AMD Ryzen 3 110 vs AMD Ryzen Embedded 9700X Comparison

Where Each One Wins

The AMD Ryzen 3 110 and the AMD Ryzen Embedded 9700X occupy different corners of the processor market, and the benchmark data reflects that separation. The Ryzen 3 110 is a mobile-oriented part built for efficiency and compact systems, while the Ryzen Embedded 9700X is a desktop-class processor aimed at embedded workloads that need sustained multi-threaded throughput. In the recorded measurements, neither part has a single head-to-head benchmark win over the other, but the specification sheet points to clear domains of advantage. The Ryzen 3 110 wins on power efficiency and integrated graphics capability for its class, while the Ryzen Embedded 9700X wins on raw core count, clock speeds, cache size, and memory bandwidth. The Ryzen 3 110 uses a 28 W TDP, which is less than half of the 65 W TDP of the Ryzen Embedded 9700X, making the former the obvious choice for fanless or low-power embedded designs where heat dissipation is a constraint. The Ryzen Embedded 9700X, with 8 cores and 16 threads versus the Ryzen 3 110's 4 cores and 8 threads, is the part for workloads that scale across many threads, such as network appliances, industrial controllers, or multi-tenant virtualized environments.

The Ryzen 3 110 features a Radeon 660M integrated GPU, which is a more capable graphics solution than the generic Radeon Graphics found on the Ryzen Embedded 9700X. For applications that require display output with modest 3D acceleration, the Ryzen 3 110 holds the edge. However, the Ryzen Embedded 9700X delivers a substantially higher boost clock of 5.50 GHz versus 4.30 GHz, and its base clock of 3.80 GHz is nearly 27% higher than the Ryzen 3 110's 3.00 GHz. In single-threaded tasks that depend on clock speed rather than core count, the Embedded part wins. The Ryzen Embedded 9700X also supports PCIe Gen 5 with 24 lanes, while the Ryzen 3 110 is limited to PCIe Gen 4 with 20 lanes, so the former provides more headroom for high-bandwidth peripherals like NVMe storage or accelerators. The memory bandwidth figures tell a similar story: the Ryzen Embedded 9700X reaches 89.6 GB/s, while the Ryzen 3 110 maxes out at 76.8 GB/s. Both parts use DDR5 and dual-channel memory, but the Embedded chip has a wider effective throughput path.

The Verdict

The data indicates that the Ryzen 3 110 is the appropriate selection for low-power mobile or embedded systems where the 28 W TDP and the Radeon 660M GPU are critical. The Ryzen Embedded 9700X is the superior choice for performance-oriented embedded or desktop applications that need 8 cores, 16 threads, high clocks, and the latest PCIe generation. The Ryzen 3 110 has a 50th percentile ranking among all CPUs, and the Ryzen Embedded 9700X also sits at the 50th percentile, meaning both parts are mid-pack in the overall database, but their strengths are orthogonal. For a system that prioritizes idle efficiency and integrated graphics, the Ryzen 3 110 delivers. For a system that prioritizes compute density and memory bandwidth, the Ryzen Embedded 9700X is the one to pick. The Ryzen 3 110 is not unlocked, so overclocking is off the table; the Ryzen Embedded 9700X has an unlocked multiplier, allowing tuning for those who need it. Neither part has a launch MSRP listed in the database, so pricing is not a distinguishing factor here. The production status for both is active, and the Ryzen Embedded 9700X was released on 2025-10-06, just six days after the Ryzen 3 110's 2025-09-30 release date.

Head-to-Head Benchmarks

The head-to-head benchmark table is empty, and the wins count for both parts is zero, so there are no direct measured comparisons to walk through. The analysis must rely on the specification differences and the percentile rankings. The Ryzen Embedded 9700X has twice the cores and twice the threads of the Ryzen 3 110: 8 cores and 16 threads versus 4 cores and 8 threads. In multi-threaded workloads, the Embedded part should outperform the Ryzen 3 110 by a wide margin, though no exact percentage is recorded. The Ryzen Embedded 9700X also has a 5.50 GHz boost clock versus 4.30 GHz, a 27.9% higher boost frequency, which translates to a clear advantage in single-threaded tasks. The L3 cache is 32 MB shared on the Embedded part versus 8 MB shared on the Ryzen 3 110, a 4x difference that reduces memory latency for frequently accessed data. The L2 cache is 1 MB per core on the Ryzen Embedded 9700X versus 512 KB per core on the Ryzen 3 110, and the L1 cache is 80 KB per core versus 64 KB per core. All of these cache deltas favor the Embedded chip.

The memory bandwidth difference is 12.8 GB/s in favor of the Ryzen Embedded 9700X, which also supports PCIe Gen 5 with 24 lanes versus Gen 4 with 20 lanes on the Ryzen 3 110. The process node is a key differentiator: the Ryzen Embedded 9700X uses a 4 nm process with 8,315 million transistors and a die size of 70.6 mm², while the Ryzen 3 110 uses a 6 nm process with a die size of 210 mm². The smaller die and newer process give the Embedded part a transistor density advantage, though the Ryzen 3 110's larger die likely reflects its integrated graphics block. The Ryzen 3 110's Radeon 660M is a specific GPU model, whereas the Ryzen Embedded 9700X has a generic Radeon Graphics solution, so for display-only tasks the Ryzen 3 110 is more capable. The Ryzen 3 110 also has a lower TDP of 28 W, which is a 56.9% reduction from the 65 W TDP of the Ryzen Embedded 9700X.

FAQ

Q: Which processor has more cores?

A: The AMD Ryzen Embedded 9700X has 8 cores and 16 threads, while the AMD Ryzen 3 110 has 4 cores and 8 threads.

Q: What is the difference in boost clock speeds?

A: The Ryzen Embedded 9700X boosts to 5.50 GHz, which is 1.20 GHz higher than the Ryzen 3 110's 4.30 GHz boost clock.

Q: Which processor supports faster PCIe?

A: The Ryzen Embedded 9700X supports PCIe Gen 5 with 24 lanes, while the Ryzen 3 110 supports PCIe Gen 4 with 20 lanes.

Q: How does the L3 cache compare?

A: The Ryzen Embedded 9700X has 32 MB of shared L3 cache, while the Ryzen 3 110 has 8 MB of shared L3 cache, a 4x difference.

Q: Which processor has a lower TDP?

A: The Ryzen 3 110 has a 28 W TDP, which is significantly lower than the Ryzen Embedded 9700X's 65 W TDP.

Q: Are both processors based on the same architecture?

A: No. The Ryzen 3 110 uses Zen 3+ architecture with the Rembrandt-R codename, while the Ryzen Embedded 9700X uses Zen 5 architecture with the Granite Ridge codename.

Architecture Differences

The Ryzen 3 110 is built on the Zen 3+ architecture with the codename Rembrandt-R, while the Ryzen Embedded 9700X uses the Zen 5 architecture with the codename Granite Ridge. This is a generational leap: Zen 3+ is a refresh of the Zen 3 design, while Zen 5 is a newer microarchitecture with a redesigned front end and wider execution units. The process nodes differ as well: the Ryzen 3 110 is fabricated on a 6 nm process at TSMC, while the Ryzen Embedded 9700X uses a 4 nm process at the same foundry. The transistor count is not listed for the Ryzen 3 110, but the Ryzen Embedded 9700X has 8,315 million transistors on a die size of 70.6 mm². The Ryzen 3 110 has a die size of 210 mm², which is nearly three times larger, likely due to the integrated Radeon 660M GPU and the older process node. The Ryzen 3 110 belongs to the Ryzen 3 generation (Zen 3+), while the Ryzen Embedded 9700X belongs to the 9000 series and the Ryzen Embedded generation (Zen 5). The socket also differs: the Ryzen 3 110 uses AMD Socket FP7, which is a mobile socket, while the Ryzen Embedded 9700X uses AMD Socket AM5, which is a desktop socket. The Ryzen Embedded 9700X has an unlocked multiplier, while the Ryzen 3 110 does not, a feature difference tied to their respective market segments.

Specification Differences

The two processors differ in nearly every major specification field. The Ryzen 3 110 has 4 cores and 8 threads, while the Ryzen Embedded 9700X has 8 cores and 16 threads. The base clock is 3.00 GHz on the Ryzen 3 110 versus 3.80 GHz on the Ryzen Embedded 9700X, and the boost clock is 4.30 GHz versus 5.50 GHz. The TDP is 28 W versus 65 W, a 37 W difference. The socket is FP7 for the Ryzen 3 110 and AM5 for the Ryzen Embedded 9700X. The cache hierarchy differs at every level: L1 is 64 KB per core on the Ryzen 3 110 versus 80 KB per core on the Ryzen Embedded 9700X; L2 is 512 KB per core versus 1 MB per core; and L3 is 8 MB shared versus 32 MB shared. Memory bandwidth is 76.8 GB/s versus 89.6 GB/s, and PCIe support is Gen 4 with 20 lanes versus Gen 5 with 24 lanes. The integrated graphics are the Radeon 660M on the Ryzen 3 110 and generic Radeon Graphics on the Ryzen Embedded 9700X. The market segment is Mobile for the Ryzen 3 110 and Desktop for the Ryzen Embedded 9700X. The process node is 6 nm versus 4 nm, and the die size is 210 mm² versus 70.6 mm². The multiplier is locked on the Ryzen 3 110 and unlocked on the Ryzen Embedded 9700X. Both support DDR5 memory in dual-channel mode, and both support ECC memory. The release dates are 2025-09-30 for the Ryzen 3 110 and 2025-10-06 for the Ryzen Embedded 9700X.