Intel Core i3-13100TE

The Intel Core i3-13100TE is a 4-core, 8-thread desktop processor in Intel’s Core 13th Gen series, built on Raptor Lake architecture and manufactured on a 10 nm process. It runs at a 2.40 GHz base clock with a 4.10 GHz boost clock, and it carries 12 MB of shared L3 cache inside a 35 W TDP envelope. Its average benchmark score is 2887, which puts the chip at the 54th percentile among all CPUs in the database.

Single-Thread vs Multi-Thread Behavior

The benchmark split between single-thread and multi-thread performance is clear across the Cinebench family. In Cinebench R15, the 13100TE scores 909 multi-core and 128 single-core. In Cinebench R20, it scores 3788 multi-core and 534 single-core. In Cinebench R23, it scores 9020 multi-core and 1273 single-core. In every Cinebench revision, the multi-core score is substantially higher than the single-core score, which is exactly what a 4-core/8-thread chip should produce when all threads are busy. Geekbench tells a similar but more restrained story: 5703 multi-core and 1739 single-core. Geekbench’s mixed workload cannot always use all 8 threads at full intensity, so the multi-core advantage is less dramatic than in Cinebench’s fully threaded render loop.

The practical consequence is a balanced desktop profile. The 4.10 GHz boost clock and Raptor Lake core design handle responsive, lightly threaded tasks such as application startup and UI interaction. The 8 threads and the 12 MB shared L3 cache provide throughput for longer, multi-threaded jobs. The cache hierarchy reinforces this balance: each core has 80 KB of L1 and 1.25 MB of L2, while the shared L3 acts as a common pool across all 4 cores. Benchmark results indicate that the processor is not built around a single extreme; it offers strong per-core speed and a meaningful multi-thread step-up when the operating system or application can saturate all threads.

Platform and Compatibility

The 13100TE is a Desktop part on Intel Socket 1700, belonging to the Raptor Lake-S product line. It remains in Active production, and its part number is SRMFT. The memory controller supports both DDR4 and DDR5 in a dual-channel configuration, and ECC memory support is present. That combination gives builders a choice between two memory generations and extends the chip’s usefulness to systems where memory-error tolerance is important. The PCIe controller provides Gen 5 connectivity with 16 CPU-attached lanes; this is the CPU-only lane count, so the high-bandwidth path for add-in devices comes directly from the processor. The integrated UHD Graphics 730 supplies display output, meaning the processor can run a basic system without a discrete graphics card.

The die area is 163 mm², and the process node is Intel’s 10 nm process. The release date is 2023-01-03, placing the 13100TE in the early 2023 desktop window for Core 13th Gen. For an upgrade path, the boundaries are defined by the Intel Socket 1700 interface, the DDR4/DDR5 memory support, and the CPU-attached PCIe Gen 5 lanes. The multiplier is locked, so the platform does not include multiplier overclocking as an expected feature. This is a straightforward drop-in processor for Socket 1700 boards that support 13th Gen Core desktop parts and can accept DDR4 or DDR5 memory.

Benchmark Performance

The aggregate benchmark score of 2887 represents the chip’s overall position across the recorded workloads. In the all-CPU ranking, the 13100TE sits at the 54th percentile, meaning it outperforms a majority of the CPUs tracked in the database. The Cinebench R23 multi-core score of 9020 is the strongest multi-thread result in the set, while the R23 single-core score of 1273 shows the per-core capability of the Raptor Lake design. The older Cinebench R20 results, 3788 multi-core and 534 single-core, and the Cinebench R15 results, 909 multi-core and 128 single-core, follow the same pattern. Geekbench reports 5703 multi-core and 1739 single-core, confirming that the chip is a competent performer in both thread regimes.

The nearest-rival data puts the 13100TE in a tight competitive band. The Intel Core i7-11370H has an average score of 2882, with a delta of 0.2% in favor of the 13100TE. The Intel Core i5-11320H averages 2907, with a delta of -0.7%, meaning the 13100TE trails that rival. The AMD Ryzen 5 PRO 1600 averages 2909, also with a delta of -0.7%. The AMD Ryzen 3 PRO 5475U averages 2865, with a delta of 0.8% in favor of the 13100TE. The rival average scores all sit near the 13100TE’s 2887 figure, and the deltas are small enough that workload selection and benchmark revision could easily change which part appears faster in a given test.

How It Compares

Intel Core i7-11370H, The i7-11370H has an average score of 2882. The 13100TE’s 2887 is 0.2% higher, giving the Core i3 a marginal edge in aggregate performance. The two chips are effectively in the same performance class, with the benchmark data showing only a slight tilt toward the 13100TE.

Intel Core i5-11320H, The i5-11320H posts an average score of 2907. The -0.7% delta means the 13100TE trails this rival by a small margin. The data places the Core i5 ahead, but the narrow delta keeps the comparison close in practical terms.

AMD Ryzen 5 PRO 1600, The Ryzen 5 PRO 1600 averages 2909, the highest average among the nearest rivals. The -0.7% delta puts the 13100TE behind by the same margin it trails the i5-11320H. This makes the Ryzen 5 PRO the top performer in this immediate rival group.

AMD Ryzen 3 PRO 5475U, The Ryzen 3 PRO 5475U averages 2865, the lowest average in the nearest-rival group. The 0.8% delta gives the 13100TE an edge over this AMD part. The data shows the 13100TE sitting above this rival and below the Ryzen 5 PRO 1600, with the two Intel rivals occupying the same narrow band.

Power and Thermals

The 13100TE has a TDP of 35 W, which places it in a low-power desktop thermal class. A 35 W TDP means the cooling requirement is modest; a capable air cooler is sufficient for this processor. The 10 nm process and 163 mm² die size are the physical parameters behind that thermal envelope, and the locked multiplier means cooling does not need headroom for overclocking. The integrated UHD Graphics 730 also reduces the thermal load of a complete system by removing the need for a separate graphics card in builds that only require display output. The Active production status and Desktop market segment position the 13100TE as a current low-power desktop option whose thermal profile is a central part of its design.