AMD Ryzen AI 9 HX 475

The AMD Ryzen AI 9 HX 475 is a mobile processor from the Ryzen AI 400 generation, built on the Zen 5 architecture with the codename Gorgon Point. It is manufactured on TSMC’s 4 nm process and listed for AMD Socket FP8. The chip provides 12 cores and 24 threads, with a base clock of 2.00 GHz and a boost clock of 5.20 GHz. It includes an integrated Radeon 890M GPU, and the market segment is Mobile.

Benchmark Performance

The database record for the Ryzen AI 9 HX 475 does not contain any benchmark measurements. The avgBenchmarkScore field is 0, and the nearestRivals array is empty. As a result, there are no scores from this processor to interpret and no deltaPct values to quote against rival CPUs. The only relative ranking field present is percentileVsAllCpus, with a value of 50. That places this processor at the median point of the all-CPU distribution in the dataset. This is not a measured performance result; it is a positional value that says half of the CPUs in the dataset sit above it and half sit below it, without indicating how large those gaps are.

Because the nearestRivals list is empty, exact statements such as “ahead of” or “behind” another processor cannot be made from this record. The data shows a specification stack that should be strong on paper for a 12-core / 24-thread mobile part, but benchmark validation is missing. The useful conclusion is that this database entry is currently a specification-only record. The 50th percentile should be read cautiously: it is a median placement, not a measured score, and it does not reveal whether the processor is closer to the lower or upper edge of its own performance class.

Platform and Compatibility

The AMD Ryzen AI 9 HX 475 uses AMD Socket FP8. The architecture is Zen 5, with the codename Gorgon Point, and the processor belongs to the Ryzen AI 400 (Zen 5 / Zen 5c) generation. The die is built by TSMC on a 4 nm process, with a listed die size of 233 mm². The record does not include a transistor count.

Memory support covers DDR5 and LPDDR5X, using a dual-channel memory bus. The listed memory bandwidth is 89.6 GB/s. ECC memory is not supported, so error-correcting memory is not an available feature for this part. That matters for workloads where data integrity in memory is a priority.

PCIe support is listed as Gen 4 with 16 lanes available from the CPU only. The record does not describe any additional chipset-provided lanes, so expansion beyond the CPU’s 16 lanes is outside the scope of this data. The integrated GPU is the Radeon 890M, which means the processor can handle display output without a discrete graphics card. The market segment is Mobile, so this is a platform intended for laptops and portable systems rather than desktop-style builds.

The multiplier is not unlocked, meaning user-controlled overclocking through the multiplier is not supported. The part number is 100-000001859, and production status is Active. Upgrade path information is limited: the record lists Socket FP8 but does not name any other compatible Socket FP8 processors. Potential drop-in upgrades on the same socket would depend on the specific mobile platform, firmware, and generation support, none of which are detailed in the fact pack.

Power and Thermals

The Ryzen AI 9 HX 475 has a TDP of 54 W. That is the only power-related number in the record. This is a moderate TDP for a mobile processor, and it indicates that the cooling solution should be designed to handle a 54 W-class part. The 4 nm process node helps keep power in check, but the fact pack does not include a separate maximum package power or sustained power figure.

The base clock of 2.00 GHz is much lower than the boost clock of 5.20 GHz. That spread suggests the processor will often operate at low frequency under light load and reach high frequency only when power and thermals allow. During sustained all-core workloads, the 54 W TDP is likely to limit how long the chip can hold 5.20 GHz. The record does not specify how boost behavior is managed under extended load.

For cooling, a system built around this processor should use a solution capable of handling a 54 W mobile CPU without excessive fan noise or throttling. The integrated Radeon 890M GPU also generates heat within the same chassis, but the fact pack provides no separate power figure for the GPU. The practical result is that laptop design and thermal engineering will matter for sustained performance more than the raw TDP number alone.

FAQ

Q: What socket does the AMD Ryzen AI 9 HX 475 use?

A: AMD Socket FP8.

Q: How many cores and threads does the Ryzen AI 9 HX 475 have?

A: It has 12 cores and 24 threads, with a base clock of 2.00 GHz and a boost clock of 5.20 GHz.

Q: What memory types are supported?

A: DDR5 and LPDDR5X, with a dual-channel memory bus and a listed bandwidth of 89.6 GB/s. ECC memory is not supported.

Q: Does the processor include integrated graphics?

A: Yes, the integrated GPU is the Radeon 890M.

Q: What PCIe capabilities are listed?

A: PCIe Gen 4 with 16 lanes available from the CPU only.

Q: Is the multiplier unlocked for overclocking?

A: No, the multiplierUnlocked field is false.

Who Should Consider It

Since no benchmark scores are present in this record, workload recommendations are grounded in the specification data rather than measured deltas. The 12-core / 24-thread configuration makes this processor a reasonable fit for creation workloads that can use many threads. The 5.20 GHz boost clock also provides strong single-thread headroom for the parts of those workloads that depend on fewer threads. The shared L3 cache is 16 MB, while each core has 80 KB of L1 and 1 MB of L2 cache, which gives the processor a solid local cache structure.

For gaming, the integrated Radeon 890M means a discrete GPU is not required for basic graphics usage. The high boost clock should help with latency-sensitive game logic and lightly threaded game tasks. However, the absence of any benchmark scores means exact frame rate expectations cannot be stated from this record. A buyer who needs high-end gaming performance should look for measured results, because the data here does not establish how strong the integrated GPU is in actual games.

For office and productivity use, this is a capable mobile part. Twenty-four threads can handle multitasking and background workloads easily, while the 54 W TDP allows the processor to fit into portable laptops rather than requiring a heavy cooling system. The dual-channel memory bus with 89.6 GB/s bandwidth is also enough for general productivity and integrated graphics use. The lack of ECC support means this is not a good fit for users who specifically need error-correcting memory. The locked multiplier also removes overclocking as a feature. The 50th percentile all-CPU ranking should not be used as a buying signal; the stronger indicators are the core count, thread count, boost clock, and mobile TDP.

Single-Thread vs Multi-Thread Behavior

The single-thread and multi-thread behavior of the Ryzen AI 9 HX 475 can be inferred from the clock and core specifications. The boost clock of 5.20 GHz provides a high single-thread ceiling. That is useful for workloads where one or a small number of threads dominate the workload and where responsiveness matters. The lower base clock of 2.00 GHz means the processor does not promise high frequency at idle or under very light load; instead it can scale upward when the workload demands it.

The multi-thread side is defined by 12 cores and 24 threads. This is a substantial parallel resource for a mobile processor. Tasks that spread well across cores can benefit from the thread count, but the 54 W TDP will constrain how much of that parallel capacity can be sustained at high frequency. Under an all-core load, the processor may not be able to hold 5.20 GHz on all cores simultaneously. The exact sustained frequency depends on the laptop cooling solution and the power delivery design, neither of which is quantified in the fact pack.

The fact pack labels the generation as Ryzen AI 400 (Zen 5 / Zen 5c), which suggests a mix of core types may exist within this generation, but it does not state how the 12 cores are divided between Zen 5 and Zen 5c cores. That distinction cannot be analyzed from this record. What is clear is that this processor is balanced on paper: it combines a high boost clock with a high thread count. Lightly threaded workloads will prefer the boost clock, while parallel workloads will prefer the core and thread count. Without benchmark scores, the crossover point between those two behavior patterns remains unmeasured.