AMD Ryzen AI Embedded P174 vs Intel Core 3 201TE Comparison

AMD
AMD

AMD Ryzen AI Embedded P174

CORE STATE Gorgon Point
CORE SPECS 10 Cores / 20 Threads
CLOCK SPEED 2 Base / 5 GHz Turbo
CACHE 16 MB
MAX TDP 28W
ARCHITECTURE Gorgon Point
nm
PROCESS 4 nm
LAUNCH DATE 2026
VS
Intel
INTEL

Core 3 201TE

CORE STATE Bartlett Lake
CORE SPECS 4 Cores / 8 Threads
CLOCK SPEED 2.9 Base / 4.6 GHz Turbo
CACHE 12 MB (shared)
MAX TDP 45W
ARCHITECTURE Bartlett Lake
nm
PROCESS 10 nm
LAUNCH DATE 2025

Analysis: AMD Ryzen AI Embedded P174 vs Intel Core 3 201TE

Head-to-Head Benchmarks

The recorded database contains no direct head-to-head benchmark scores for the AMD Ryzen AI Embedded P174 versus the Intel Core 3 201TE. Both processors return an average benchmark score of 0 and hold identical percentile positions at 50.0% of all CPUs tracked in the database. Without measured performance data, the comparison rests entirely on architectural specifications and feature sets rather than empirical test results.

The absence of benchmark numbers does not diminish the observable gap in processing resources. The AMD part fields 10 cores and 20 threads, while the Intel part provides 4 cores and 8 threads. That is a 150% advantage in core count and a 150% advantage in thread count for the AMD processor. In multi-threaded workloads where core scaling is near-linear, the AMD part would be expected to finish substantial portions of parallel work in roughly 40% of the time required by the Intel part, assuming equal per-core efficiency. The Intel part does counter with a higher base clock of 2.90 GHz against 2.00 GHz, a 45% base-clock advantage, and a boost clock of 4.60 GHz against 5.00 GHz, where the AMD part leads by 8.7%.

Single-thread performance favors the AMD part on peak frequency alone. A 5.00 GHz boost clock versus 4.60 GHz gives the AMD processor a 0.40 GHz ceiling, which translates to an 8.7% higher maximum clock rate for lightly threaded tasks. The Intel part's higher base clock matters for sustained all-core loads without boost headroom, but the AMD part's 20 threads provide far more parallelism for workloads that can use it.

Power efficiency skews heavily toward the AMD processor. The AMD part carries a 28 W TDP against 45 W for the Intel part, a 37.8% lower thermal design power. When combined with the higher core and thread counts, the AMD part delivers 0.714 threads per watt compared to 0.178 threads per watt for the Intel part, a 4x efficiency gap in thread throughput per watt. The data shows no benchmark results to confirm real-world efficiency, but the specification sheet strongly favors the AMD part for power-constrained deployments.

Architecture Differences

The two processors come from different manufacturing generations and foundries. The AMD Ryzen AI Embedded P174 uses a 4 nm process node fabricated by TSMC, while the Intel Core 3 201TE uses a 10 nm node fabricated by Intel. The smaller process node gives the AMD part a fundamental density and power advantage. Die size reflects this: the AMD processor measures 233 mm², the Intel processor 163 mm². The AMD die packs 10 cores into a larger physical area, while the Intel die fits only 4 cores into a smaller area, a direct consequence of the node difference.

The AMD part belongs to the Gorgon Point codename family and the Ryzen AI Embedded generation built on Zen 5 and Zen 5c cores. The Intel part uses the Bartlett Lake codename within the Core 3 generation. Both are active production parts, but they target different market segments: the AMD processor is classified as Mobile, the Intel processor as Desktop.

Cache hierarchies differ in structure and total capacity. Both parts allocate 80 KB of L1 cache per core. The AMD part provides 1 MB of L2 per core, while the Intel part provides 1.25 MB per core, a 25% larger L2 allocation per core for Intel. However, the AMD part's L3 cache totals 16 MB, while the Intel part's L3 totals 12 MB shared, giving AMD a 33.3% larger L3 pool. The per-core L2 advantage for Intel is offset by the larger shared L3 on the AMD side.

Memory support diverges. The AMD part supports DDR5 and LPDDR5X memory in a dual-channel configuration with a peak bandwidth of 89.6 GB/s. The Intel part supports DDR4 and DDR5, also dual-channel, with a peak bandwidth of 76.8 GB/s. The AMD part leads memory bandwidth by 16.7%. Both processors support ECC memory, which suits embedded and reliability-focused deployments.

PCIe capabilities differ by generation. The AMD part provides PCIe Gen 4 with 16 CPU lanes. The Intel part provides PCIe Gen 5 with 16 CPU lanes. The Intel part's Gen 5 interface doubles the per-lane transfer rate relative to Gen 4, which matters for high-throughput storage or accelerator attachment despite equal lane counts.

Integrated graphics differ significantly. The AMD processor uses a Radeon 880M iGPU, while the Intel processor uses UHD Graphics 730. The Radeon 880M belongs to a more recent graphics architecture and pairs with the AMD part's higher memory bandwidth, while the UHD 730 is a more modest desktop-class solution. The release dates place the Intel part in January 2025 and the AMD part in February 2026, a 13-month gap that explains the AMD part's newer process and feature set.

The AMD part is rated at 28 W TDP, the Intel part at 45 W TDP. The Intel part uses Socket 1700, the AMD part uses AMD Socket FP8. Neither processor has an unlocked multiplier. The Intel part carries a part number of SRPKDQ5CK; the AMD part's part number is listed as unknown.

FAQ

Q: Which processor has more cores and threads?

A: The AMD Ryzen AI Embedded P174 has 10 cores and 20 threads, while the Intel Core 3 201TE has 4 cores and 8 threads. The AMD part provides 6 additional cores and 12 additional threads.

Q: How do their clock speeds compare?

A: The AMD part has a base clock of 2.00 GHz and a boost clock of 5.00 GHz. The Intel part has a base clock of 2.90 GHz and a boost clock of 4.60 GHz. Intel leads base clock by 0.90 GHz, AMD leads boost clock by 0.40 GHz.

Q: Which processor supports faster memory?

A: The AMD part supports DDR5 and LPDDR5X with 89.6 GB/s peak bandwidth. The Intel part supports DDR4 and DDR5 with 76.8 GB/s peak bandwidth. The AMD part leads by 12.8 GB/s. Both support ECC memory.

Q: What are the TDP ratings?

A: The AMD part is rated at 28 W, the Intel part at 45 W. The AMD part consumes 17 W less under its thermal design power specification.

Q: Do both processors have integrated graphics?

A: Yes. The AMD part uses a Radeon 880M iGPU, and the Intel part uses UHD Graphics 730.

Q: Which processor uses a newer process node?

A: The AMD part uses a 4 nm node from TSMC. The Intel part uses a 10 nm node from Intel. The AMD part's node is smaller by 6 nm.

Specification Differences

| Specification | AMD Ryzen AI Embedded P174 | Intel Core 3 201TE |

|---|---|---|

| Cores | 10 | 4 |

| Threads | 20 | 8 |

| Base clock | 2.00 GHz | 2.90 GHz |

| Boost clock | 5.00 GHz | 4.60 GHz |

| TDP | 28 W | 45 W |

| Socket | AMD Socket FP8 | Intel Socket 1700 |

| Codename | Gorgon Point | Bartlett Lake |

| Generation | Ryzen AI Embedded (Zen 5 / Zen 5c) | Core 3 (Bartlett Lake) |

| Process node | 4 nm | 10 nm |

| Foundry | TSMC | Intel |

| Die size | 233 mm² | 163 mm² |

| L2 cache | 1 MB per core | 1.25 MB per core |

| L3 cache | 16 MB | 12 MB shared |

| Memory support | DDR5, LPDDR5X | DDR4, DDR5 |

| Memory bandwidth | 89.6 GB/s | 76.8 GB/s |

| PCIe | Gen 4, 16 lanes | Gen 5, 16 lanes |

| Integrated graphics | Radeon 880M | UHD Graphics 730 |

| Market segment | Mobile | Desktop |

| Release date | February 2026 | January 2025 |

| Part number | unknown | SRPKDQ5CK |

Both processors share 80 KB L1 cache per core, dual-channel memory buses, ECC memory support, 16 CPU PCIe lanes, active production status, and locked multipliers. The Intel part has a launch MSRP of $134, while the AMD part has no recorded launch MSRP.

Where Each One Wins

The AMD Ryzen AI Embedded P174 wins on raw parallel processing capacity. Its 10 cores and 20 threads double the Intel part's thread count. Its 5.00 GHz boost clock is the highest peak frequency between the two. Its 16 MB L3 cache exceeds the Intel part's 12 MB by 4 MB. Its memory bandwidth of 89.6 GB/s beats the Intel part's 76.8 GB/s. Its 28 W TDP is 17 W lower than the Intel part's 45 W. Its 4 nm process node from TSMC is smaller than Intel's 10 nm node. Its Radeon 880M integrated graphics represents a newer iGPU generation. It supports LPDDR5X memory in addition to DDR5, which the Intel part cannot use. Its February 2026 release date makes it the newer design.

The Intel Core 3 201TE wins on base clock frequency. Its 2.90 GHz base clock exceeds the AMD part's 2.00 GHz base clock by 0.90 GHz, a 45% advantage for sustained all-core operation at base speeds. It wins on per-core L2 cache, offering 1.25 MB per core against 1 MB per core for the AMD part. It wins on PCIe generation, providing Gen 5 connectivity versus Gen 4. It wins on memory flexibility, supporting both DDR4 and DDR5, while the AMD part supports only DDR5 and LPDDR5X. It has a smaller die size at 163 mm² versus 233 mm². It is a desktop-class part with Socket 1700 compatibility, whereas the AMD part targets the mobile segment with Socket FP8. Its January 2025 release predates the AMD part by over a year, making it the more established platform option.

The Verdict

The data supports a clear split by workload type. For multi-threaded compute, virtualization, and embedded AI workloads that scale across threads, the AMD Ryzen AI Embedded P174 holds the structural advantage: 20 threads, a 5.00 GHz boost ceiling, 16 MB L3, and 89.6 GB/s of memory bandwidth. Its 28 W TDP makes it the more power-efficient choice per thread, and its 4 nm TSMC node indicates a newer, denser design. The Radeon 880M iGPU and LPDDR5X memory support further position it for mobile embedded deployments where graphics and memory bandwidth matter.

For single-threaded latency-sensitive tasks and applications that favor higher base clocks, the Intel Core 3 201TE offers a 2.90 GHz base frequency, which is 45% higher than the AMD part's base clock. Its PCIe Gen 5 interface provides newer I/O connectivity, and its support for DDR4 memory allows reuse of existing memory infrastructure. The 12 MB shared L3 and 1.25 MB per-core L2 provide respectable cache resources for a 4-core design, and the desktop Socket 1700 platform is a mature ecosystem.

The database records no benchmark scores for either processor, so percentile rankings remain equal at 50.0% and average benchmark scores sit at 0. The verdict therefore derives from specification analysis alone. Buyers requiring maximum thread throughput and efficiency per watt should select the AMD Ryzen AI Embedded P174. Buyers requiring a high base clock, PCIe Gen 5, or DDR4 compatibility should select the Intel Core 3 201TE. The AMD part is the stronger all-around specification sheet, while the Intel part covers specific legacy and I/O use cases.

DETAILED SPECIFICATIONS

SPECIFICATION
AI Embedded P174
3 201TE
Core Specs
Cores
10
4 -60.0%
Threads
20
8 -60.0%
Base Clock (GHz)
2
2.9 +45.0%
Boost Clock (GHz)
5
4.6 -8.0%
Frequency (GHz)
2
2.9 +45.0%
Turbo Clock (GHz)
5
4.6 -8.0%
Multiplier
20
29 +45.0%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
80 KB (per core)
80 KB (per core)
L2 Cache
1 MB (per core)
1.25 MB (per core)
L3 Cache
16 MB
12 MB (shared)
Power
TDP (W)
28
45 +60.7%
PL1
45 W
PL2
106 W
Configurable TDP
15-54 W
Architecture
Codename
Gorgon Point
Bartlett Lake
Generation
Ryzen AI Embedded (Zen 5 / Zen 5c)
Core 3 (Bartlett Lake)
Process Size
4 nm
10 nm
Die Size
233 mm²
163 mm²
Foundry
TSMC
Intel
Memory
Memory Support
DDR5, LPDDR5X
DDR4, DDR5
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
89.6 GB/s
76.8 GB/s
ECC Memory
Yes
Yes
DDR4 Speed
3200 MT/s
Platform
Socket
AMD Socket FP8
Intel Socket 1700
Chipsets
W680, R680E, Q670e, Q670, H610E, H610
PCIe
Gen 4, 16 Lanes(CPU only)
Gen 5, 16 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
4 + 6
E-Core Frequency
1400 MHz up to 3.2 GHz
AI/NPU
NPU
Yes / 50 TOPS
Graphics
Integrated Graphics
Radeon 880M
UHD Graphics 730
Other
Market
Mobile
Desktop
Production Status
Active
Active
Launch Price
$134
Part Number
unknown
SRPKDQ5CK
Package
FP8
FC-LGA16A
Tj Max
105°C
100°C
View Ryzen AI Embedded P174 Details View Core 3 201TE Details