Intel Core 9 273PE vs Qualcomm Snapdragon X1P-26-100 Comparison

Intel
INTEL

Intel Core 9 273PE

CORE STATE Bartlett Lake
CORE SPECS 12 Cores / 24 Threads
CLOCK SPEED 2.3 Base / 5.7 GHz Turbo
CACHE 36 MB (shared)
MAX TDP 65W
ARCHITECTURE Bartlett Lake
nm
PROCESS 10 nm
LAUNCH DATE 2026
VS
Unknown
CPU

Snapdragon X1P-26-100

CORE STATE Oryon
CORE SPECS 8 Cores / 8 Threads
CLOCK SPEED 3 Base
CACHE 6 MB (shared)
MAX TDP 25W
ARCHITECTURE Oryon
nm
PROCESS 4 nm
LAUNCH DATE 2024

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
3,153
N/A
cinebench_cinebench_r15_singlecore
445
N/A
cinebench_cinebench_r20_multicore
13,140
N/A
cinebench_cinebench_r20_singlecore
1,855
N/A
cinebench_cinebench_r23_multicore
31,288
N/A
cinebench_cinebench_r23_singlecore
4,417
N/A
passmark_data_compression
405,885
N/A
passmark_data_encryption
22,719
N/A
passmark_extended_instructions
24,630
N/A
passmark_find_prime_numbers
203
N/A
passmark_floating_point_math
107,884
N/A
passmark_integer_math
139,410
N/A
passmark_multithread
36,810
N/A
passmark_physics
3,120
N/A
passmark_random_string_sorting
45,098
N/A
passmark_single_thread
3,650
N/A
passmark_singlethread
3,650
N/A

Analysis: Intel Core 9 273PE vs Qualcomm Snapdragon X1P-26-100

Head-to-Head Benchmarks

The Intel Core 9 273PE enters the database with a substantial body of recorded scores, while the Qualcomm Snapdragon X1P-26-100 has no benchmark results listed. This creates an asymmetric comparison: the Intel part has 17 recorded data points across Cinebench and Passmark suites, whereas the Qualcomm processor has none. The database shows the Intel Core 9 273PE sits at the 90th percentile among all CPUs, with an average benchmark score of 49845. The Qualcomm Snapdragon X1P-26-100 sits at the 50th percentile with an average score of zero, reflecting its absence of measured data.

The Intel part delivers 3153 points in Cinebench R15 multicore and 445 in single-core. In R20, the scores are 13140 multicore and 1855 single-core. The R23 run shows 31288 multicore and 4417 single-core. Passmark results include 36810 in multithread, 3650 in single thread, 405885 in data compression, 22719 in data encryption, 24630 in extended instructions, 203 in find prime numbers, 107884 in floating point math, 139410 in integer math, 3120 in physics, and 45098 in random string sorting.

Because the Qualcomm chip has no scores, the head-to-head comparison cannot show margin data. The nearest rivals for the Intel part, however, provide context. The AMD Ryzen AI Max+ 388 averages 49796, a 0.1 percent advantage over the Intel part. The Intel Core i5-14600KF averages 49394, 0.9 percent behind. The Intel Core i9-13980HX averages 50398, 1.1 percent ahead. The AMD Ryzen AI 9 HX PRO 370 averages 50448, 1.2 percent ahead. These deltas show the Core 9 273PE performs within one to two percent of a tight cluster of high-end desktop and mobile processors.

Architecture Differences

The Intel Core 9 273PE uses a 10 nm process node fabricated by Intel, while the Qualcomm Snapdragon X1P-26-100 uses a 4 nm node from TSMC. The Intel part is built on the Bartlett Lake codename and belongs to the Core 9 (Bartlett Lake) generation. The Qualcomm part uses the Oryon codename and belongs to the Snapdragon X (Plus) generation.

Core counts differ sharply. The Intel chip has 12 cores and 24 threads, while the Qualcomm chip has 8 cores and 8 threads. The Intel part supports simultaneous multithreading, the Qualcomm part does not, given its thread count equals its core count. Base clocks show 2.30 GHz for Intel and 3.00 GHz for Qualcomm. The Intel part boosts to 5.70 GHz; the Qualcomm part has no boost clock listed.

Cache hierarchies are structured differently. The Intel part uses 80 KB L1 per core, 2 MB L2 per core, and 36 MB shared L3. The Qualcomm part uses 288 KB L1 per core, 12 MB L2 per module, and 6 MB shared L3. The Intel design allocates more total L3, while the Qualcomm design gives each core a larger L1 and each module a larger L2.

Memory support diverges: Intel supports DDR4 and DDR5 with dual-channel bus and 89.6 GB/s bandwidth, plus ECC memory support. Qualcomm supports LPDDR5X with dual-channel bus and 135.2 GB/s bandwidth, but no ECC. PCIe lanes also differ: Intel offers Gen 5 with 16 CPU lanes, Qualcomm offers Gen 4 with 12 CPU lanes.

Integrated graphics vary: Intel uses UHD Graphics 730, Qualcomm uses Adreno X1-45. The Intel part targets the desktop segment with a 65 W TDP, while the Qualcomm part targets mobile with 25 W TDP. The Intel part uses Intel Socket 1700; the Qualcomm part uses Qualcomm BGA 2073. The Intel part launched with a multiplier locked, as does the Qualcomm part. The Intel part carries part number SA4QD, the Qualcomm part X1P26100.

FAQ

Q: Which processor has a higher boost clock?

A: The Intel Core 9 273PE boosts to 5.70 GHz. The Qualcomm Snapdragon X1P-26-100 has no boost clock listed in the database.

Q: How do the core counts compare?

A: The Intel Core 9 273PE has 12 cores and 24 threads. The Qualcomm Snapdragon X1P-26-100 has 8 cores and 8 threads.

Q: Which chip supports ECC memory?

A: The Intel Core 9 273PE supports ECC memory. The Qualcomm Snapdragon X1P-26-100 does not.

Q: What is the process node difference?

A: The Intel Core 9 273PE uses a 10 nm process from Intel. The Qualcomm Snapdragon X1P-26-100 uses a 4 nm process from TSMC.

Q: Which processor has higher memory bandwidth?

A: The Qualcomm Snapdragon X1P-26-100 has 135.2 GB/s bandwidth. The Intel Core 9 273PE has 89.6 GB/s bandwidth.

Q: What are the market segments?

A: The Intel Core 9 273PE is a desktop processor. The Qualcomm Snapdragon X1P-26-100 is a mobile processor.

Specification Differences

| Field | Intel Core 9 273PE | Qualcomm Snapdragon X1P-26-100 |

|-------|-------------------|-------------------------------|

| Cores | 12 | 8 |

| Threads | 24 | 8 |

| Base clock | 2.30 GHz | 3.00 GHz |

| Boost clock | 5.70 GHz | Not listed |

| TDP | 65 W | 25 W |

| Socket | Intel Socket 1700 | Qualcomm BGA 2073 |

| Codename | Bartlett Lake | Oryon |

| Generation | Core 9 (Bartlett Lake) | Snapdragon X (Plus) |

| Process node | 10 nm | 4 nm |

| Foundry | Intel | TSMC |

| L1 cache | 80 KB (per core) | 288 KB (per core) |

| L2 cache | 2 MB (per core) | 12 MB (per module) |

| L3 cache | 36 MB (shared) | 6 MB (shared) |

| Memory support | DDR4, DDR5 | LPDDR5X |

| Memory bus | Dual-channel | Dual-channel |

| Memory bandwidth | 89.6 GB/s | 135.2 GB/s |

| ECC memory | Yes | No |

| PCIe | Gen 5, 16 Lanes (CPU only) | Gen 4, 12 Lanes (CPU only) |

| Integrated graphics | UHD Graphics 730 | Adreno X1-45 |

| Market segment | Desktop | Mobile |

| Release date | 2026-03-08 | 2024-08-27 |

| Launch MSRP | $549 | Not listed |

| Multiplier unlocked | No | No |

| Part number | SA4QD | X1P26100 |

| Percentile | 90th | 50th |

| Average benchmark score | 49845 | 0 |

The Verdict

The benchmark data strongly favors the Intel Core 9 273PE, but only because the Qualcomm Snapdragon X1P-26-100 has no recorded scores. The Intel part delivers measured results across multiple Cinebench and Passmark tests, placing it at the 90th percentile of all CPUs. The Qualcomm part sits at the 50th percentile with zero average score, meaning the database contains no performance evidence for it.

The Intel part shows a 0.1 percent deficit against the AMD Ryzen AI Max+ 388, a 0.9 percent lead over the Intel Core i5-14600KF, a 1.1 percent deficit against the Intel Core i9-13980HX, and a 1.2 percent deficit against the AMD Ryzen AI 9 HX PRO 370. These margins place the Core 9 273PE in a competitive band among high-end processors, with no rival exceeding it by more than 1.2 percent.

Architecturally, the two chips target different use cases. The Intel part offers 12 cores, 24 threads, a 5.70 GHz boost, 36 MB of L3, ECC support, PCIe Gen 5, and DDR4/DDR5 memory. The Qualcomm part offers 8 cores, 8 threads, a 3.00 GHz base clock, 6 MB of L3, LPDDR5X memory, and PCIe Gen 4. The Intel chip is a desktop part with a 65 W TDP; the Qualcomm chip is a mobile part with a 25 W TDP. The Intel launch MSRP is $549.

The data shows the Intel Core 9 273PE is a measurable, high-percentile desktop processor with competitive scores against its nearest rivals. The Qualcomm Snapdragon X1P-26-100 has no benchmark presence in the database, so no performance verdict can be derived from recorded measurements. The specification sheet indicates a mobile, power-efficient design with higher memory bandwidth and a smaller process node, but without scores, the database cannot confirm its relative performance. Buyers choosing strictly from recorded data would select the Intel part. Those requiring a mobile form factor with lower TDP would consider the Qualcomm part on its listed specifications alone.

DETAILED SPECIFICATIONS

SPECIFICATION
9 273PE
Snapdragon X1P-26-100
Core Specs
Cores
12
8 -33.3%
Threads
24
8 -66.7%
Base Clock (GHz)
2.3
3 +30.4%
Boost Clock (GHz)
5.7
—
Frequency (GHz)
2.3
3 +30.4%
Turbo Clock (GHz)
5.7
—
Multiplier
23
30 +30.4%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
80 KB (per core)
288 KB (per core)
L2 Cache
2 MB (per core)
12 MB (per module)
L3 Cache
36 MB (shared)
6 MB (shared)
Power
TDP (W)
65
25 -61.5%
PL1
65 W
—
PL2
219 W
35 W
Architecture
Codename
Bartlett Lake
Oryon
Generation
Core 9 (Bartlett Lake)
Snapdragon X (Plus)
Process Size
10 nm
4 nm
Foundry
Intel
TSMC
Memory
Memory Support
DDR4, DDR5
LPDDR5X
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
89.6 GB/s
135.2 GB/s
ECC Memory
Yes
No
DDR4 Speed
3200 MT/s
—
Platform
Socket
Intel Socket 1700
Qualcomm BGA 2073
Chipsets
W680, R680E, Q670e, Q670, H610E, H610
—
PCIe
Gen 5, 16 Lanes(CPU only)
Gen 4, 12 Lanes(CPU only)
Intel Hybrid
P-Core Turbo
5.4 GHz
—
AI/NPU
NPU
—
Yes / 45 TOPS
Graphics
Integrated Graphics
UHD Graphics 730
Adreno X1-45
Other
Market
Desktop
Mobile
Production Status
Active
Active
Launch Price
$549
—
Part Number
SA4QD
X1P26100
Package
FC-LGA16A
FC-BGA
Tj Max
100°C
—
View Core 9 273PE Details View Snapdragon X1P-26-100 Details