AMD Ryzen 3 110 vs AMD Ryzen AI Max PRO 490 Comparison

Head-to-Head Benchmarks

The database contains no recorded head-to-head benchmark matches between the AMD Ryzen 3 110 and the AMD Ryzen AI Max PRO 490. Both processors have an average benchmark score of 0 and a percentile ranking of 50 among all CPUs in the database. This means neither part has accumulated any measured performance data, so direct numerical comparisons of application performance cannot be derived from the recorded measurements.

The absence of benchmark results does not indicate parity. The specification sheets reveal a substantial gap in core configuration, memory bandwidth, and graphics capability. The Ryzen 3 110 provides 4 cores and 8 threads, while the Ryzen AI Max PRO 490 provides 12 cores and 24 threads. That is a 3x difference in core count and a 3x difference in thread count. The Ryzen AI Max PRO 490 also boosts to 5.00 GHz versus 4.30 GHz for the Ryzen 3 110, and its base clock of 3.20 GHz sits above the Ryzen 3 110's 3.00 GHz base.

Memory bandwidth separates the two more sharply. The Ryzen 3 110 uses dual-channel DDR5 with 76.8 GB/s of bandwidth. The Ryzen AI Max PRO 490 uses quad-channel LPDDR5X with 273.1 GB/s. That is 3.55x the memory bandwidth, a decisive advantage for workloads that stream large datasets, such as integrated graphics rendering or data-parallel computation.

Integrated graphics also differ in tier. The Ryzen 3 110 carries a Radeon 660M, while the Ryzen AI Max PRO 490 carries a Radeon 8050S. The numerical performance gap between these iGPU units is not recorded in the database, but the naming hierarchy and the memory bandwidth difference suggest the Radeon 8050S operates under far more favorable conditions.

Process technology favors the Ryzen AI Max PRO 490. It uses a 4 nm TSMC node, while the Ryzen 3 110 uses a 6 nm TSMC node. Smaller geometry typically allows higher clock speeds and better power efficiency per transistor. The Ryzen AI Max PRO 490's TDP of 55 W is nearly double the Ryzen 3 110's 28 W, so the larger chip consumes more power while also delivering more cores and higher clocks.

Package size and cache layout differ as well. The Ryzen 3 110 has a die size of 210 mm², while the Ryzen AI Max PRO 490 uses a chiplet design with two dies of 70.6 mm² each, for a combined area of about 141.2 mm². The Ryzen AI Max PRO 490 includes 64 MB of shared L3 cache, versus 8 MB shared L3 on the Ryzen 3 110. Per-core L2 cache also differs: 1 MB per core on the Ryzen AI Max PRO 490 versus 512 KB per core on the Ryzen 3 110. L1 cache is 80 KB per core versus 64 KB per core.

FAQ

Q: Which processor has more cores and threads?

A: The AMD Ryzen AI Max PRO 490 has 12 cores and 24 threads. The AMD Ryzen 3 110 has 4 cores and 8 threads. The Ryzen AI Max PRO 490 offers triple the core count and triple the thread count.

Q: What are the boost clock speeds of each processor?

A: The AMD Ryzen AI Max PRO 490 boosts to 5.00 GHz. The AMD Ryzen 3 110 boosts to 4.30 GHz. The Ryzen AI Max PRO 490 also has a higher base clock at 3.20 GHz versus 3.00 GHz.

Q: How much memory bandwidth does each processor support?

A: The AMD Ryzen 3 110 supports dual-channel DDR5 with 76.8 GB/s of memory bandwidth. The AMD Ryzen AI Max PRO 490 supports quad-channel LPDDR5X with 273.1 GB/s of memory bandwidth, which is 3.55x higher.

Q: What integrated graphics do the two processors use?

A: The AMD Ryzen 3 110 uses a Radeon 660M. The AMD Ryzen AI Max PRO 490 uses a Radeon 8050S.

Q: What process nodes are used for each chip?

A: The AMD Ryzen 3 110 is built on a 6 nm TSMC process. The AMD Ryzen AI Max PRO 490 is built on a 4 nm TSMC process.

Q: What is the TDP of each processor?

A: The AMD Ryzen 3 110 has a TDP of 28 W. The AMD Ryzen AI Max PRO 490 has a TDP of 55 W.

Q: How much L3 cache does each processor have?

A: The AMD Ryzen 3 110 has 8 MB of shared L3 cache. The AMD Ryzen AI Max PRO 490 has 64 MB of shared L3 cache, eight times more.

The Verdict

The recorded data shows two processors aimed at different performance envelopes. The AMD Ryzen 3 110 is a 4-core, 8-thread mobile part with a 28 W TDP, dual-channel DDR5 memory, and a 6 nm TSMC node. The AMD Ryzen AI Max PRO 490 is a 12-core, 24-thread mobile part with a 55 W TDP, quad-channel LPDDR5X memory, and a 4 nm TSMC node. Every major specification in the database favors the Ryzen AI Max PRO 490: core count, thread count, base clock, boost clock, L3 cache, per-core L2 cache, per-core L1 cache, memory bandwidth, memory channel count, process node, and integrated graphics tier.

The Ryzen 3 110 holds advantages only in a few specific areas. Its die area of 210 mm² is larger than the combined 2x 70.6 mm² of the Ryzen AI Max PRO 490, which is not a performance benefit but a packaging observation. Its TDP is lower at 28 W versus 55 W, making it the more power-efficient choice for thermally constrained systems. Its PCIe configuration offers 20 lanes versus 16 lanes on the Ryzen AI Max PRO 490, both Gen 4. The Ryzen 3 110 also uses dual-channel DDR5, which is a simpler memory topology than quad-channel LPDDR5X.

Both parts lack recorded benchmark scores and have a percentile ranking of 50 in the database, so the verdict rests entirely on the specification data. For workloads that scale with core count, thread count, cache size, and memory bandwidth, the Ryzen AI Max PRO 490 is the clear choice. For lightweight mobile systems where power draw is the limiting factor, the Ryzen 3 110's 28 W TDP makes it the more restrained option. Neither part has a launch MSRP recorded in the database, so cost-based selection cannot be assessed from the data.

The Ryzen 3 110 targets the entry-level mobile segment with a modest 4-core configuration and a Radeon 660M iGPU. The Ryzen AI Max PRO 490 targets a higher-performance mobile segment with a 12-core configuration, 64 MB of L3 cache, and a Radeon 8050S iGPU. The release dates differ by roughly eight months: the Ryzen 3 110 launched on September 30, 2025, and the Ryzen AI Max PRO 490 launched on May 19, 2026. Both parts remain in active production.

Specification Differences

The two processors differ across nearly every recorded specification field. The Ryzen 3 110 has 4 cores and 8 threads; the Ryzen AI Max PRO 490 has 12 cores and 24 threads. Base clock is 3.00 GHz versus 3.20 GHz. Boost clock is 4.30 GHz versus 5.00 GHz. TDP is 28 W versus 55 W. Socket is AMD Socket FP7 versus AMD Socket FP11. Process node is 6 nm versus 4 nm, both fabricated by TSMC. Die size is 210 mm² versus 2x 70.6 mm². L1 cache is 64 KB per core versus 80 KB per core. L2 cache is 512 KB per core versus 1 MB per core. L3 cache is 8 MB shared versus 64 MB shared. Memory support is DDR5 versus LPDDR5X. Memory bus is dual-channel versus quad-channel. Memory bandwidth is 76.8 GB/s versus 273.1 GB/s. PCIe is Gen 4 with 20 lanes versus Gen 4 with 16 lanes. Integrated graphics is Radeon 660M versus Radeon 8050S. Part numbers are 100-000000549(FP7r2) versus 100-000002141. Release dates are September 30, 2025 versus May 19, 2026.

Both processors support ECC memory. Both are multiplier-unlocked false, meaning neither offers unlocked overclocking. Both are marketed for the mobile segment. Both have a production status of Active. Neither has a launch MSRP recorded in the database.

Architecture Differences

The Ryzen 3 110 uses the Zen 3+ architecture with the codename Rembrandt-R, belonging to the Ryzen 3 generation of Zen 3+ (Rembrandt) parts. The Ryzen AI Max PRO 490 uses the Zen 5 architecture with the codename Gorgon Halo, belonging to the Ryzen AI Max PRO generation of Zen 5 parts. The architecture generation gap is significant: Zen 3+ is a refresh of the Zen 3 design, while Zen 5 is a newer microarchitecture generation. The process node moves from 6 nm TSMC on the Ryzen 3 110 to 4 nm TSMC on the Ryzen AI Max PRO 490.

Cache hierarchy changes reflect the newer design. The Ryzen 3 110 provides 64 KB of L1 per core, 512 KB of L2 per core, and 8 MB of shared L3. The Ryzen AI Max PRO 490 provides 80 KB of L1 per core, 1 MB of L2 per core, and 64 MB of shared L3. The L3 cache jump from 8 MB to 64 MB is an 8x increase, which substantially improves the amount of data that can reside on-chip for repeated access. The per-core L2 doubling from 512 KB to 1 MB similarly benefits working sets that fit within a single core's private cache.

The memory architecture also differs at the system level. The Ryzen 3 110 uses dual-channel DDR5 with a memory bandwidth of 76.8 GB/s. The Ryzen AI Max PRO 490 uses quad-channel LPDDR5X with a memory bandwidth of 273.1 GB/s. The quad-channel configuration and faster memory technology combine to deliver 3.55x the bandwidth, which matters for the integrated GPU and for memory-bound compute workloads.

The integrated GPU architecture is not detailed in the database beyond the model names: Radeon 660M for the Ryzen 3 110 and Radeon 8050S for the Ryzen AI Max PRO 490. The Ryzen AI Max PRO 490's GPU benefits from the larger memory bandwidth pool and the newer platform. The Ryzen 3 110's Radeon 660M operates with a narrower memory bus and lower overall bandwidth.

The die layout differs as well. The Ryzen 3 110 uses a monolithic die of 210 mm². The Ryzen AI Max PRO 490 uses two dies of 70.6 mm² each, indicating a chiplet-based design. The combined die area of the Ryzen AI Max PRO 490 is approximately 141.2 mm², smaller than the Ryzen 3 110's monolithic 210 mm² die despite the former having three times the cores. This reflects the density advantage of the 4 nm process and the chiplet partitioning strategy.

The socket platforms are incompatible: AMD Socket FP7 for the Ryzen 3 110 and AMD Socket FP11 for the Ryzen AI Max PRO 490. Neither processor has an unlocked multiplier, so both rely on the platform's power management and boost behavior rather than user-controlled overclocking. Both support ECC memory, which is notable for mobile parts and indicates suitability for error-sensitive workloads.

The PCIe implementation differs in lane count. The Ryzen 3 110 provides Gen 4 with 20 lanes, while the Ryzen AI Max PRO 490 provides Gen 4 with 16 lanes. Both are CPU-only lane counts. The Ryzen 3 110 offers more PCIe lanes, which is a counterpoint to its lower overall performance class. The Ryzen AI Max PRO 490 compensates with a much larger memory bus and higher memory bandwidth, which can substitute for PCIe bandwidth in some accelerator and GPU workloads.

The release timeline places the Ryzen 3 110 about eight months earlier, with a launch date of September 30, 2025, versus May 19, 2026 for the Ryzen AI Max PRO 490. Both are listed as Active in production status, so both remain available in the market. The generation names in the database, "Ryzen 3 (Zen 3+ (Rembrandt))" for the Ryzen 3 110 and "Ryzen AI Max PRO (Zen 5)" for the Ryzen AI Max PRO 490, reinforce that these are different architectural eras with different design priorities: power efficiency and simplicity for the Ryzen 3 110, core count and memory throughput for the Ryzen AI Max PRO 490.