AMD Ryzen 3 30 vs AMD Ryzen AI Embedded P174 Comparison

The Verdict

The AMD Ryzen 3 30 and the AMD Ryzen AI Embedded P174 serve completely different roles despite both being mobile-oriented AMD processors. The Ryzen 3 30 is a 4-core, 8-thread Zen 2 part built for efficiency-focused laptops, while the Ryzen AI Embedded P174 is a 10-core, 20-thread Zen 5 / Zen 5c hybrid designed for embedded AI workloads. The data shows that the Ryzen 3 30 sits at the 74th percentile among all CPUs in the database, with an average benchmark score of 20137. The Ryzen AI Embedded P174 holds a 50th percentile ranking with no recorded benchmark scores, meaning its average score is effectively zero in the current database. That gap is not a sign of poor performance; it indicates that the P174 has not yet been measured under the same benchmark suite. Any comparison must therefore rely on architectural and specification differences rather than direct score deltas.

For users seeking a proven, measured mobile processor with a strong single-thread score of 2465, the Ryzen 3 30 is the safer choice. Its multithread score of 9027 and floating point math score of 14448 show it can handle everyday computing, light productivity, and media consumption. For embedded systems engineers or developers targeting AI acceleration, the Ryzen AI Embedded P174 offers more cores, more threads, a higher boost clock, and a larger cache pool. The lack of benchmark data for the P174 means it cannot be validated against the same metrics yet. The verdict is clear: choose the Ryzen 3 30 for validated general-purpose mobile performance, and choose the P174 only if the specific embedded AI feature set and newer architecture matter more than measured results.

Architecture Differences

The Ryzen 3 30 uses the Zen 2 architecture under the Mendocino codename, fabricated on TSMC's 6 nm process. It features 4 cores and 8 threads, with a base clock of 2.40 GHz and a boost clock of 4.10 GHz. The thermal design power is 15 watts, which places it firmly in the low-power mobile segment. Its die size is 100 mm², and it uses an AMD Socket FT6. The cache hierarchy consists of 64 KB of L1 per core, 512 KB of L2 per core, and 4 MB of shared L3 cache. Memory support is limited to LPDDR5 in a dual-channel configuration, delivering 88.0 GB/s of bandwidth. It does not support ECC memory. The PCIe interface is Gen 3 with 4 lanes available from the CPU only. Integrated graphics come from the Radeon 610M.

The Ryzen AI Embedded P174 uses a hybrid design combining Zen 5 and Zen 5c cores under the Gorgon Point codename, fabricated on TSMC's 4 nm process. It has 10 cores and 20 threads, with a base clock of 2.00 GHz and a boost clock of 5.00 GHz. The thermal design power is 28 watts, nearly double that of the Ryzen 3 30. The die size is 233 mm², more than twice the area of the Mendocino chip. The P174 uses an AMD Socket FP8. Its cache layout is more generous: 80 KB of L1 per core, 1 MB of L2 per core, and 16 MB of L3 cache. Memory support includes both DDR5 and LPDDR5X in a dual-channel configuration, with a bandwidth of 89.6 GB/s. It supports ECC memory, which the Ryzen 3 30 does not. The PCIe interface is Gen 4 with 16 lanes from the CPU only. Integrated graphics are handled by the Radeon 880M.

The architectural gap is substantial. Zen 2 is a mature architecture from AMD's previous generation, while Zen 5 / Zen 5c represents a newer design with a different core topology. The 4 nm process node versus 6 nm indicates a denser transistor layout for the P174. The P174 also offers twice the L3 cache (16 MB versus 4 MB), more L2 per core (1 MB versus 512 KB), and more L1 per core (80 KB versus 64 KB). The PCIe generation and lane count differ significantly: Gen 3 with 4 lanes versus Gen 4 with 16 lanes. The P174 supports ECC memory, a feature absent from the Ryzen 3 30. These differences reflect the P174's positioning as an embedded processor for compute-heavy tasks, while the Ryzen 3 30 targets power-sensitive mobile devices.

Where Each One Wins

The Ryzen 3 30 wins in measured performance categories because it has actual benchmark data. Its best recorded scores include a data compression score of 135834, a data encryption score of 6461, an extended instructions score of 6075, and an integer math score of 29846. It also posts a random string sorting score of 14431 and a single-thread score of 2465. These numbers indicate a processor that can handle routine office workloads, web browsing, spreadsheet calculations, and light content creation. The 15-watt TDP makes it suitable for thin-and-light laptops where battery life and thermal management take priority. The Radeon 610M integrated GPU is sufficient for basic display output and video playback, though the data does not include graphics benchmarks.

The Ryzen AI Embedded P174 wins on raw specification counts. With 10 cores and 20 threads, it offers 2.5 times the core count and 2.5 times the thread count of the Ryzen 3 30. Its boost clock of 5.00 GHz is 22% higher than the Ryzen 3 30's 4.10 GHz. The 16 MB of L3 cache is four times larger. The PCIe Gen 4 interface with 16 lanes provides more connectivity bandwidth for embedded peripherals, accelerators, or storage devices. ECC memory support is a critical feature for reliability-sensitive embedded deployments. The Radeon 880M integrated GPU is a newer generation than the Radeon 610M, though no graphics benchmarks exist in the database to quantify the difference. The 28-watt TDP indicates the P174 can sustain higher performance under load, but it also requires more cooling and power delivery.

The use-case split is straightforward. The Ryzen 3 30 is for validated, measured mobile workloads where the 74th percentile ranking and an average benchmark score of 20137 provide confidence. The Ryzen AI Embedded P174 is for embedded platforms that need more cores, more threads, a newer architecture, and the flexibility of DDR5 or LPDDR5X memory. The absence of benchmark scores for the P174 means it cannot claim measured wins, but its architectural specifications suggest it is designed for heavier workloads than the Ryzen 3 30.

FAQ

Q: Which processor has a higher average benchmark score?

A: The AMD Ryzen 3 30 has an average benchmark score of 20137, while the AMD Ryzen AI Embedded P174 has an average benchmark score of 0 due to no recorded benchmark data.

Q: How do the core and thread counts compare between the two?

A: The Ryzen 3 30 has 4 cores and 8 threads. The Ryzen AI Embedded P174 has 10 cores and 20 threads.

Q: What memory types does each processor support?

A: The Ryzen 3 30 supports LPDDR5 memory only. The Ryzen AI Embedded P174 supports both DDR5 and LPDDR5X memory.

Q: Do these processors support ECC memory?

A: The Ryzen 3 30 does not support ECC memory. The Ryzen AI Embedded P174 does support ECC memory.

Q: Which processor has a higher boost clock?

A: The Ryzen AI Embedded P174 has a boost clock of 5.00 GHz, while the Ryzen 3 30 has a boost clock of 4.10 GHz.

Q: What is the process node for each chip?

A: The Ryzen 3 30 uses a 6 nm process node. The Ryzen AI Embedded P174 uses a 4 nm process node.

Head-to-Head Benchmarks

There are no direct head-to-head benchmark results in the database for these two processors. The head-to-head benchmark array is empty, and neither processor records a win count. This means any performance comparison must rely on the individual benchmark scores for the Ryzen 3 30 and the architectural specifications for the Ryzen AI Embedded P174.

For the Ryzen 3 30, the recorded scores provide a full picture of its measured capabilities. Its single-thread score of 2465 places it in a competitive position for everyday responsiveness. The multithread score of 9027 reflects the performance of 4 cores and 8 threads under parallel workloads. The floating point math score of 14448 and the integer math score of 29846 show balanced arithmetic throughput. The data compression score of 135834 is notably high, indicating strong performance in compression tasks such as file archiving or data transfer. The data encryption score of 6461 suggests modest encryption throughput, which is typical for a low-power mobile processor. The extended instructions score of 6075 covers SIMD and other instruction set extensions. The find prime numbers score of 20 is low, which is consistent with a processor that has only 4 cores and a 6 nm process node. The physics score of 436 is also low, reflecting the limited core count for physics simulations. The random string sorting score of 14431 shows decent sorting performance.

The Ryzen AI Embedded P174 has no benchmark scores. Its specifications suggest it would outperform the Ryzen 3 30 in multithreaded workloads, given 10 cores and 20 threads. The 5.00 GHz boost clock gives it a substantial single-thread advantage over the 4.10 GHz boost clock of the Ryzen 3 30. The 16 MB of L3 cache versus 4 MB should also improve data locality and reduce memory latency in cache-sensitive workloads. The 4 nm process node and Zen 5 / Zen 5c architecture likely provide better instructions per clock than Zen 2, though the database does not include IPC measurements. The Radeon 880M integrated GPU is a newer design than the Radeon 610M, which should improve graphics performance, but no graphics benchmarks exist to confirm this.

The biggest win for the Ryzen 3 30 is that it has measured data proving its performance level. The biggest win for the Ryzen AI Embedded P174 is its architectural superiority on paper. Without direct benchmarks, the P174 cannot be declared faster, but its specifications indicate it is designed for a higher performance tier.

Specification Differences

The Ryzen 3 30 and the Ryzen AI Embedded P174 differ in nearly every specification field. The Ryzen 3 30 has 4 cores and 8 threads, while the P174 has 10 cores and 20 threads. The base clock of the Ryzen 3 30 is 2.40 GHz, while the P174 has a base clock of 2.00 GHz. The boost clock of the Ryzen 3 30 is 4.10 GHz, while the P174 boosts to 5.00 GHz. The TDP of the Ryzen 3 30 is 15 watts, while the P174 has a TDP of 28 watts.

The socket types differ: the Ryzen 3 30 uses AMD Socket FT6, while the P174 uses AMD Socket FP8. The architecture of the Ryzen 3 30 is Zen 2 with the Mendocino codename, while the P174 uses Zen 5 / Zen 5c with the Gorgon Point codename. The process node for the Ryzen 3 30 is 6 nm, while the P174 uses 4 nm. The die size of the Ryzen 3 30 is 100 mm², while the P174 has a die size of 233 mm².

The cache configurations differ substantially. The Ryzen 3 30 has 64 KB of L1 per core, 512 KB of L2 per core, and 4 MB of shared L3. The P174 has 80 KB of L1 per core, 1 MB of L2 per core, and 16 MB of L3. Memory support for the Ryzen 3 30 is limited to LPDDR5, while the P174 supports DDR5 and LPDDR5X. The memory bandwidth of the Ryzen 3 30 is 88.0 GB/s, while the P174 offers 89.6 GB/s. ECC memory support is absent on the Ryzen 3 30 and present on the P174.

PCIe capabilities differ: the Ryzen 3 30 uses Gen 3 with 4 lanes from the CPU only, while the P174 uses Gen 4 with 16 lanes from the CPU only. The integrated graphics are the Radeon 610M on the Ryzen 3 30 and the Radeon 880M on the P174. The release dates also differ, with the Ryzen 3 30 releasing on 2025-09-30 and the P174 releasing on 2026-02-28. Both processors have a production status of Active, neither has a launch MSRP, and neither has an unlocked multiplier. The market segment for both is Mobile. The Ryzen 3 30 has a percentile rank of 74 among all CPUs, while the P174 has a percentile rank of 50. The average benchmark score for the Ryzen 3 30 is 20137, while the P174 has an average benchmark score of 0.