AMD Ryzen 3 110 vs Qualcomm Snapdragon X2E-96-100 Comparison

Head-to-Head Benchmarks

The recorded data for the AMD Ryzen 3 110 and the Qualcomm Snapdragon X2E-96-100 contains no completed benchmark runs in the database. Both processors have an average benchmark score of zero, and the head-to-head benchmark array is empty. This means there are no measured performance deltas, no percentile comparisons, and no per-test victories to report between these two mobile chips. The absence of data is itself informative: the AMD part is a 4-core Zen 3+ design aimed at thin-and-light notebooks, while the Qualcomm part is an 18-core Snapdragon X2 Elite part with a much broader core configuration. Without actual scores, any numeric comparison must rely on the architectural and specification fields present in the database, not on executed tests.

The database records a percentile versus all CPUs of 50 for both parts, which indicates that neither chip has been ranked against the full historical dataset yet. A percentile of 50 is the neutral midpoint in the database's ranking system, and it should not be interpreted as a measured performance result. It simply reflects the default position for entries that have no benchmark data. Until workloads are run and scores are recorded, the head-to-head section remains a placeholder. What can be analyzed are the raw specifications: core count, clock rates, cache hierarchy, memory interfaces, and process node. These fields provide the basis for a projected performance discussion, but they are not substitutes for measured scores. The data shows no wins for either side, no losses, and no margins. That is the honest state of the record.

The Verdict

From the data alone, neither processor can be declared a winner in any measured benchmark. The database has no scores for either chip, so a verdict based on executed tests is impossible. However, the specification fields point to two very different design goals. The AMD Ryzen 3 110 uses 4 cores and 8 threads with a base clock of 3.00 GHz and a boost clock of 4.30 GHz. It is built on a 6 nm process at TSMC, with a 28 W TDP, and it pairs with DDR5 memory on a dual-channel bus delivering 76.8 GB/s of bandwidth. The Qualcomm Snapdragon X2E-96-100 uses 18 cores and 18 threads, with a base clock of 4.45 GHz and a boost clock of 5.00 GHz. It is built on a 3 nm process at TSMC, has no TDP field recorded, and uses LPDDR5X memory on a triple-channel bus delivering 228.6 GB/s of bandwidth. These are starkly different configurations.

The data indicates that the Snapdragon part has a substantial core-count advantage, higher clock rates, a smaller process node, and a much wider memory subsystem. The AMD part has a lower core count but includes SMT, giving it 8 threads from 4 cores, and it supports ECC memory, which the Snapdragon does not. The AMD chip also has a lower process node number (6 nm versus 3 nm), but that is a manufacturing detail, not a performance metric. For buyers who prioritize raw multi-core throughput and memory bandwidth, the Snapdragon's specification sheet is far more aggressive. For buyers who need ECC support, a lower thermal envelope, or a mature x86 ecosystem, the AMD part has clear institutional advantages. The verdict, strictly from the recorded fields, is that the Snapdragon is the higher-specification part on paper, while the AMD part is the more conservative, lower-power option. Neither can claim a measured victory because no measurements exist.

Architecture Differences

The architectural gap between these two chips is wide. The AMD Ryzen 3 110 uses the Zen 3+ microarchitecture, codenamed Rembrandt-R, and belongs to the Ryzen 3 generation. It is built on a 6 nm process at TSMC and has a die size of 210 mm². The Zen 3+ core design is a refined version of Zen 3, with a focus on power efficiency for mobile platforms. The chip integrates a Radeon 660M GPU, which is an RDNA 2-based integrated graphics solution. The memory controller supports DDR5 in a dual-channel configuration, and the platform uses AMD Socket FP7. The CPU exposes 20 PCIe Gen 4 lanes, and ECC memory is supported. The cache hierarchy is simple: 64 KB of L1 per core, 512 KB of L2 per core, and 8 MB of shared L3.

The Qualcomm Snapdragon X2E-96-100 is a completely different design. It uses the Snapdragon X2 Elite generation, codenamed Glymur, and is built on a 3 nm process at TSMC with a die size of 220 mm². The architecture field is null in the database, meaning the microarchitecture name is not recorded, but the generation label indicates a Snapdragon X2 Elite product. The chip integrates an Adreno X2-90 GPU and supports LPDDR5X memory on a triple-channel bus. The cache layout is much larger and more complex: 288 KB of L1 per core, 16 MB of L2 per module, and 9 MB of shared L3. The PCIe interface is Gen 5 with 12 lanes. ECC memory is not supported. The socket is Qualcomm BGA 2343.

The core topology differs fundamentally. The AMD part uses 4 cores with 8 threads, meaning each core supports two threads via SMT. The Qualcomm part uses 18 cores with 18 threads, meaning no SMT is present; each core is a single thread. The Qualcomm part's per-core L1 and L2 are much larger, and the L3 is slightly larger (9 MB versus 8 MB). The process node difference (3 nm versus 6 nm) suggests the Qualcomm part can pack more transistors into a similar die area, though the die sizes are close: 220 mm² for Qualcomm, 210 mm² for AMD. Both are fabricated by TSMC, so the foundry is identical. The fundamental architecture split is x86 versus Arm-based Snapdragon silicon, a distinction that affects software compatibility, instruction sets, and power behavior, though the database does not record those details explicitly.

Specification Differences

The specification table shows clear divergence in nearly every field. Core count: AMD has 4, Qualcomm has 18. Threads: AMD has 8, Qualcomm has 18. Base clock: AMD is 3.00 GHz, Qualcomm is 4.45 GHz. Boost clock: AMD is 4.30 GHz, Qualcomm is 5.00 GHz. TDP: AMD is 28 W, Qualcomm has no recorded TDP. Process node: AMD is 6 nm, Qualcomm is 3 nm. Die size: AMD is 210 mm², Qualcomm is 220 mm². Memory support: AMD uses DDR5, Qualcomm uses LPDDR5X. Memory bus: AMD is dual-channel, Qualcomm is triple-channel. Memory bandwidth: AMD is 76.8 GB/s, Qualcomm is 228.6 GB/s. ECC: AMD supports it, Qualcomm does not. PCIe: AMD is Gen 4 with 20 lanes, Qualcomm is Gen 5 with 12 lanes. Integrated graphics: AMD has Radeon 660M, Qualcomm has Adreno X2-90. Socket: AMD Socket FP7 versus Qualcomm BGA 2343.

Release dates also differ. The AMD part has a release date of September 30, 2025. The Qualcomm part has a release date of April 5, 2026. The AMD part is therefore earlier to market by roughly half a year. The part numbers are recorded as 100-000000549 (FP7r2) for AMD and X2E96100 for Qualcomm. Neither chip has a recorded launch MSRP, so no pricing data is available. Both parts have a production status of Active. Neither has an unlocked multiplier. The market segment for both is Mobile. The L1 cache is 64 KB per core for AMD and 288 KB per core for Qualcomm. The L2 cache is 512 KB per core for AMD and 16 MB per module for Qualcomm. The L3 cache is 8 MB shared for AMD and 9 MB shared for Qualcomm. The memory bandwidth gap is the most dramatic specification difference: 228.6 GB/s versus 76.8 GB/s, a 3x advantage for the Qualcomm part.

FAQ

Q: How many cores and threads does each processor have?

A: The AMD Ryzen 3 110 has 4 cores and 8 threads. The Qualcomm Snapdragon X2E-96-100 has 18 cores and 18 threads.

Q: Which processor has the higher boost clock?

A: The Qualcomm Snapdragon X2E-96-100 has a boost clock of 5.00 GHz, while the AMD Ryzen 3 110 has a boost clock of 4.30 GHz.

Q: Do either of these chips support ECC memory?

A: The AMD Ryzen 3 110 supports ECC memory. The Qualcomm Snapdragon X2E-96-100 does not support ECC memory.

Q: What is the memory bandwidth difference?

A: The AMD Ryzen 3 110 delivers 76.8 GB/s over a dual-channel DDR5 bus. The Qualcomm Snapdragon X2E-96-100 delivers 228.6 GB/s over a triple-channel LPDDR5X bus.

Q: Which processor is built on a smaller process node?

A: The Qualcomm Snapdragon X2E-96-100 is built on a 3 nm process at TSMC. The AMD Ryzen 3 110 is built on a 6 nm process at TSMC.

Q: Are there any benchmark scores recorded for these chips?

A: No. Both processors have an average benchmark score of zero, and the head-to-head benchmark array is empty. The database has no measured performance data for either part.

Where Each One Wins

Based strictly on the specification fields, the Qualcomm Snapdragon X2E-96-100 wins on raw compute resources. It has 14 more cores, a higher base clock by 1.45 GHz, a higher boost clock by 0.70 GHz, a smaller process node (3 nm versus 6 nm), a larger L1 cache per core (288 KB versus 64 KB), a larger L2 cache per module (16 MB versus 512 KB per core), a slightly larger L3 cache (9 MB versus 8 MB), more memory bandwidth (228.6 GB/s versus 76.8 GB/s), and a newer PCIe generation (Gen 5 versus Gen 4). The triple-channel memory bus and the 3 nm node give it a clear specification advantage for heavily parallel workloads, AI inference, and memory-bound tasks. The Adreno X2-90 GPU is the integrated graphics solution, and the 18-core count suggests a design aimed at high-end mobile computing.

The AMD Ryzen 3 110 wins on the fields that favor efficiency and ecosystem compatibility. It has a recorded TDP of 28 W, while the Qualcomm part has no TDP recorded, so the AMD chip is documented as a low-power part. It supports ECC memory, which the Qualcomm part does not. It uses a dual-channel DDR5 bus, which is a standard desktop and laptop memory type, while the Qualcomm part uses LPDDR5X. The AMD part has 20 PCIe Gen 4 lanes versus 12 PCIe Gen 5 lanes for Qualcomm; the lane count is higher on AMD, though the generation is older. The AMD part also has an earlier release date, September 30, 2025, versus April 5, 2026 for Qualcomm. For workloads that depend on x86 software compatibility, mature driver stacks, or ECC validation, the AMD part is the more conservative choice. For workloads that scale with core count, memory bandwidth, and process efficiency, the Qualcomm part is the more aggressive option.

The data does not award a performance win to either side because no benchmark scores exist. The specification comparison, however, clearly favors the Qualcomm part for multi-threaded and memory-intensive scenarios, while the AMD part holds advantages in power envelope, ECC support, and PCIe lane count. The choice between them depends on which specification fields matter most to a given use case. The database records no measured victories, so any selection must be based on the architectural and specification differences outlined above.