AMD Ryzen AI Embedded P174 vs Intel Core 3 100UL Comparison

Head-to-Head Benchmarks

The recorded database contains no direct head-to-head benchmark results between the AMD Ryzen AI Embedded P174 and the Intel Core 3 100UL. Both processors show zero benchmark entries, and the wins counter for each side is zero. This means the comparison must be built entirely from the architectural and specification data available in the database, rather than from measured performance scores.

What the data does show is a clear structural advantage for the AMD part. The Ryzen AI Embedded P174 carries 10 cores and 20 threads, while the Intel Core 3 100UL has 6 cores and 8 threads. In any workload that scales with thread count, the AMD processor holds a theoretical 2.5x thread advantage. That is not a measured score, but the core and thread disparity is the single largest differentiator between these two chips.

Clock speeds also favor AMD. The Ryzen part has a base clock of 2.00 GHz and a boost clock of 5.00 GHz. Intel's Core 3 100UL sits at 1.20 GHz base and 4.50 GHz boost. The AMD chip can push 500 MHz higher under boost conditions, which typically translates to stronger single-thread performance in bursty workloads. The Intel part's lower base clock of 1.20 GHz suggests it is tuned for power efficiency at idle or light load, but it gives up peak frequency headroom.

Cache configuration differs meaningfully. AMD provides 16 MB of L3 cache shared across the chip, while Intel offers 10 MB of shared L3. Per-core L2 also differs: AMD allocates 1 MB per core, Intel allocates 1.25 MB per core. The Intel chip has slightly more L2 per core, but the AMD chip has 60% more L3 overall. For workloads that repeatedly access a shared working set, the larger L3 on the AMD part should reduce memory traffic.

Memory bandwidth is another area where AMD leads. The Ryzen AI Embedded P174 lists a memory bandwidth of 89.6 GB/s, while the Intel Core 3 100UL has no recorded bandwidth figure. Both support dual-channel memory, but AMD's support for LPDDR5X alongside DDR5 gives it access to faster memory options. Intel supports DDR4 and DDR5, but without a bandwidth number recorded, the advantage goes to AMD by default.

Neither processor has an unlocked multiplier, so overclocking is not an option on either platform. Both are locked parts.

The process node difference is stark. AMD uses a 4 nm process from TSMC, while Intel uses a 10 nm process from its own fabs. Smaller process geometry typically delivers better power efficiency and higher transistor density. The AMD die size is recorded at 233 mm², while Intel's die size is not listed. The 4 nm node gives AMD a manufacturing advantage that likely explains its ability to offer more cores and a higher boost clock within a similar power envelope.

FAQ

Q: Which processor has more cores and threads?

A: The AMD Ryzen AI Embedded P174 has 10 cores and 20 threads. The Intel Core 3 100UL has 6 cores and 8 threads. AMD offers 4 additional cores and 12 additional threads.

Q: What are the boost clock speeds for each CPU?

A: The AMD part boosts to 5.00 GHz. The Intel part boosts to 4.50 GHz. AMD holds a 500 MHz advantage in peak boost frequency.

Q: Which CPU supports ECC memory?

A: The AMD Ryzen AI Embedded P174 supports ECC memory. The Intel Core 3 100UL does not support ECC memory.

Q: What is the TDP difference between these two processors?

A: The AMD Ryzen AI Embedded P174 has a TDP of 28 watts. The Intel Core 3 100UL has a TDP of 15 watts. Intel draws 13 watts less at the rated TDP.

Q: Which processor uses a smaller manufacturing process?

A: AMD uses a 4 nm process from TSMC. Intel uses a 10 nm process from Intel. The AMD process node is smaller by 6 nanometers.

Q: What socket does each CPU use?

A: The AMD Ryzen AI Embedded P174 uses AMD Socket FP8. The Intel Core 3 100UL uses Intel Socket 1700. These sockets are not interchangeable.

Q: Which integrated GPU does each processor include?

A: AMD includes the Radeon 880M. Intel includes the UHD Graphics 64EU. Both are integrated graphics solutions, but the database does not record relative performance between them.

Architecture Differences

The AMD Ryzen AI Embedded P174 uses the Gorgon Point codename and belongs to the Ryzen AI Embedded generation built on Zen 5 and Zen 5c cores. This is a hybrid core design, mixing full Zen 5 cores with more power-efficient Zen 5c cores. The process node is 4 nm, fabricated by TSMC. The die size is recorded at 233 mm². The architecture is built for embedded and mobile workloads, with a market segment listed as Mobile.

The Intel Core 3 100UL uses the Raptor Lake architecture, specifically the Raptor Lake-PS variant. It belongs to the Core 3 generation. The process node is 10 nm, fabricated by Intel. No die size is recorded for the Intel part. The market segment is listed as Desktop, which distinguishes it from AMD's Mobile classification.

Cache architecture differs in structure. AMD provides 80 KB of L1 per core, matching Intel's 80 KB per core. For L2, AMD uses 1 MB per core, while Intel uses 1.25 MB per core. This gives Intel a per-core L2 advantage of 0.25 MB. For L3, AMD provides 16 MB shared, Intel provides 10 MB shared. AMD's total L3 is 6 MB larger.

Memory support differs. AMD supports DDR5 and LPDDR5X. Intel supports DDR4 and DDR5. Both are dual-channel. AMD records a memory bandwidth of 89.6 GB/s, Intel has no recorded bandwidth. AMD supports ECC memory, Intel does not.

PCIe lane counts differ. AMD provides Gen 4 with 16 lanes (CPU only). Intel provides Gen 4 with 8 lanes (CPU only). AMD doubles the PCIe lane count, which matters for systems with multiple NVMe drives, GPUs, or expansion cards.

Release dates are far apart. AMD launched on 2026-02-28. Intel launched on 2024-04-07. The AMD part is nearly two years newer, which explains its access to a smaller process node and newer core architecture.

Specification Differences

| Specification | AMD Ryzen AI Embedded P174 | Intel Core 3 100UL |

|---|---|---|

| Cores | 10 | 6 |

| Threads | 20 | 8 |

| Base Clock | 2.00 GHz | 1.20 GHz |

| Boost Clock | 5.00 GHz | 4.50 GHz |

| TDP | 28 W | 15 W |

| Socket | AMD Socket FP8 | Intel Socket 1700 |

| Codename | Gorgon Point | Raptor Lake-PS |

| Process Node | 4 nm | 10 nm |

| Foundry | TSMC | Intel |

| L2 Cache | 1 MB per core | 1.25 MB per core |

| L3 Cache | 16 MB | 10 MB |

| Memory Support | DDR5, LPDDR5X | DDR4, DDR5 |

| Memory Bandwidth | 89.6 GB/s | Not recorded |

| ECC Memory | Yes | No |

| PCIe | Gen 4, 16 Lanes | Gen 4, 8 Lanes |

| Integrated Graphics | Radeon 880M | UHD Graphics 64EU |

| Market Segment | Mobile | Desktop |

| Release Date | 2026-02-28 | 2024-04-07 |

The table shows that AMD leads in core count, thread count, base clock, boost clock, L3 cache, memory bandwidth, ECC support, PCIe lanes, and process node. Intel leads in TDP efficiency and per-core L2 cache. Intel also supports DDR4 memory, which AMD does not.

The Verdict

The data points to the AMD Ryzen AI Embedded P174 as the more capable processor for demanding workloads. It offers more than double the thread count, a higher boost clock, more L3 cache, faster memory support, ECC memory, and double the PCIe lanes. The 4 nm process node from TSMC gives it a manufacturing advantage over Intel's 10 nm process.

The Intel Core 3 100UL has one clear advantage: power consumption. At 15 watts TDP, it draws 13 watts less than the AMD part's 28 watts. For passively cooled embedded systems, fanless industrial PCs, or battery-sensitive mobile devices, that power difference can be decisive. Intel also supports DDR4 memory, which may lower system cost in some deployments.

Neither processor has a recorded benchmark score, so any performance ranking is inferred from specifications rather than measured results. The database shows both processors at the 50th percentile among all CPUs, which is a neutral placement with no distinguishing performance signal.

For workloads that need many threads, high boost clocks, large shared cache, or ECC memory, the AMD Ryzen AI Embedded P174 is the specification winner. For applications that prioritize low power draw, the Intel Core 3 100UL is the specification winner. The choice hinges on whether compute throughput or power efficiency matters more for the target system.

Where Each One Wins

The AMD Ryzen AI Embedded P174 wins in multi-threaded scenarios. With 20 threads versus 8, it can handle heavily parallel workloads such as software compilation, video encoding, virtual machine hosting, or database processing with substantially more parallelism. The 5.00 GHz boost clock also gives it an edge in single-threaded burst workloads where peak frequency matters.

AMD wins in memory-heavy applications. The 89.6 GB/s memory bandwidth and LPDDR5X support allow it to feed data to cores faster. The 16 MB L3 cache is 6 MB larger than Intel's, which helps with working sets that fit in shared cache. ECC memory support makes it suitable for data integrity-critical environments like servers or financial computing.

AMD wins in expansion-heavy systems. The 16 PCIe Gen 4 lanes double Intel's 8 lanes. This supports more NVMe storage devices or a discrete GPU without lane sharing.

The Intel Core 3 100UL wins in power-constrained environments. The 15 watt TDP is 13 watts lower than AMD's 28 watts. For fanless designs, small form factor industrial PCs, or systems that run continuously on limited power budgets, this difference matters.

Intel wins in DDR4 compatibility. Systems with existing DDR4 memory infrastructure can use the Core 3 100UL without migrating to DDR5. This matters for cost-sensitive upgrades or industrial systems with long lifecycles.

Intel wins in per-core L2 cache. At 1.25 MB per core versus AMD's 1 MB per core, Intel provides a 25% larger L2 allocation per core. Workloads that repeatedly access a small per-core working set may see slightly lower latency on the Intel part.

The AMD part is newer by roughly two years, which shows up in its smaller process node, higher core count, and modern memory support. The Intel part is older but draws less power and supports older memory types. Each processor fits a different niche: AMD for compute density, Intel for power economy.