AMD Ryzen 3 110 vs Qualcomm Snapdragon X1E-80-100 Comparison

Head-to-Head Benchmarks

The recorded database contains no benchmark scores for either the AMD Ryzen 3 110 or the Qualcomm Snapdragon X1E-80-100. The average benchmark score for both processors is 0, and the head-to-head benchmark array is empty. Without measured performance data, no direct comparison of wins or losses can be established from the database. Both processors hold a percentile rank of 50 against all CPUs, which indicates a median standing in the overall distribution, but this percentile is not derived from actual benchmark runs in the database.

The absence of benchmark results means that statements about relative speed, multi-threaded throughput, or single-core responsiveness cannot be substantiated with recorded numbers. The database shows no wins for either component (winsA: 0, winsB: 0), confirming that no performance advantage has been measured. This is a case where the specification sheet provides the only quantitative basis for comparison, and even then, architectural differences must be interpreted cautiously without performance validation.

Architecture Differences

The AMD Ryzen 3 110 is built on the Zen 3+ architecture, codenamed Rembrandt-R, and belongs to the Ryzen 3 generation. It uses a 6 nm process node manufactured by TSMC, with a die size of 210 mm². The Qualcomm Snapdragon X1E-80-100 uses the Oryon codename and belongs to the Snapdragon X (Elite) generation, built on a more advanced 4 nm process node, also by TSMC. The process node difference (6 nm versus 4 nm) suggests the Qualcomm part is fabricated with a denser transistor process, though the database does not list transistor counts for either chip.

Core counts differ substantially. The AMD processor has 4 cores and 8 threads, while the Qualcomm processor has 12 cores and 12 threads. The Qualcomm part does not support simultaneous multithreading, as its thread count equals its core count, whereas the AMD part uses SMT to double its threads from 4 to 8. This structural difference means the Qualcomm silicon has three times the physical cores, while the AMD silicon offers two threads per core.

Cache hierarchies are organized differently. The AMD Ryzen 3 110 has 64 KB of L1 per core, 512 KB of L2 per core, and 8 MB of shared L3 cache. The Qualcomm Snapdragon X1E-80-100 has 288 KB of L1 per core, 12 MB of L2 per module, and 6 MB of shared L3 cache. The larger L1 per core on the Qualcomm side (288 KB versus 64 KB) suggests a different cache design philosophy, while the AMD chip provides more shared L3 (8 MB versus 6 MB). The Qualcomm chip also has a module-based L2 allocation, which is not present in the AMD design.

Clock speeds differ in both base and boost. The AMD processor runs at a base clock of 3.00 GHz and boosts to 4.30 GHz. The Qualcomm processor has a higher base clock of 3.40 GHz but a lower boost clock of 4.00 GHz. This means the AMD chip has a 0.30 GHz higher boost ceiling, while the Qualcomm chip has a 0.40 GHz higher base frequency. The thermal design power also differs: the AMD part is rated at 28 watts TDP, while the Qualcomm part is rated at 35 watts TDP, a 7 watt difference.

Memory support is another divergence. The AMD Ryzen 3 110 supports DDR5 memory on a dual-channel bus, with a memory bandwidth of 76.8 GB/s. The Qualcomm Snapdragon X1E-80-100 supports LPDDR5X memory on a dual-channel bus, with a memory bandwidth of 135.2 GB/s. The Qualcomm part offers 58.4 GB/s more memory bandwidth, which is a 76% increase over the AMD part. ECC memory is supported by the AMD chip but not by the Qualcomm chip.

PCIe lane counts differ as well. The AMD processor provides Gen 4 with 20 lanes (CPU only), while the Qualcomm processor provides Gen 4 with 12 lanes (CPU only). The AMD chip has 8 more PCIe lanes available for CPU-attached devices. Integrated graphics also differ: the AMD part uses Radeon 660M, while the Qualcomm part uses Adreno X1-85. The sockets are different, with the AMD chip using AMD Socket FP7 and the Qualcomm chip using Qualcomm BGA 2073.

The release dates show a time gap. The Qualcomm Snapdragon X1E-80-100 was released on April 23, 2024, while the AMD Ryzen 3 110 was released on September 30, 2025. The AMD part is the newer release by approximately 17 months. Both processors have active production status and neither has an unlocked multiplier.

The Verdict

Based strictly on the data in the database, the Qualcomm Snapdragon X1E-80-100 offers more physical cores (12 versus 4), a higher base clock (3.40 GHz versus 3.00 GHz), a more advanced process node (4 nm versus 6 nm), and significantly more memory bandwidth (135.2 GB/s versus 76.8 GB/s). It also has more L1 cache per core (288 KB versus 64 KB) and more L2 cache per module (12 MB versus 512 KB per core on the AMD side). These specifications suggest that the Qualcomm part is designed for higher throughput in heavily parallel workloads, provided software can utilize all 12 cores.

The AMD Ryzen 3 110 counters with a higher boost clock (4.30 GHz versus 4.00 GHz), more shared L3 cache (8 MB versus 6 MB), more PCIe lanes (20 versus 12), ECC memory support, and a lower TDP (28 watts versus 35 watts). The higher boost clock and lower power envelope indicate that the AMD part may be better suited for bursty, lightly threaded tasks where a single core can reach a higher frequency without drawing as much power. The ECC memory support and larger L3 cache also point to a design favoring data integrity and latency-sensitive workloads.

Neither processor has measured benchmark scores in the database, so the verdict cannot be based on performance validation. The data supports a structural conclusion: the Qualcomm part appears oriented toward core-heavy, bandwidth-intensive workloads, while the AMD part appears oriented toward frequency-sensitive, power-conscious tasks with fewer threads. The choice between them depends on which specification priorities match the intended workload, but no empirical performance data in the database confirms one as superior.

FAQ

Q: Which processor has more cores and threads?

A: The Qualcomm Snapdragon X1E-80-100 has 12 cores and 12 threads. The AMD Ryzen 3 110 has 4 cores and 8 threads.

Q: What are the base clock speeds of the two processors?

A: The AMD Ryzen 3 110 has a base clock of 3.00 GHz. The Qualcomm Snapdragon X1E-80-100 has a base clock of 3.40 GHz.

Q: Which processor has a higher boost clock?

A: The AMD Ryzen 3 110 has a boost clock of 4.30 GHz, which is 0.30 GHz higher than the Qualcomm Snapdragon X1E-80-100's boost clock of 4.00 GHz.

Q: Do both processors support ECC memory?

A: No. The AMD Ryzen 3 110 supports ECC memory. The Qualcomm Snapdragon X1E-80-100 does not support ECC memory.

Q: What is the memory bandwidth difference between the two?

A: The Qualcomm Snapdragon X1E-80-100 provides 135.2 GB/s of memory bandwidth, while the AMD Ryzen 3 110 provides 76.8 GB/s, a difference of 58.4 GB/s in favor of the Qualcomm part.

Q: Which processor was released earlier?

A: The Qualcomm Snapdragon X1E-80-100 was released on April 23, 2024. The AMD Ryzen 3 110 was released on September 30, 2025.

Where Each One Wins

The Qualcomm Snapdragon X1E-80-100 wins on physical core count, with 12 cores compared to the AMD Ryzen 3 110's 4 cores. This makes it structurally more capable for parallel workloads that scale across multiple threads, even without SMT. Its base clock of 3.40 GHz is also higher, which could benefit sustained workloads that operate at base frequency rather than relying on boost behavior.

The Qualcomm part also wins on memory bandwidth, offering 135.2 GB/s versus 76.8 GB/s. This is a 58.4 GB/s advantage, which could matter for memory-bound applications such as large data processing or integrated graphics tasks. The LPDDR5X support and the per-core L1 cache of 288 KB (versus 64 KB on the AMD chip) further favor this processor in scenarios where frequent cache hits and high memory throughput are critical.

The AMD Ryzen 3 110 wins on boost clock, reaching 4.30 GHz versus 4.00 GHz for the Qualcomm part. This 0.30 GHz advantage could translate to faster single-threaded execution in workloads that rely on one or two cores reaching peak frequency. The AMD chip also has more PCIe lanes (20 versus 12), supporting more CPU-attached devices such as NVMe drives or accelerators.

The AMD part wins on power efficiency by specification, with a 28 watt TDP versus 35 watts for the Qualcomm part. The lower TDP suggests it may generate less heat and require less robust cooling, though the database does not include thermal or power measurements. ECC memory support is another win for the AMD chip, which could be relevant for reliability-sensitive computing. The larger shared L3 cache (8 MB versus 6 MB) also gives the AMD processor an advantage in workloads that repeatedly access a moderate-sized working set.

Specification Differences

The following table summarizes the fields in the database where the two processors differ:

| Specification | AMD Ryzen 3 110 | Qualcomm Snapdragon X1E-80-100 |

|---|---|---|

| Cores | 4 | 12 |

| Threads | 8 | 12 |

| Base Clock | 3.00 GHz | 3.40 GHz |

| Boost Clock | 4.30 GHz | 4.00 GHz |

| TDP | 28 watts | 35 watts |

| Socket | AMD Socket FP7 | Qualcomm BGA 2073 |

| Architecture | Zen 3+ | (not listed) |

| Codename | Rembrandt-R | Oryon |

| Generation | Ryzen 3 (Zen 3+ (Rembrandt)) | Snapdragon X (Elite) |

| Process Node | 6 nm | 4 nm |

| Die Size | 210 mm² | (not listed) |

| L1 Cache | 64 KB (per core) | 288 KB (per core) |

| L2 Cache | 512 KB (per core) | 12 MB (per module) |

| L3 Cache | 8 MB (shared) | 6 MB (shared) |

| Memory Support | DDR5 | LPDDR5X |

| Memory Bandwidth | 76.8 GB/s | 135.2 GB/s |

| ECC Memory | Yes | No |

| PCIe | Gen 4, 20 Lanes (CPU only) | Gen 4, 12 Lanes (CPU only) |

| Integrated Graphics | Radeon 660M | Adreno X1-85 |

| Release Date | 2025-09-30 | 2024-04-23 |

| Part Number | 100-000000549 (FP7r2) | X1E80100 |

| Manufacturer | AMD | (not listed) |

Both processors share a dual-channel memory bus, active production status, mobile market segment, TSMC foundry, Gen 4 PCIe, and a locked multiplier. Neither has a launch MSRP listed in the database.