ryzen AI Embedded P174 uses the Gorgon Point codename and belongs to the Ryzen AI Embedded generation built on the Zen 5 / Zen 5c architecture. It is manufactured on a 4 nm process at TSMC, with a die size of 233 mm². The processor uses AMD Socket FP8 and is classified as a mobile market segment part. Its integrated graphics are the Radeon 880M, and it supports DDR5 and LPDDR5X memory across a dual-channel bus with a recorded memory bandwidth of 89.6 GB/s. The CPU provides 16 PCIe Gen 4 lanes and includes ECC memory support. The production status is active, with a release date recorded as 2026-02-28.

The Intel Core 7 150HL uses the Raptor Lake architecture with the Raptor Lake-PS codename. It is manufactured on a 10 nm process at Intel, with no die size recorded. The processor uses Intel Socket 1700 and is classified as a desktop market segment part. Its integrated graphics are the Iris Xe Graphics 96EU, and it supports both DDR4 and DDR5 memory across a dual-channel bus, though no memory bandwidth figure is recorded. The CPU provides 8 PCIe Gen 4 lanes and does not support ECC memory. The production status is active, with a release date recorded as 2024-04-07.

The architectural divergence is substantial. The AMD part uses a newer, denser manufacturing process at 4 nm versus 10 nm, which typically enables lower power consumption and higher transistor density. The Intel part uses a hybrid core topology inherent to Raptor Lake, but the database records only total cores, not performance versus efficiency core counts. The AMD part's Zen 5 / Zen 5c combination is also a hybrid design, but the database does not specify the core-type breakdown for either processor.

Cache hierarchies differ: the AMD processor allocates 1 MB of L2 per core and 16 MB of L3, while the Intel processor allocates 2 MB of L2 per core and 24 MB of shared L3. The larger L3 cache on the Intel part could benefit workloads with repeated data access across cores. The larger per-core L2 on the Intel part could benefit single-threaded workloads with localized data sets.

Memory support also diverges. The AMD processor supports only DDR5 and LPDDR5X, while the Intel processor supports both DDR4 and DDR5. This gives the Intel part flexibility for systems with legacy DDR4 memory, but the AMD part gains the lower-power LPDDR5X option for mobile or embedded designs.

The AMD processor has double the PCIe Gen 4 lanes at 16 versus 8, which allows for more expansion devices or a higher-bandwidth GPU connection. The Intel processor's 8 lanes may suffice for a single GPU plus limited peripherals, but the AMD part offers more headroom for additional controllers.

The Verdict

The data indicates that neither processor has a recorded benchmark advantage over the other, as the database contains no head-to-head results. Both processors achieve the same 50th percentile ranking among all CPUs, meaning they occupy the median performance tier in the database's overall distribution.

The AMD Ryzen AI Embedded P174 suits applications where power efficiency and compact thermal envelopes are primary constraints. Its 28-watt TDP, 4 nm process, and mobile market classification point toward embedded systems, thin-and-light mobile devices, or passively cooled industrial computing. The Radeon 880M integrated graphics and LPDDR5X memory support reinforce this positioning. The 16 PCIe Gen 4 lanes provide connectivity for multiple peripherals without a discrete GPU.

The Intel Core 7 150HL suits applications where higher sustained base clocks and larger cache capacities are beneficial. Its 45-watt TDP, desktop market classification, and 14-core configuration indicate a focus on throughput-oriented workloads in a powered environment. The DDR4 support lowers system cost for upgrade paths, and the Iris Xe Graphics 96EU provides integrated display output without a discrete GPU.

The selection between these processors depends on the operating environment. The AMD part delivers a lower power draw, smaller process node, and ECC memory support, which are critical for reliability-focused embedded deployments. The Intel part delivers more physical cores, a higher base clock, and a larger L3 cache, which are advantageous for multi-threaded compute tasks in desktop-style chassis with adequate cooling.

Neither processor offers an unlocked multiplier, so overclocking is not a differentiator. Both are active production parts, but the Intel processor has an earlier release date, which may indicate a more mature ecosystem of motherboards and firmware support.

Specification Differences

The following fields differ between the AMD Ryzen AI Embedded P174 and the Intel Core 7 150HL:

• Cores: AMD 10, Intel 14
• Base clock: AMD 2.00 GHz, Intel 2.40 GHz
• TDP: AMD 28 watts, Intel 45 watts
• Socket: AMD Socket FP8, Intel Socket 1700
• Codename: Gorgon Point, Raptor Lake-PS
• Generation: Ryzen AI Embedded (Zen 5 / Zen 5c), Core 7 (Raptor Lake-PS)
• Process node: 4 nm, 10 nm
• Foundry: TSMC, Intel
• Die size: 233 mm², not recorded
• L2 cache per core: 1 MB, 2 MB
• L3 cache: 16 MB, 24 MB (shared)
• Memory support: DDR5, LPDDR5X versus DDR4, DDR5
• Memory bandwidth: 89.6 GB/s, not recorded
• ECC memory: Supported, not supported
• PCIe lanes: Gen 4, 16 lanes versus Gen 4, 8 lanes
• Integrated graphics: Radeon 880M, Iris Xe Graphics 96EU
• Market segment: Mobile, Desktop
• Release date: 2026-02-28, 2024-04-07

Fields that are identical include the boost clock at 5.00 GHz, thread count at 20, L1 cache at 80 KB per core, dual-channel memory bus, and the locked multiplier status. Both processors have no recorded launch MSRP in the database.

Where Each One Wins

The AMD Ryzen AI Embedded P174 wins in efficiency-oriented metrics. Its 28-watt TDP is significantly lower than the Intel part's 45 watts, making it suitable for thermally constrained designs. The 4 nm process node at TSMC represents a more advanced manufacturing technology than Intel's 10 nm node, which typically correlates with lower power leakage and higher transistor density. The 233 mm² die size is recorded, whereas the Intel part has no die size data. ECC memory support gives the AMD part an advantage in error-sensitive workloads such as financial computing, scientific simulations, or long-running server tasks where data integrity is paramount. The 16 PCIe Gen 4 lanes provide double the connectivity of the Intel part, enabling more simultaneous high-speed peripherals. The LPDDR5X memory support allows for lower-voltage memory operation in mobile designs. The mobile market segment classification indicates the AMD part is designed for portable or embedded form factors where space and power are at a premium.

The Intel Core 7 150HL wins in throughput-oriented metrics. Its 14 cores versus 10 cores provides 40% more physical cores for parallel workloads, which can translate to higher multi-threaded performance in applications that scale with core count. The 2.40 GHz base clock versus 2.00 GHz means the Intel part sustains a higher minimum frequency under sustained load, which benefits all-core workloads that do not reach boost conditions. The 2 MB L2 cache per core is double the AMD part's 1 MB, which improves per-core data locality. The 24 MB shared L3 cache is 50% larger than the AMD part's 16 MB, which reduces memory latency for frequently accessed shared data. The DDR4 memory support allows the Intel part to be paired with lower-cost memory modules in existing systems. The desktop market segment classification indicates the Intel part is designed for chassis with active cooling and abundant power delivery. The earlier release date suggests a longer field history with established BIOS and driver support.

The benchmark database does not provide direct performance scores to confirm or refute these structural advantages. The identical 50th percentile ranking for both processors suggests that, in the aggregate across all CPUs, they are comparable in overall capability. The choice between them hinges on whether the deployment environment prioritizes power efficiency and reliability features (AMD) or core count and cache capacity (Intel).