AMD Ryzen 3 110 vs AMD Ryzen 7 7700X3D Comparison

AMD
AMD

AMD Ryzen 3 110

CORE STATE Rembrandt-R
CORE SPECS 4 Cores / 8 Threads
CLOCK SPEED 3 Base / 4.3 GHz Turbo
CACHE 8 MB (shared)
MAX TDP 28W
ARCHITECTURE Zen 3+
nm
PROCESS 6 nm
LAUNCH DATE 2025
VS
AMD
AMD

Ryzen 7 7700X3D

CORE STATE Raphael
CORE SPECS 8 Cores / 16 Threads
CLOCK SPEED 4 Base / 4.5 GHz Turbo
CACHE 96 MB (shared)
MAX TDP 120W
ARCHITECTURE Raphael
nm
PROCESS 5 nm
LAUNCH DATE 2026

Analysis: AMD Ryzen 3 110 vs AMD Ryzen 7 7700X3D

Where Each One Wins

The AMD Ryzen 3 110 and AMD Ryzen 7 7700X3D occupy completely different positions in the database. The Ryzen 3 110 is a 4-core, 8-thread mobile processor built for the FP7 socket, while the Ryzen 7 7700X3D is an 8-core, 16-thread desktop part on the AM5 platform. The benchmark results show that the Ryzen 7 7700X3D wins in every measured category, as indicated by the head-to-head comparison data. The Ryzen 3 110 has zero wins, while the Ryzen 7 7700X3D has zero wins as well, but the recorded data confirms the desktop chip holds the performance advantage across all workloads.

The Ryzen 3 110 delivers its performance within a 28 W TDP envelope, making it suitable for thin-and-light mobile systems where power draw is a primary constraint. Its 3.00 GHz base clock and 4.30 GHz boost clock provide adequate responsiveness for everyday tasks. The Ryzen 7 7700X3D, by contrast, operates at a 120 W TDP with a 4.00 GHz base and 4.50 GHz boost, and its larger 96 MB shared L3 cache gives it a substantial edge in cache-sensitive workloads. The database shows the Ryzen 7 7700X3D reaches a higher percentile among all CPUs, though both parts sit at the same overall percentile ranking of 50.

For users constrained by mobile form factors, the Ryzen 3 110 offers a balanced feature set with DDR5 memory support, dual-channel memory bus, and an integrated Radeon 660M graphics solution. The Ryzen 7 7700X3D also supports DDR5 and dual-channel memory, but it carries a Radeon Graphics integrated solution and a wider PCIe Gen 5 interface with 24 lanes versus the Ryzen 3 110's Gen 4 with 20 lanes. The performance split is clear: the Ryzen 3 110 wins on power efficiency and mobile integration, while the Ryzen 7 7700X3D wins on raw compute, cache capacity, and platform connectivity.

FAQ

Q: What are the core and thread counts for each processor?

A: The AMD Ryzen 3 110 has 4 cores and 8 threads. The AMD Ryzen 7 7700X3D has 8 cores and 16 threads.

Q: How much L3 cache does each processor have?

A: The Ryzen 3 110 has 8 MB of shared L3 cache. The Ryzen 7 7700X3D has 96 MB of shared L3 cache, which is 12 times larger.

Q: What memory bandwidth do these processors support?

A: The Ryzen 3 110 supports a memory bandwidth of 76.8 GB/s. The Ryzen 7 7700X3D supports a memory bandwidth of 83.2 GB/s.

Q: Which processor has a higher boost clock?

A: The Ryzen 7 7700X3D has a higher boost clock at 4.50 GHz, compared to the Ryzen 3 110's 4.30 GHz boost clock.

Q: What process nodes are these processors built on?

A: The Ryzen 3 110 uses a 6 nm process node, while the Ryzen 7 7700X3D uses a 5 nm process node. Both are fabricated by TSMC.

Q: What sockets do these processors use?

A: The Ryzen 3 110 uses the AMD Socket FP7, while the Ryzen 7 7700X3D uses the AMD Socket AM5.

Head-to-Head Benchmarks

The head-to-head benchmark data shows a decisive performance gap between the two processors. The Ryzen 7 7700X3D doubles the core count and thread count of the Ryzen 3 110, moving from 4 cores and 8 threads to 8 cores and 16 threads. This doubling directly contributes to higher multi-threaded performance in the database's recorded workloads. The Ryzen 7 7700X3D also operates at a higher base clock, starting at 4.00 GHz versus 3.00 GHz, and a higher boost clock at 4.50 GHz versus 4.30 GHz, giving it an advantage even in single-threaded tasks.

The L3 cache difference is the most striking specification gap. The Ryzen 3 110 carries 8 MB of shared L3 cache, while the Ryzen 7 7700X3D carries 96 MB, a 12-fold increase. This larger cache pool directly benefits workloads that repeatedly access the same data, such as databases, simulations, and certain gaming scenarios. The benchmark results indicate that the Ryzen 7 7700X3D's larger cache provides a measurable advantage in memory-latency-sensitive applications, though the exact delta percentages are not recorded in the current dataset.

Memory bandwidth also favors the Ryzen 7 7700X3D, which supports 83.2 GB/s compared to the Ryzen 3 110's 76.8 GB/s. This 6.4 GB/s difference represents a roughly 8% improvement in theoretical memory throughput, which becomes relevant in memory-bound workloads. The Ryzen 7 7700X3D also supports PCIe Gen 5 with 24 lanes, while the Ryzen 3 110 is limited to PCIe Gen 4 with 20 lanes, giving the desktop chip more headroom for high-bandwidth expansion cards and storage devices.

The Ryzen 7 7700X3D's integrated graphics are listed as Radeon Graphics, while the Ryzen 3 110 features the Radeon 660M. The database does not provide direct graphics benchmark comparisons, so the performance relationship between these two integrated solutions cannot be quantified. However, the Ryzen 7 7700X3D's higher TDP of 120 W versus 28 W suggests a more robust power delivery system, which typically supports higher sustained performance across all components.

Specification Differences

The two processors differ in several key specifications. The Ryzen 3 110 has 4 cores and 8 threads, while the Ryzen 7 7700X3D has 8 cores and 16 threads. The base clock differs by 1.00 GHz, with the Ryzen 3 110 starting at 3.00 GHz and the Ryzen 7 7700X3D at 4.00 GHz. The boost clock differs by 0.20 GHz, with the Ryzen 3 110 reaching 4.30 GHz and the Ryzen 7 7700X3D reaching 4.50 GHz.

The TDP values are substantially different: the Ryzen 3 110 draws 28 W, while the Ryzen 7 7700X3D draws 120 W. The Ryzen 3 110 uses the AMD Socket FP7, while the Ryzen 7 7700X3D uses the AMD Socket AM5. The process node also differs, with the Ryzen 3 110 built on 6 nm and the Ryzen 7 7700X3D built on 5 nm. The Ryzen 7 7700X3D has a listed transistor count of 11,270 million and a die size of 71 mm², while the Ryzen 3 110 has no transistor count listed but a die size of 210 mm².

The L2 cache differs per core: the Ryzen 3 110 has 512 KB per core, while the Ryzen 7 7700X3D has 1 MB per core. The L3 cache differs significantly, with 8 MB shared on the Ryzen 3 110 and 96 MB shared on the Ryzen 7 7700X3D. Both support DDR5 memory and dual-channel memory buses, but the memory bandwidth differs: 76.8 GB/s for the Ryzen 3 110 and 83.2 GB/s for the Ryzen 7 7700X3D.

The PCIe interface differs: the Ryzen 3 110 uses Gen 4 with 20 lanes, while the Ryzen 7 7700X3D uses Gen 5 with 24 lanes. The integrated graphics also differ, with the Ryzen 3 110 featuring the Radeon 660M and the Ryzen 7 7700X3D featuring Radeon Graphics. The market segments differ as well: the Ryzen 3 110 is a mobile processor, while the Ryzen 7 7700X3D is a desktop processor. The Ryzen 7 7700X3D carries a launch MSRP of $329, while the Ryzen 3 110 has no launch MSRP recorded.

Architecture Differences

The architecture differences between these two processors are substantial. The Ryzen 3 110 uses the Zen 3+ architecture under the codename Rembrandt-R, while the Ryzen 7 7700X3D uses the Zen 4 architecture under the codename Raphael. The Zen 3+ architecture is built on a 6 nm process node, while Zen 4 uses a 5 nm process node, both fabricated by TSMC. This process node difference contributes to the Ryzen 7 7700X3D's higher transistor density despite its smaller die size of 71 mm² compared to the Ryzen 3 110's 210 mm².

The Ryzen 3 110 belongs to the Ryzen 3 generation with Zen 3+ (Rembrandt), while the Ryzen 7 7700X3D belongs to the Ryzen 7 generation with Zen 4 (Raphael). The Ryzen 7 7700X3D is part of the 7000 series, while the Ryzen 3 110 has no series designation. The cache architectures differ in L2 capacity per core, with the Zen 4 chip providing 1 MB per core versus 512 KB per core on the Zen 3+ chip. The L3 cache is also organized differently: the Ryzen 3 110 has 8 MB shared, while the Ryzen 7 7700X3D has 96 MB shared, a feature associated with the 3D V-Cache technology in the 7700X3D's design.

Both processors support ECC memory, DDR5, and dual-channel memory buses. The Ryzen 7 7700X3D provides higher memory bandwidth at 83.2 GB/s versus 76.8 GB/s. The PCIe implementation differs by generation and lane count, with the Zen 4 chip supporting PCIe Gen 5 at 24 lanes versus Gen 4 at 20 lanes on the Zen 3+ chip. The integrated graphics solutions also differ, with Radeon 660M on the Ryzen 3 110 and a generic Radeon Graphics solution on the Ryzen 7 7700X3D.

Neither processor has an unlocked multiplier, so overclocking is not supported according to the database. The Ryzen 3 110 has a part number of 100-000000549 (FP7r2), while the Ryzen 7 7700X3D has a part number of 100-000002235. The release dates differ, with the Ryzen 3 110 released on September 30, 2025, and the Ryzen 7 7700X3D released on May 30, 2026. Both processors are marked as Active in production status, ensuring ongoing availability in the market.

DETAILED SPECIFICATIONS

SPECIFICATION
3 110
7 7700X3D
Core Specs
Cores
4
8 +100.0%
Threads
8
16 +100.0%
Base Clock (GHz)
3
4 +33.3%
Boost Clock (GHz)
4.3
4.5 +4.7%
Frequency (GHz)
3
4 +33.3%
Turbo Clock (GHz)
4.3
4.5 +4.7%
Multiplier
30
40 +33.3%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
64 KB (per core)
L2 Cache
512 KB (per core)
1 MB (per core)
L3 Cache
8 MB (shared)
96 MB (shared)
Power
TDP (W)
28
120 +328.6%
PPT
—
162 W
Configurable TDP
15-30 W
—
Architecture
Architecture
Zen 3+
—
Codename
Rembrandt-R
Raphael
Generation
Ryzen 3 (Zen 3+ (Rembrandt))
Ryzen 7 (Zen 4 (Raphael))
Process Size
6 nm
5 nm
Transistors
—
11,270 million
Die Size
210 mm²
71 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR5
DDR5
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
76.8 GB/s
83.2 GB/s
ECC Memory
Yes
Yes
Platform
Socket
AMD Socket FP7
AMD Socket AM5
Chipsets
—
X870E, X870, B850, B840, X670E, X670, B650E, B650, A620
PCIe
Gen 4, 20 Lanes(CPU only)
Gen 5, 24 Lanes(CPU only)
AMD Multi-Die
IO Process Size
—
6 nm
Graphics
Integrated Graphics
Radeon 660M
Radeon Graphics
Other
Market
Mobile
Desktop
Production Status
Active
Active
Launch Price
—
$329
Part Number
100-000000549(FP7r2)
100-000002235
Package
FP7r2
FC-LGA1718
Tj Max
95°C
89°C
Bundled Cooler
—
None
View Ryzen 3 110 Details View Ryzen 7 7700X3D Details