AMD Ryzen 3 110 vs Qualcomm Snapdragon X1E-84-100 Comparison

Head-to-Head Benchmarks

The recorded database contains no direct head-to-head benchmark results for the AMD Ryzen 3 110 and the Qualcomm Snapdragon X1E-84-100. Both processors have an average benchmark score of 0, and the head-to-head benchmark array is empty. The percentile versus all CPUs is identical for both at 50, placing them at the exact midpoint of the database distribution. This lack of measured performance data means any comparison must rely on the architectural and specification differences recorded in the database rather than raw scores.

The absence of benchmark data is itself informative. The AMD Ryzen 3 110 is listed with 4 cores and 8 threads, while the Qualcomm Snapdragon X1E-84-100 carries 12 cores and 12 threads. In multi-threaded workloads, the core count difference suggests the Qualcomm part would have a structural advantage, but no recorded score confirms this. The Ryzen 3 110 has a base clock of 3.00 GHz and a boost clock of 4.30 GHz, whereas the Snapdragon X1E-84-100 starts at 3.80 GHz and boosts to 4.20 GHz. The AMD part has the higher boost ceiling, which typically benefits single-threaded responsiveness, but again, the database does not provide a measured delta.

Memory bandwidth differs substantially between the two. The AMD Ryzen 3 110 supports DDR5 with a recorded bandwidth of 76.8 GB/s, while the Qualcomm Snapdragon X1E-84-100 uses LPDDR5X and reaches 135.2 GB/s. That is a 76% higher memory bandwidth figure for the Qualcomm processor. Memory-heavy workloads such as data compression, large spreadsheet operations, or integrated graphics tasks often scale with bandwidth, so this recorded difference is a meaningful differentiator in the absence of direct scores.

The process node also diverges. The AMD Ryzen 3 110 is fabricated on a 6 nm process at TSMC, while the Qualcomm Snapdragon X1E-84-100 uses a 4 nm process at the same foundry. The smaller node typically allows higher transistor density and improved power efficiency, though the database does not include transistor counts for either part. The Qualcomm die size is not recorded, while the AMD die size is 210 mm².

Cache hierarchies are markedly different. The AMD Ryzen 3 110 has 64 KB of L1 per core, 512 KB of L2 per core, and 8 MB of shared L3. The Qualcomm Snapdragon X1E-84-100 has 288 KB of L1 per core, 12 MB of L2 per module, and 6 MB of shared L3. The Qualcomm part has more than four times the L1 per core and 24 times the L2 per module, while the AMD part has 2 MB more shared L3. These cache configurations suggest different design philosophies: AMD relies on a larger shared L3 for inter-core communication, while Qualcomm emphasizes per-core and per-module capacity.

Power envelopes differ as well. The AMD Ryzen 3 110 has a TDP of 28 watts, and the Qualcomm Snapdragon X1E-84-100 has a TDP of 35 watts. The 7-watt difference is modest but may influence sustained performance in thin-and-light mobile chassis. Neither processor has an unlocked multiplier, so overclocking is not a differentiator.

The Verdict

From the recorded data, the Qualcomm Snapdragon X1E-84-100 appears positioned for workloads that benefit from more cores and higher memory bandwidth. Its 12 cores and 12 threads double the core count of the AMD Ryzen 3 110, and its 135.2 GB/s memory bandwidth is 58.4 GB/s higher. The 4 nm process node also suggests a more modern manufacturing approach. These factors point toward multi-threaded productivity tasks, content creation, and memory-intensive applications.

The AMD Ryzen 3 110 is positioned differently. It has 4 cores and 8 threads, a higher boost clock of 4.30 GHz versus 4.20 GHz, and a lower TDP of 28 watts versus 35 watts. The smaller core count and lower power draw make it a candidate for lighter workloads where battery life and sustained single-thread performance matter more than raw multi-thread throughput. The 8 MB of shared L3 cache, larger than the Qualcomm's 6 MB, may help in workloads with moderate working sets that fit within that shared pool.

The database shows no benchmark scores, so neither processor can be declared a performance winner. The verdict must be conditional on the recorded specifications. Users whose workloads are heavily multi-threaded and memory-bound would align with the Qualcomm part's core count and bandwidth. Users prioritizing lower power consumption and a higher boost clock would align with the AMD part. Both processors sit at the 50th percentile in the database, indicating no recorded separation in overall standing.

FAQ

Q: Which processor has more cores?

A: The Qualcomm Snapdragon X1E-84-100 has 12 cores and 12 threads. The AMD Ryzen 3 110 has 4 cores and 8 threads.

Q: What is the memory bandwidth difference?

A: The Qualcomm Snapdragon X1E-84-100 has a memory bandwidth of 135.2 GB/s, while the AMD Ryzen 3 110 has 76.8 GB/s. The Qualcomm part has 58.4 GB/s more bandwidth.

Q: Which processor has the higher boost clock?

A: The AMD Ryzen 3 110 has a boost clock of 4.30 GHz. The Qualcomm Snapdragon X1E-84-100 has a boost clock of 4.20 GHz, which is 0.10 GHz lower.

Q: Do both processors use the same manufacturing process?

A: No. The AMD Ryzen 3 110 uses a 6 nm process at TSMC, and the Qualcomm Snapdragon X1E-84-100 uses a 4 nm process at TSMC.

Q: What are the TDP values?

A: The AMD Ryzen 3 110 has a TDP of 28 watts. The Qualcomm Snapdragon X1E-84-100 has a TDP of 35 watts.

Q: Which processor has more L3 cache?

A: The AMD Ryzen 3 110 has 8 MB of shared L3 cache. The Qualcomm Snapdragon X1E-84-100 has 6 MB of shared L3 cache.

Specification Differences

The two processors differ across nearly every recorded specification. The AMD Ryzen 3 110 has 4 cores and 8 threads; the Qualcomm Snapdragon X1E-84-100 has 12 cores and 12 threads. Base clocks are 3.00 GHz for AMD and 3.80 GHz for Qualcomm. Boost clocks are 4.30 GHz for AMD and 4.20 GHz for Qualcomm.

TDP is 28 watts for AMD and 35 watts for Qualcomm. The AMD socket is AMD Socket FP7, the Qualcomm socket is Qualcomm BGA 2073. The AMD processor uses DDR5 memory, the Qualcomm processor uses LPDDR5X. Memory bandwidth is 76.8 GB/s for AMD and 135.2 GB/s for Qualcomm. ECC memory support is true for AMD and false for Qualcomm.

PCIe lanes differ: AMD has Gen 4 with 20 lanes, Qualcomm has Gen 4 with 12 lanes. Integrated graphics are the Radeon 660M for AMD and the Adreno X1-85 for Qualcomm. Release dates are 2025-09-30 for AMD and 2024-04-23 for Qualcomm. Part numbers are 100-000000549(FP7r2) for AMD and X1E84100 for Qualcomm.

Architecture Differences

The AMD Ryzen 3 110 is built on the Zen 3+ architecture with the Rembrandt-R codename, part of the Ryzen 3 generation. The Qualcomm Snapdragon X1E-84-100 uses the Oryon codename within the Snapdragon X Elite generation. The AMD processor has no recorded architecture field beyond Zen 3+, while the Qualcomm architecture field is null in the database.

Process nodes differ: AMD uses 6 nm, Qualcomm uses 4 nm, both at TSMC. The AMD die size is recorded as 210 mm², while the Qualcomm die size is not recorded. Cache configurations are structurally different. AMD has 64 KB L1 per core, 512 KB L2 per core, and 8 MB shared L3. Qualcomm has 288 KB L1 per core, 12 MB L2 per module, and 6 MB shared L3.

The AMD processor supports DDR5 memory with ECC, while the Qualcomm processor supports LPDDR5X without ECC. The AMD integrated graphics are Radeon 660M, the Qualcomm integrated graphics are Adreno X1-85. The AMD processor has 20 PCIe Gen 4 lanes, the Qualcomm processor has 12 PCIe Gen 4 lanes.

Where Each One Wins

The Qualcomm Snapdragon X1E-84-100 wins on core count, memory bandwidth, and process node. Twelve cores versus four cores gives it a structural advantage in multi-threaded workloads. The 135.2 GB/s memory bandwidth versus 76.8 GB/s favors memory-intensive tasks. The 4 nm process node versus 6 nm suggests better manufacturing efficiency. The 3.80 GHz base clock versus 3.00 GHz also gives it a higher floor for sustained operation.

The AMD Ryzen 3 110 wins on boost clock, power draw, L3 cache, PCIe lanes, and ECC support. The 4.30 GHz boost clock versus 4.20 GHz favors single-threaded bursts. The 28 watt TDP versus 35 watts indicates lower power consumption. The 8 MB shared L3 versus 6 MB provides more shared cache. The 20 PCIe Gen 4 lanes versus 12 lanes offers more expansion bandwidth. ECC memory support is present on AMD and absent on Qualcomm.

The database records no benchmark wins for either processor, so these are specification-based advantages rather than measured performance victories. The Qualcomm part suits workloads that scale with cores and memory bandwidth. The AMD part suits workloads that favor single-thread speed, lower power, and ECC reliability.