AMD Ryzen 5 7600X3D vs Qualcomm Snapdragon X1P-26-100 Comparison

AMD
AMD

AMD Ryzen 5 7600X3D

CORE STATE Raphael
CORE SPECS 6 Cores / 12 Threads
CLOCK SPEED 4.1 Base / 4.7 GHz Turbo
CACHE 96 MB (shared)
MAX TDP 65W
ARCHITECTURE Zen 4
nm
PROCESS 5 nm
LAUNCH DATE 2024
VS
Unknown
CPU

Snapdragon X1P-26-100

CORE STATE Oryon
CORE SPECS 8 Cores / 8 Threads
CLOCK SPEED 3 Base
CACHE 6 MB (shared)
MAX TDP 25W
ARCHITECTURE Oryon
nm
PROCESS 4 nm
LAUNCH DATE 2024

PERFORMANCE BENCHMARKS

3dmark_16_threads
5,906
N/A
3dmark_2_threads
1,840
N/A
3dmark_4_threads
3,498
N/A
3dmark_8_threads
5,215
N/A
3dmark_max_threads
5,956
N/A
3dmark_single_thread
944
N/A
cinebench_cinebench_r15_multicore
2,193
N/A
cinebench_cinebench_r15_singlecore
309
N/A
cinebench_cinebench_r20_multicore
9,138
N/A
cinebench_cinebench_r20_singlecore
1,289
N/A
cinebench_cinebench_r23_multicore
21,758
N/A
cinebench_cinebench_r23_singlecore
3,071
N/A
passmark_data_compression
281,665
N/A
passmark_data_encryption
16,237
N/A
passmark_extended_instructions
21,108
N/A
passmark_find_prime_numbers
234
N/A
passmark_floating_point_math
44,289
N/A
passmark_integer_math
73,804
N/A
passmark_multithread
25,855
N/A
passmark_physics
2,906
N/A
passmark_random_string_sorting
34,318
N/A
passmark_single_thread
3,605
N/A
passmark_singlethread
3,605
N/A

Analysis: AMD Ryzen 5 7600X3D vs Qualcomm Snapdragon X1P-26-100

AMD Ryzen 5 7600X3D vs Qualcomm Snapdragon X1P-26-100

The database contains no shared benchmark results for these two processors, so a direct head-to-head comparison cannot be constructed from recorded measurements. The AMD Ryzen 5 7600X3D carries 23 benchmark entries across 3DMark, Cinebench, and PassMark suites, while the Qualcomm Snapdragon X1P-26-100 has no benchmark scores in the database. The AMD part holds an average benchmark score of 24,728, placing it in the 77th percentile of all CPUs, whereas the Snapdragon has an average score of 0 and sits at the 50th percentile, a position that reflects the absence of test data rather than measured performance.

Head-to-Head Benchmarks

Since the head-to-head benchmark array is empty, the comparison relies on the AMD processor’s individual scores and the Qualcomm processor’s lack of recorded results. The AMD Ryzen 5 7600X3D delivers a Cinebench R23 multi-core score of 21,758 and a single-core score of 3,071. In Cinebench R20, it reaches 9,138 multi-core and 1,289 single-core. The R15 results show 2,193 multi-core and 309 single-core. 3DMark results include 5,906 for 16 threads, 5,956 for max threads, 5,215 for 8 threads, 3,498 for 4 threads, 1,840 for 2 threads, and 944 for single-thread. PassMark tests show 73,804 in integer math, 44,289 in floating-point math, 25,855 in multithread, 3,605 in single-thread, 3,605 in singlethread, 2,906 in physics, 34318 in random string sorting, 21,108 in extended instructions, 16,237 in data encryption, 281,665 in data compression, and 234 in find prime numbers.

The Snapdragon X1P-26-100 has no benchmark scores in the database, so no wins or losses can be attributed to it. The wins counter shows 0 for both processors. The only meaningful interpretation is that the AMD chip has a complete performance profile, while the Qualcomm chip lacks any measurable data in the database. The AMD processor’s nearest rivals, based on average benchmark score, are the AMD Ryzen 7 5700X3D at 24,709 (0.1% behind), the AMD Ryzen 9 5900HX at 24,822 (0.4% ahead), the Intel Core 5 210H at 24,872 (0.6% ahead), and the Intel Core i5-12450HX at 24,576 (0.6% behind). These deltas are all within one percent, indicating the Ryzen 5 7600X3D sits in a tightly clustered performance band.

Architecture Differences

The AMD Ryzen 5 7600X3D uses the Zen 4 architecture with the Raphael codename, built on a 5 nm process at TSMC. It contains 6 cores and 12 threads, with a base clock of 4.10 GHz and a boost clock of 4.70 GHz. The thermal design power is 65 watts. The chip has 11,270 million transistors on a 71 mm² die. Cache consists of 64 KB L1 per core, 1 MB L2 per core, and 96 MB shared L3. This large L3 cache is the defining feature of the X3D line, providing substantial capacity for gaming and cache-sensitive workloads.

The Qualcomm Snapdragon X1P-26-100 uses the Oryon codename within the Snapdragon X Plus generation, built on a 4 nm process at TSMC. It contains 8 cores and 8 threads, with a base clock of 3.00 GHz and no boost clock listed. The thermal design power is 25 watts. Cache configuration is 288 KB L1 per core, 12 MB L2 per module, and 6 MB shared L3. The process node is one step smaller, but the cache hierarchy differs significantly: the AMD chip has a much larger shared L3, while the Qualcomm chip distributes more L2 per module.

Memory support diverges. The AMD processor uses DDR5 with dual-channel configuration and a memory bandwidth of 83.2 GB/s, and it supports ECC memory. The Qualcomm processor uses LPDDR5X with dual-channel configuration and a memory bandwidth of 135.2 GB/s, and it does not support ECC. The Qualcomm chip has a higher memory bandwidth figure, which reflects its mobile-oriented design with integrated memory controllers optimized for low-power LPDDR5X. The AMD chip’s PCIe interface is Gen 5 with 24 lanes (CPU only), while the Qualcomm chip uses Gen 4 with 12 lanes (CPU only). The AMD part integrates Radeon Graphics, while the Qualcomm part integrates Adreno X1-45.

The AMD processor uses the AMD Socket AM5, a desktop socket with replaceable processors. The Qualcomm processor uses the Qualcomm BGA 2073, a soldered mobile package. The AMD chip has a launch MSRP of $299 and a release date of August 29, 2024. The Qualcomm chip has no launch MSRP listed and a release date of August 27, 2024, two days earlier. Neither processor has an unlocked multiplier. The AMD part number is 100-000001721, and the Qualcomm part number is X1P26100.

The AMD processor belongs to the 7000 series and the Ryzen 5 generation (Zen 4 Raphael). The Qualcomm processor has no series designation, but its generation is listed as Snapdragon X (Plus). The AMD chip is marked as a Desktop market segment, while the Qualcomm chip is marked as Mobile. Both are listed as Active in production status.

The Verdict

The recorded data supports a clear choice for desktop workloads: the AMD Ryzen 5 7600X3D is the only processor in this comparison with measured performance. Its average benchmark score of 24,728 places it at the 77th percentile of all CPUs, and its nearest rivals are all within 0.6% of its average score, confirming it performs in the upper-mid range of desktop processors. The Qualcomm Snapdragon X1P-26-100 has no benchmark entries, an average score of 0, and no nearest rivals, so there is no basis for a performance comparison.

The AMD chip’s strengths are its 96 MB shared L3 cache, 12 threads from 6 cores, and boost clock of 4.70 GHz. The Qualcomm chip’s strengths are its 8 cores, smaller 4 nm process, lower 25 watt TDP, and higher memory bandwidth of 135.2 GB/s. However, without benchmark scores, these specifications cannot be translated into measured performance advantages. The AMD processor’s 65 watt TDP and desktop socket indicate a power-hungry but upgradeable platform, while the Qualcomm processor’s 25 watt TDP and BGA package indicate a power-efficient, fixed mobile solution.

For users selecting a processor based on database measurements, the AMD Ryzen 5 7600X3D is the only option with verified scores. The Qualcomm Snapdragon X1P-26-100 cannot be evaluated for performance, and its percentile ranking of 50 reflects missing data, not a measured midpoint. The AMD chip’s 77th percentile ranking is derived from actual benchmark results across multiple suites, providing a concrete reference point. No recommendation can be made for the Qualcomm chip because no data exists to support one.

Specification Differences

The two processors differ in every major specification field except for dual-channel memory bus and active production status. Core count differs: the AMD has 6 cores, the Qualcomm has 8. Thread count differs: the AMD has 12 threads, the Qualcomm has 8. Base clock differs: the AMD runs at 4.10 GHz, the Qualcomm at 3.00 GHz. The AMD lists a 4.70 GHz boost clock, while the Qualcomm lists no boost clock. TDP differs: 65 watts for AMD, 25 watts for Qualcomm. Socket differs: AMD Socket AM5 versus Qualcomm BGA 2073. Architecture differs: Zen 4 versus none listed. Codename differs: Raphael versus Oryon. Generation differs: Ryzen 5 (Zen 4 Raphael) versus Snapdragon X (Plus). Process node differs: 5 nm versus 4 nm, both at TSMC. Transistor count and die size are listed only for the AMD chip at 11,270 million and 71 mm², respectively; the Qualcomm chip has no values. Cache differs across all levels: L1 is 64 KB per core for AMD versus 288 KB per core for Qualcomm; L2 is 1 MB per core versus 12 MB per module; L3 is 96 MB shared versus 6 MB shared. Memory support differs: DDR5 versus LPDDR5X. Memory bandwidth differs: 83.2 GB/s versus 135.2 GB/s. ECC support differs: true for AMD, false for Qualcomm. PCIe differs: Gen 5 with 24 lanes versus Gen 4 with 12 lanes. Integrated graphics differ: Radeon Graphics versus Adreno X1-45. Market segment differs: Desktop versus Mobile. Release date differs by two days, August 29 versus August 27, 2024. Launch MSRP exists only for the AMD chip at $299. The multiplier is locked on both. Part numbers differ: 100-000001721 versus X1P26100.

FAQ

Q: Which processor has more cores in the database?

A: The Qualcomm Snapdragon X1P-26-100 has 8 cores, while the AMD Ryzen 5 7600X3D has 6 cores.

Q: What is the L3 cache size for each processor?

A: The AMD Ryzen 5 7600X3D has 96 MB shared L3 cache. The Qualcomm Snapdragon X1P-26-100 has 6 MB shared L3 cache.

Q: Which processor has a higher memory bandwidth specification?

A: The Qualcomm Snapdragon X1P-26-100 lists 135.2 GB/s, while the AMD Ryzen 5 7600X3D lists 83.2 GB/s.

Q: Does either processor support ECC memory?

A: Only the AMD Ryzen 5 7600X3D supports ECC memory. The Qualcomm Snapdragon X1P-26-100 does not.

Q: What is the average benchmark score for each processor?

A: The AMD Ryzen 5 7600X3D has an average benchmark score of 24,728. The Qualcomm Snapdragon X1P-26-100 has an average benchmark score of 0, with no benchmark entries recorded.

Q: Which processor has a lower thermal design power?

A: The Qualcomm Snapdragon X1P-26-100 has a TDP of 25 watts, compared to the AMD Ryzen 5 7600X3D at 65 watts.

Where Each One Wins

The AMD Ryzen 5 7600X3D wins in every measured category because it is the only processor with benchmark results. Its Cinebench R23 multi-core score of 21,758 and single-core score of 3,071 provide concrete data for both threaded and single-threaded workloads. The 96 MB shared L3 cache gives it a structural advantage for workloads that repeatedly access large datasets, and the 12 threads allow it to handle parallel tasks. The boost clock of 4.70 GHz and 65 watt TDP indicate a desktop processor designed for sustained performance under standard cooling. Its nearest rival, the AMD Ryzen 7 5700X3D, scores only 0.1% lower on average, while the Intel Core 5 210H scores 0.6% higher, placing the 7600X3D in a competitive mid-range desktop band.

The Qualcomm Snapdragon X1P-26-100 wins on specification-based attributes that do not require benchmark data. Its 8 cores exceed the AMD chip’s 6 cores, and its 25 watt TDP is less than half the AMD chip’s 65 watts, indicating a power efficiency advantage for mobile use. The 4 nm process node is smaller than the 5 nm AMD node, and the memory bandwidth of 135.2 GB/s is 62% higher than the AMD chip’s 83.2 GB/s, though this figure comes from the LPDDR5X memory standard rather than measured throughput. The Qualcomm chip’s 8 cores with 8 threads means no hyperthreading, but the core count alone suggests a design for parallel efficiency in a low-power envelope. The 288 KB L1 per core is larger than the AMD chip’s 64 KB per core, and the 12 MB L2 per module provides faster access to a per-module cache pool. The Qualcomm chip’s BGA socket and mobile market segment confirm it is intended for soldered, power-constrained devices, whereas the AMD chip’s AM5 socket and desktop segment target upgradeable systems.

The data shows no overlap in measured performance. The AMD chip’s 77th percentile ranking is based on real scores, while the Qualcomm chip’s 50th percentile is a placeholder for missing data. In the absence of benchmarks, the Qualcomm chip’s wins remain theoretical, derived from its lower power draw, higher memory bandwidth, and larger core count. The AMD chip’s wins are empirical, spanning 23 separate benchmark results across rendering, physics, encryption, compression, and math workloads.

DETAILED SPECIFICATIONS

SPECIFICATION
5 7600X3D
Snapdragon X1P-26-100
Core Specs
Cores
6
8 +33.3%
Threads
12
8 -33.3%
Base Clock (GHz)
4.1
3 -26.8%
Boost Clock (GHz)
4.7
—
Frequency (GHz)
4.1
3 -26.8%
Turbo Clock (GHz)
4.7
—
Multiplier
41
30 -26.8%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
288 KB (per core)
L2 Cache
1 MB (per core)
12 MB (per module)
L3 Cache
96 MB (shared)
6 MB (shared)
Power
TDP (W)
65
25 -61.5%
PL2
—
35 W
PPT
88 W
—
Architecture
Architecture
Zen 4
—
Codename
Raphael
Oryon
Generation
Ryzen 5 (Zen 4 (Raphael))
Snapdragon X (Plus)
Process Size
5 nm
4 nm
Transistors
11,270 million
—
Die Size
71 mm²
—
Foundry
TSMC
TSMC
Memory
Memory Support
DDR5
LPDDR5X
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
83.2 GB/s
135.2 GB/s
ECC Memory
Yes
No
Platform
Socket
AMD Socket AM5
Qualcomm BGA 2073
Chipsets
X670E, X670, B650E, B650, A620
—
PCIe
Gen 5, 24 Lanes(CPU only)
Gen 4, 12 Lanes(CPU only)
AMD Multi-Die
IO Process Size
6 nm
—
AI/NPU
NPU
—
Yes / 45 TOPS
Graphics
Integrated Graphics
Radeon Graphics
Adreno X1-45
Other
Market
Desktop
Mobile
Production Status
Active
Active
Launch Price
$299
—
Part Number
100-000001721
X1P26100
Package
FC-LGA1718
FC-BGA
Tj Max
89°C
—
Bundled Cooler
None
—
View Ryzen 5 7600X3D Details View Snapdragon X1P-26-100 Details