AMD

AMD Ryzen Embedded V3C14

AMD processor specifications and benchmark scores

4
Cores
8
Threads
3.8
GHz Boost
15W
TDP
ECC Memory

At a Glance

AMD
Cores / Threads 4C / 8T
Boost Clock 3.8 GHz
Base Clock 2.3 GHz
L3 Cache 8 MB (shared)
TDP 15W
Architecture Zen 3+
Socket AMD Socket FP7
nm
Process 6 nm
Released Sep 2022

AMD Ryzen Embedded V3C14 Specifications

Ryzen Embedded V3C14 Core Configuration

Processing cores and threading

The AMD Ryzen Embedded V3C14 features 4 physical cores and 8 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
4
Threads
8
SMP CPUs
1

Embedded V3C14 Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Ryzen Embedded V3C14 benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Ryzen Embedded V3C14 by AMD can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
2.3 GHz
Boost Clock
3.8 GHz
Multiplier
23x

AMD's Ryzen Embedded V3C14 Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the Embedded V3C14 processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Ryzen Embedded V3C14's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
64 KB (per core)
L2 Cache
512 KB (per core)
L3 Cache
8 MB (shared)

Zen 3+ Architecture & Process

Manufacturing and design details

The AMD Ryzen Embedded V3C14 is built on AMD's 6 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in Embedded V3C14 incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
Zen 3+
Codename
Rembrandt
Process Node
6 nm
Foundry
TSMC
Generation
Ryzen Embedded (Zen 3+ (Rembrandt))

Zen 3+ Instruction Set Features

Supported CPU instructions and extensions

The Ryzen Embedded V3C14 by AMD supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
SSE2
SSE3
SSSE3
SSE4A
SSE4.1
SSE4.2
AES
AVX
AVX2
BMI1
BMI2
SHA
F16C
FMA3
AMD64
AMD-V
SMAP
SMEP
SMT
Precision Boost 2
XFR 2

Embedded V3C14 Power & Thermal

TDP and power specifications

The AMD Ryzen Embedded V3C14 has a TDP (Thermal Design Power) of 15W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
15W
Tj Max
105°C
Configurable TDP
10-25W

AMD Socket FP7 Platform & Socket

Compatibility information

The Ryzen Embedded V3C14 uses the AMD Socket FP7 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
AMD Socket FP7
PCIe
Gen 4, 20 Lanes(CPU only)
Package
FP7r2
DDR5

AMD Socket FP7 Memory Support

RAM compatibility and speeds

Memory support specifications for the Embedded V3C14 define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Ryzen Embedded V3C14 determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Type
DDR5
Memory Bus
Dual-channel
Memory Bandwidth
76.8 GB/s
ECC Memory
Supported

Ryzen Embedded V3C14 Product Information

Release and pricing details

The AMD Ryzen Embedded V3C14 is manufactured by AMD and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Ryzen Embedded V3C14 by AMD offers a specific balance of performance, features, and cost within AMD's product lineup.

Manufacturer
AMD
Release Date
Sep 2022
Market
Desktop
Status
Active
Part Number
100-000000557

Ryzen Embedded V3C14 Benchmark Scores

cinebench_cinebench_r15_multicoreSource

Cinebench R15 multi-core renders a complex 3D scene using all CPU threads simultaneously. This test reveals how AMD Ryzen Embedded V3C14 performs in parallel rendering workloads like video production and 3D animation. Higher scores mean faster render times in professional applications.

cinebench_cinebench_r15_multicore #884 of 1967
1,017
7%
Max: 14,978

cinebench_cinebench_r15_singlecoreSource

Cinebench R15 single-core measures the speed of one CPU thread rendering 3D geometry. This score indicates how AMD Ryzen Embedded V3C14 handles tasks that can't be parallelized across multiple cores. Games and many desktop applications still rely heavily on single-thread performance.

cinebench_cinebench_r15_singlecore #908 of 1400
143
7%
Max: 2,114

cinebench_cinebench_r20_multicoreSource

Cinebench R20 multi-core uses a scene requiring 4x more computational power than R15. This test better reflects modern CPU capabilities for professional rendering on AMD Ryzen Embedded V3C14.

cinebench_cinebench_r20_multicore #746 of 1786
4,241
7%
Max: 62,412

cinebench_cinebench_r20_singlecoreSource

Cinebench R20 single-core tests one thread against a more demanding scene than R15. This reveals the true single-thread rendering capability of AMD Ryzen Embedded V3C14.

cinebench_cinebench_r20_singlecore #741 of 1776
598
7%
Max: 8,811

cinebench_cinebench_r23_multicoreSource

Cinebench R23 multi-core is the current standard for CPU rendering benchmarks with a 10-minute minimum runtime. This extended test reveals sustained performance of AMD Ryzen Embedded V3C14 after thermal limits kick in.

cinebench_cinebench_r23_multicore #817 of 1938
10,099
7%
Max: 148,601
Compare with other CPUs

cinebench_cinebench_r23_singlecoreSource

Cinebench R23 single-core measures sustained single-thread performance over 10 minutes. This reveals how AMD Ryzen Embedded V3C14 maintains boost clocks under continuous load.

cinebench_cinebench_r23_singlecore #837 of 1923
1,425
7%
Max: 20,979

About AMD Ryzen Embedded V3C14

The AMD Ryzen Embedded V3C14 is a 4-core, 8-thread processor built on the Zen 3+ architecture (Rembrandt) using a 6 nm process from TSMC. Its average benchmark score of 2921 places it at the 54th percentile of all CPUs, indicating a solidly mid-range position. The data shows a processor that trades raw multi-threaded muscle for efficiency, making it a niche contender for specific workloads rather than a general-purpose champion.

Benchmark Performance

In Cinebench R23, the V3C14 scores 10099 points in multi-core and 1425 points in single-core. The multi-core result is the headline figure here, representing a substantial performance envelope for a 15-watt part. The single-core score of 1425 is modest, reflecting the processor’s embedded-market design focus on sustained efficiency over burst performance.

The average benchmark score of 2921 puts the V3C14 in a tightly contested cluster of rivals. It edges out the Intel Core i3-12100TE by a mere 0.2% (2915 vs 2921), a difference that is statistically negligible. The lead over the Intel Core i5-9600KF is 0.4% (2910 vs 2921), and the same 0.4% margin applies against the AMD Ryzen 5 PRO 1600 (2909). The largest gap is against the Intel Core i5-11320H, where the V3C14 leads by 0.5% (2907 vs 2921).

What these deltas reveal is that the V3C14 sits in a performance dead zone. It is neither faster nor slower than its nearest competitors in any meaningful way; it is effectively tied with all four. The 54th percentile ranking reinforces this, the processor is exactly average, no more, no less. The Cinebench R20 results (4241 multi-core, 598 single-core) and R15 results (1017 multi-core, 143 single-core) follow the same pattern, showing consistent scaling across benchmark versions.

Single-Thread vs Multi-Thread Behavior

The split between single-thread and multi-thread performance is stark. The Cinebench R23 single-core score of 1425 is low by modern standards, while the multi-core score of 10099 is respectable for a 4-core part. The ratio between the two, roughly 7.1 to 1, indicates that the processor scales well across its 8 threads, but each individual thread lacks the clock-driven punch seen in higher-end desktop chips.

The base clock of 2.30 GHz and boost clock of 3.80 GHz are modest figures. The boost clock is the key enabler for single-thread workloads, but the data suggests it cannot sustain high frequencies under load. For real-world applications, this means tasks that rely on a single thread, such as legacy software, certain database queries, or lightly threaded game logic, will feel slower than the multi-core scores might suggest. Conversely, workloads that can utilize all 8 threads, such as video encoding or compilation, will see near-linear scaling.

The 8 MB of shared L3 cache is adequate but not generous. Combined with the 64 KB L1 and 512 KB L2 per core, the cache hierarchy is typical for a Zen 3+ design. The dual-channel DDR5 memory support with 76.8 GB/s bandwidth ensures that multi-threaded data streaming does not become a bottleneck, which partially compensates for the lower clock speeds.

Who Should Consider It

The V3C14 is not a gaming processor. The single-core score of 1425 in Cinebench R23 is well below what modern game engines prefer, and the 8 MB L3 cache is small for large game worlds. Benchmark data indicates that frame-rate-sensitive workloads would struggle against even the i3-12100TE, which is itself a low-power part. Gamers should look elsewhere.

Creation workloads are a better fit, provided they are multi-threaded. The 10099-point multi-core score in Cinebench R23 means video rendering, 3D scene compilation, and batch photo processing will complete in reasonable time. The 8 threads and 76.8 GB/s memory bandwidth support sustained throughput. However, the processor will not excel in single-threaded creation tasks like Photoshop filters or certain audio plugins.

Office and productivity use cases are the sweet spot. The processor’s efficiency, evidenced by its 15-watt TDP, makes it ideal for always-on systems, thin clients, or embedded workstations. Spreadsheet recalculation, document compilation, and web-based workloads, which are often multi-threaded in modern browsers, will run smoothly. The ECC memory support adds reliability for data-sensitive environments.

How It Compares

Intel Core i3-12100TE: The V3C14 leads by 0.2% in average score, a tie in practical terms. Both are 4-core parts, but the i3-12100TE has a higher boost clock. The V3C14 counters with ECC memory support and a lower TDP, making it the better choice for fault-tolerant, power-constrained deployments.

Intel Core i5-9600KF: The V3C14 leads by 0.4%. The i5-9600KF is a 6-core, 6-thread part from an older generation. The V3C14’s 8 threads give it a multi-threaded edge in Cinebench R23 (10099 vs the i5’s lower score, inferred from the average delta). However, the i5-9600KF likely wins in single-thread due to higher clocks. The V3C14’s DDR5 support and ECC are its differentiators.

AMD Ryzen 5 PRO 1600: The V3C14 leads by 0.4%. The Ryzen 5 PRO 1600 is a 6-core, 12-thread first-generation Zen part. Despite having fewer cores, the V3C14 matches it on average, thanks to Zen 3+’s superior instructions-per-clock and higher memory bandwidth. The V3C14 is clearly the more modern and efficient design.

Intel Core i5-11320H: The V3C14 leads by 0.5%. The i5-11320H is a mobile part with 4 cores and 8 threads, same as the V3C14. The margin is the largest among rivals but still tiny. The V3C14’s advantage comes from its DDR5 memory subsystem, while the i5-11320H uses DDR4. Both are 15-watt parts, but the V3C14’s embedded pedigree offers better long-term availability.

Platform and Compatibility

The V3C14 uses AMD Socket FP7, a platform designed for embedded and mobile form factors. It is not compatible with mainstream AM4 or AM5 motherboards, which limits upgrade options to other FP7 processors. The architecture is Zen 3+ (Rembrandt), a refined version of Zen 3, fabricated on a 6 nm process.

Memory support is DDR5, operating on a dual-channel bus with a peak bandwidth of 76.8 GB/s. ECC memory is supported, which is critical for embedded applications where data corruption is unacceptable. PCIe connectivity is Gen 4 with 20 lanes from the CPU, providing ample bandwidth for NVMe storage and peripheral devices.

The multiplier is locked, meaning overclocking is not possible. The production status is Active, and the release date was September 26, 2022. The part number is 100-000000557. The platform’s upgrade path is constrained to the FP7 socket family, which is a closed ecosystem; users should plan for a full system replacement rather than a CPU swap.

FAQ

Q: What is the processor’s position relative to all CPUs?

A: It sits at the 54th percentile, meaning it outperforms slightly more than half of all tested CPUs.

Q: Does it support ECC memory?

A: Yes, ECC memory is supported, which is a key feature for reliability in embedded and server-like environments.

Q: What is the maximum memory bandwidth?

A: The dual-channel DDR5 bus provides 76.8 GB/s of memory bandwidth.

Q: How many PCIe lanes does it provide?

A: The CPU offers 20 PCIe Gen 4 lanes.

Q: Is the multiplier unlocked for overclocking?

A: No, the multiplier is locked, so the processor runs at its specified clock speeds only.

Q: What is the socket type?

A: It uses AMD Socket FP7, which is specific to embedded and mobile platforms.

Power and Thermals

The V3C14 has a TDP of 15 watts, placing it in the ultra-low-power class. This is the defining characteristic of the processor. The data shows that this power budget is sufficient to drive a 4-core, 8-thread design to a 10099-point multi-core score in Cinebench R23, which is an impressive efficiency ratio.

A 15-watt TDP implies that a passive cooler or a small, low-profile active cooler is sufficient for thermal management. There is no need for high-end liquid cooling or large tower air coolers. The 6 nm process from TSMC contributes to this efficiency, reducing leakage and heat generation. The boost clock of 3.80 GHz is achievable within this power envelope, but sustained multi-threaded loads will likely settle at lower frequencies to maintain the 15-watt limit.

For system integrators, this means simpler thermal design, smaller chassis, and lower fan noise. The trade-off is that the processor cannot sustain high clocks for prolonged periods, which is evident in the modest single-core scores. The 15-watt TDP makes the V3C14 suitable for fanless industrial PCs, network appliances, or compact embedded systems where heat dissipation is a primary constraint.

The Intel Equivalent of Ryzen Embedded V3C14

Looking for a similar processor from Intel? The Intel Core i5-13600KF offers comparable performance and features in the Intel lineup.

Intel Core i5-13600KF

Intel • 14 Cores

View Specs Compare

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