AMD Ryzen 5 7500X3D vs AMD Ryzen AI 7 PRO 350 Comparison

AMD
AMD

AMD Ryzen 5 7500X3D

CORE STATE Raphael
CORE SPECS 6 Cores / 12 Threads
CLOCK SPEED 4 Base / 4.5 GHz Turbo
CACHE 96 MB (shared)
MAX TDP 65W
ARCHITECTURE Raphael
nm
PROCESS 5 nm
LAUNCH DATE 2025
VS
AMD
AMD

Ryzen AI 7 PRO 350

CORE STATE Krackan Point
CORE SPECS 8 Cores / 16 Threads
CLOCK SPEED 2 Base / 5 GHz Turbo
CACHE 8 MB
MAX TDP 28W
ARCHITECTURE Zen 5
nm
PROCESS 4 nm
LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

passmark_data_compression
271,649
281,834
passmark_data_encryption
15,797
14,462
passmark_extended_instructions
20,455
19,955
passmark_find_prime_numbers
221
81
passmark_floating_point_math
43,594
51,639
passmark_integer_math
70,774
84,868
passmark_multithread
25,047
23,994
passmark_physics
2,779
1,318
passmark_random_string_sorting
32,999
31,071
passmark_single_thread
3,494
3,872
passmark_singlethread
3,494
3,872
cinebench_cinebench_r15_multicore
N/A
2,336.5
cinebench_cinebench_r15_singlecore
N/A
247
cinebench_cinebench_r23_multicore
N/A
14,278.5
cinebench_cinebench_r23_singlecore
N/A
1,954

Analysis: AMD Ryzen 5 7500X3D vs AMD Ryzen AI 7 PRO 350

Where Each One Wins

The recorded benchmark data splits the two processors along a clear workload boundary. The AMD Ryzen 5 7500X3D wins 6 of the 11 head-to-head tests, while the AMD Ryzen AI 7 PRO 350 wins 5. The desktop chip, built on the Raphael design, dominates in tests that stress memory latency, core scheduling, and specialized instruction paths. The mobile chip, Krackan Point, takes the lead in raw arithmetic throughput, floating-point number crunching, and single-thread responsiveness.

The Ryzen 5 7500X3D’s wins are concentrated in workloads where its 96 MB of shared L3 cache can absorb repeated data access. Data encryption shows a 9.2% advantage, extended instructions a 2.5% edge, and random string sorting a 6.2% margin. The most dramatic separation appears in prime number finding, where the desktop part scores 221 versus 81, a 172.8% gap. Physics simulation also favors the 7500X3D heavily, at 110.8% ahead. These results point to a processor that thrives when data sets fit into its massive cache and when the workload involves irregular access patterns or branch-heavy logic.

The Ryzen AI 7 PRO 350 counters with wins in integer math, floating-point math, data compression, and both single-thread tests. Its integer math score of 84868 beats the 7500X3D’s 70774 by 16.6%. Floating-point math shows a 15.6% advantage. Data compression, which often benefits from higher memory bandwidth, goes to the mobile chip by 3.6%. The single-thread score of 3872 versus 3494 gives the AI 7 PRO 350 a 9.8% lead, indicating that its higher 5.00 GHz boost clock and Zen 5 architecture deliver better per-core performance in latency-sensitive tasks. The multithread test, however, goes the other way: the 7500X3D scores 25047 against 23994, a 4.4% win, despite having fewer cores and threads.

Architecture Differences

The two chips come from different design philosophies. The Ryzen 5 7500X3D is a desktop processor from the 7000 series, built on the Raphael codename and the Zen 4 architecture. It uses a 5 nm process from TSMC with 11,270 million transistors on a 71 mm² die. The Ryzen AI 7 PRO 350 is a mobile part from the Ryzen AI PRO 300 generation, using the Krackan Point codename with Zen 5 and Zen 5c cores. It moves to a 4 nm TSMC process with a much larger 195 mm² die, though its transistor count is not recorded in the database.

Cache configurations diverge sharply. The 7500X3D provides 64 KB of L1 per core, 1 MB of L2 per core, and 96 MB of shared L3 cache. The AI 7 PRO 350 offers 80 KB of L1 per core, 1 MB of L2 per core, but only 8 MB of total L3. That 88 MB difference in L3 capacity is the single largest architectural gap and explains why the desktop chip excels in cache-sensitive workloads. The mobile chip compensates with a different core layout: 8 cores and 16 threads versus 6 cores and 12 threads, and it uses a hybrid Zen 5 / Zen 5c design that likely trades some peak performance for efficiency.

Memory support also differs. The 7500X3D supports DDR5 with dual-channel access and 83.2 GB/s of bandwidth. The AI 7 PRO 350 supports both DDR5 and LPDDR5X, also dual-channel, with a higher recorded bandwidth of 89.6 GB/s. Both support ECC memory. PCIe connectivity favors the desktop chip with Gen 5 and 24 lanes, while the mobile chip uses Gen 4 with 16 lanes. Integrated graphics are present on both, but the AI 7 PRO 350 uses the Radeon 860M, which is a more advanced integrated solution than the generic Radeon Graphics on the 7500X3D.

Head-to-Head Benchmarks

The largest single delta in the head-to-head data is the prime number test. The 7500X3D scores 221, the AI 7 PRO 350 scores 81, a 172.8% difference. This test often rewards large caches and efficient branch handling, and the desktop chip’s 96 MB L3 likely keeps the working set resident. The physics test shows a similar pattern: 2779 versus 1318, a 110.8% margin. Physics simulations frequently reuse data across iterations, so the cache advantage again comes to the fore.

The AI 7 PRO 350’s biggest wins are in integer and floating-point math. Integer math shows 84868 versus 70774, a 16.6% lead, while floating-point math shows 51639 versus 43594, a 15.6% lead. These are throughput-heavy tests that scale with core count and clock speed, and the mobile chip’s 8 cores and 5.00 GHz boost clock help it pull ahead. Data compression also favors the AI 7 PRO 350, 281834 versus 271649, a 3.6% margin, likely helped by its higher memory bandwidth of 89.6 GB/s.

The middle ground is occupied by tests where the 7500X3D wins by smaller margins. Extended instructions go 20455 to 19955, a 2.5% edge. Random string sorting goes 32999 to 31071, a 6.2% edge. Multithread goes 25047 to 23994, a 4.4% edge, even though the AI 7 PRO 350 has two more cores and four more threads. Data encryption goes 15797 to 14462, a 9.2% edge for the desktop chip. The single-thread tests are the only clear wins for the mobile chip outside of arithmetic, with 3872 versus 3494, a 9.8% margin in both the single_thread and singlethread entries.

Specification Differences

The two processors differ on nearly every core specification. The 7500X3D uses 6 cores and 12 threads, while the AI 7 PRO 350 uses 8 cores and 16 threads. Base clocks are 4.00 GHz versus 2.00 GHz, but boost clocks reverse the order: 4.50 GHz for the desktop chip and 5.00 GHz for the mobile chip. TDP is markedly different: 65 watts for the 7500X3D, 28 watts for the AI 7 PRO 350. The sockets are incompatible: AM5 for the desktop part, FP8 for the mobile part.

The process node shifts from 5 nm to 4 nm, and the die size from 71 mm² to 195 mm². Transistor count is listed for the 7500X3D but not for the AI 7 PRO 350. L1 cache per core is 64 KB versus 80 KB, while L3 cache is 96 MB versus 8 MB. Memory support expands from DDR5 to DDR5 plus LPDDR5X, and bandwidth rises from 83.2 GB/s to 89.6 GB/s. PCIe generation drops from Gen 5 to Gen 4, and lanes drop from 24 to 16. Integrated graphics change from Radeon Graphics to Radeon 860M. The release dates are about ten months apart: the 7500X3D launched on 2025-11-11, the AI 7 PRO 350 on 2025-01-05. The desktop chip has a launch MSRP of $269; the mobile chip has no recorded launch MSRP.

FAQ

Q: Which processor has more cores and threads?

A: The AMD Ryzen AI 7 PRO 350 has 8 cores and 16 threads, while the AMD Ryzen 5 7500X3D has 6 cores and 12 threads.

Q: Why does the Ryzen 5 7500X3D win the prime number test by such a large margin?

A: The 7500X3D scores 221 versus 81 for the AI 7 PRO 350, a 172.8% difference. The desktop chip’s 96 MB of shared L3 cache, compared to 8 MB on the mobile chip, likely keeps the working set resident and avoids repeated memory fetches.

Q: How does the single-thread performance compare?

A: The AI 7 PRO 350 scores 3872 in the passmark single-thread test, which is 9.8% ahead of the 7500X3D’s 3494. This aligns with its higher 5.00 GHz boost clock versus 4.50 GHz.

Q: Does the mobile chip have higher memory bandwidth?

A: Yes, the AI 7 PRO 350 records 89.6 GB/s versus 83.2 GB/s for the 7500X3D, despite both using dual-channel memory. The mobile chip also supports LPDDR5X in addition to DDR5.

Q: Which processor is more efficient in terms of TDP?

A: The AI 7 PRO 350 has a TDP of 28 watts, while the 7500X3D has a TDP of 65 watts. The mobile chip delivers comparable multithread performance (23994 versus 25047) with less than half the power envelope.

Q: What is the biggest cache difference?

A: The 7500X3D has 96 MB of shared L3 cache, while the AI 7 PRO 350 has 8 MB. The desktop chip also provides 64 KB of L1 per core versus 80 KB per core for the mobile chip, so the L3 gap is the dominant difference.

The Verdict

The data supports a clear use-case split. The AMD Ryzen 5 7500X3D is the better choice for workloads that repeatedly access a large data set: prime number finding, physics simulation, encryption, and random string sorting all show double-digit or larger advantages. Its 96 MB L3 cache and 65 watt TDP make it a desktop part that excels in cache-sensitive, latency-bound tasks. The 6-core, 12-thread configuration is sufficient for these workloads, as evidenced by its 4.4% multithread win over the 8-core mobile chip.

The AMD Ryzen AI 7 PRO 350 is the stronger part for throughput-oriented number crunching and single-thread responsiveness. Its integer math, floating-point math, and data compression scores all beat the 7500X3D, and its single-thread performance is nearly 10% higher. The 8-core, 16-thread design, combined with a 5.00 GHz boost clock, delivers better raw arithmetic throughput. Its 28 watt TDP and support for LPDDR5X make it a mobile part that can handle both productivity and efficiency demands.

The choice depends on the primary workload. For physics, encryption, or any task that benefits from a massive L3 cache, the 7500X3D is the recorded leader. For integer-heavy, floating-point-heavy, or single-thread-critical applications, the AI 7 PRO 350 holds the edge. Neither chip is a universal winner; the benchmark results show a 6-to-5 split that reflects architecture priorities rather than overall superiority.

DETAILED SPECIFICATIONS

SPECIFICATION
5 7500X3D
AI 7 PRO 350
Core Specs
Cores
6
8 +33.3%
Threads
12
16 +33.3%
Base Clock (GHz)
4
2 -50.0%
Boost Clock (GHz)
4.5
5 +11.1%
Frequency (GHz)
4
2 -50.0%
Turbo Clock (GHz)
4.5
5 +11.1%
Multiplier
40
20 -50.0%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
80 KB (per core)
L2 Cache
1 MB (per core)
1 MB (per core)
L3 Cache
96 MB (shared)
8 MB
Power
TDP (W)
65
28 -56.9%
PPT
88 W
—
Configurable TDP
—
15-54 W
Architecture
Architecture
—
Zen 5
Codename
Raphael
Krackan Point
Generation
Ryzen 5 (Zen 4 (Raphael))
Ryzen AI PRO 300 (Zen 5 / Zen 5c)
Process Size
5 nm
4 nm
Transistors
11,270 million
—
Die Size
71 mm²
195 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR5
DDR5, LPDDR5X
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
83.2 GB/s
89.6 GB/s
ECC Memory
Yes
Yes
Platform
Socket
AMD Socket AM5
AMD Socket FP8
Chipsets
X870E, X870, B850, B840, X670E, X670, B650E, B650, A620
—
PCIe
Gen 5, 24 Lanes(CPU only)
Gen 4, 16 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
—
4 + 4
E-Core Frequency
—
2000 MHz up to 3.5 GHz
AMD Multi-Die
IO Process Size
6 nm
—
AI/NPU
NPU
—
Yes / 50 TOPS
Graphics
Integrated Graphics
Radeon Graphics
Radeon 860M
Other
Market
Desktop
Mobile
Production Status
Active
Active
Launch Price
$269
—
Part Number
100-000001904
100-000000713
Package
FC-LGA1718
FP8
Tj Max
89°C
100°C
Bundled Cooler
None
—
View Ryzen 5 7500X3D Details View Ryzen AI 7 PRO 350 Details