Intel Core 5 211E vs Qualcomm Snapdragon X1P-26-100 Comparison

Intel
INTEL

Intel Core 5 211E

CORE STATE Bartlett Lake
CORE SPECS 10 Cores / 16 Threads
CLOCK SPEED 2.7 Base / 4.9 GHz Turbo
CACHE 20 MB (shared)
MAX TDP 65W
ARCHITECTURE Bartlett Lake
nm
PROCESS 10 nm
LAUNCH DATE 2025
VS
Unknown
CPU

Snapdragon X1P-26-100

CORE STATE Oryon
CORE SPECS 8 Cores / 8 Threads
CLOCK SPEED 3 Base
CACHE 6 MB (shared)
MAX TDP 25W
ARCHITECTURE Oryon
nm
PROCESS 4 nm
LAUNCH DATE 2024

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
2,055
N/A
cinebench_cinebench_r15_singlecore
289
N/A
cinebench_cinebench_r20_multicore
8,563
N/A
cinebench_cinebench_r20_singlecore
1,208
N/A
cinebench_cinebench_r23_multicore
20,389
N/A
cinebench_cinebench_r23_singlecore
2,878
N/A
passmark_data_compression
346,757
N/A
passmark_data_encryption
17,938
N/A
passmark_extended_instructions
21,592
N/A
passmark_find_prime_numbers
43
N/A
passmark_floating_point_math
66,402
N/A
passmark_integer_math
88,117
N/A
passmark_multithread
23,833
N/A
passmark_physics
702
N/A
passmark_random_string_sorting
34,308
N/A
passmark_single_thread
4,006
N/A
passmark_singlethread
4,006
N/A

Analysis: Intel Core 5 211E vs Qualcomm Snapdragon X1P-26-100

The Verdict

The data places the Intel Core 5 211E decisively ahead of the Qualcomm Snapdragon X1P-26-100 in raw processing capability. The Intel part holds an 86th percentile ranking among all CPUs, while the Qualcomm chip sits at the 50th percentile. The Intel processor delivers a full suite of benchmark scores, whereas the Qualcomm processor has no recorded benchmark entries in the database, leaving its measured performance undefined. For any workload requiring sustained multi-threaded compute, the Intel Core 5 211E is the clear choice based on available data. The Qualcomm Snapdragon X1P-26-100, with its lower core count and significantly lower TDP, targets a different usage profile, one where power efficiency and mobile integration take precedence over raw throughput. However, without benchmark scores for the Qualcomm part, direct performance comparison is impossible.

Architecture Differences

The two processors diverge fundamentally in their underlying design philosophies. The Intel Core 5 211E is a desktop part built on the Bartlett Lake architecture, manufactured on a 10 nm process at Intel's own foundry. It features 10 cores and 16 threads, indicating the presence of hyper-threading, with a base clock of 2.70 GHz and a boost clock of 4.90 GHz. The chip uses the Intel Socket 1700 platform and has a TDP of 65 watts. Its cache hierarchy is structured with 80 KB of L1 per core, 2 MB of L2 per core, and 20 MB of shared L3 cache. The die size is 257 mm².

The Qualcomm Snapdragon X1P-26-100 is a mobile processor built on the Oryon architecture, manufactured on a 4 nm process at TSMC. It has 8 cores and 8 threads, meaning no simultaneous multi-threading, with a base clock of 3.00 GHz and no recorded boost clock. The processor uses the Qualcomm BGA 2073 socket and has a TDP of just 25 watts. Its cache layout is notably different: 288 KB of L1 per core, 12 MB of L2 per module, and 6 MB of shared L3 cache. The die size is not recorded in the database. The process node advantage for Qualcomm, 4 nm versus 10 nm, is a significant architectural distinction, as is the foundry choice, TSMC versus Intel.

Memory support also separates the two. The Intel chip supports both DDR4 and DDR5 in a dual-channel configuration, with a memory bandwidth of 76.8 GB/s. The Qualcomm chip supports only LPDDR5X in a dual-channel configuration, but delivers a substantially higher memory bandwidth of 135.2 GB/s. The Intel processor supports ECC memory, while the Qualcomm part does not. PCIe connectivity differs as well: Intel offers Gen 5 with 16 CPU lanes, while Qualcomm provides Gen 4 with 12 CPU lanes. Integrated graphics are present on both, with Intel using UHD Graphics 730 and Qualcomm using Adreno X1-45.

Head-to-Head Benchmarks

The head-to-head benchmark table in the database contains no entries. Consequently, there are no direct comparative scores for the Intel Core 5 211E against the Qualcomm Snapdragon X1P-26-100. The Intel part has an extensive set of standalone benchmark results, while the Qualcomm part has none recorded. The Intel Core 5 211E achieves a Cinebench R23 multi-core score of 20,389 and a single-core score of 2,878. In Cinebench R20, it scores 8,563 multi-core and 1,208 single-core. Cinebench R15 results show 2,055 multi-core and 289 single-core. PassMark tests reveal a multi-thread score of 23,833 and a single-thread score of 4,006. In specific workloads, the Intel chip delivers 346,757 in data compression, 17,938 in data encryption, 21,592 in extended instructions, 43 in find prime numbers, 66,402 in floating point math, 88,117 in integer math, 702 in physics, and 34,308 in random string sorting. The average benchmark score for the Intel part is 37,829. These figures provide a full performance profile for the Intel processor. For the Qualcomm part, the absence of any benchmark data means no conclusions can be drawn about its measured performance relative to the Intel chip.

FAQ

Q: Which processor has a higher core count?

A: The Intel Core 5 211E has 10 cores and 16 threads. The Qualcomm Snapdragon X1P-26-100 has 8 cores and 8 threads.

Q: What is the TDP difference between the two?

A: The Intel Core 5 211E has a TDP of 65 watts. The Qualcomm Snapdragon X1P-26-100 has a TDP of 25 watts.

Q: Which processor supports ECC memory?

A: The Intel Core 5 211E supports ECC memory. The Qualcomm Snapdragon X1P-26-100 does not support ECC memory.

Q: How does memory bandwidth compare?

A: The Intel Core 5 211E has a memory bandwidth of 76.8 GB/s. The Qualcomm Snapdragon X1P-26-100 has a memory bandwidth of 135.2 GB/s, which is higher.

Q: What is the process node for each chip?

A: The Intel Core 5 211E is manufactured on a 10 nm process at Intel. The Qualcomm Snapdragon X1P-26-100 is manufactured on a 4 nm process at TSMC.

Q: What is the release date for each processor?

A: The Intel Core 5 211E was released on 2025-01-12. The Qualcomm Snapdragon X1P-26-100 was released on 2024-08-27.

Where Each One Wins

The Intel Core 5 211E wins in every measurable performance category, based on the recorded data. Its 10 cores and 16 threads provide a substantial advantage in multi-threaded workloads, as evidenced by its Cinebench R23 multi-core score of 20,389. The single-thread performance is also strong, with a Cinebench R23 single-core score of 2,878 and a PassMark single-thread score of 4,006. The processor's 86th percentile ranking among all CPUs confirms its position as a high-performance desktop part. The Intel chip also supports PCIe Gen 5 with 16 lanes, which is a generation ahead of the Qualcomm part's PCIe Gen 4 with 12 lanes. ECC memory support makes the Intel processor suitable for error-sensitive computing environments.

The Qualcomm Snapdragon X1P-26-100 wins in power efficiency and memory bandwidth. Its TDP of 25 watts is less than half that of the Intel part's 65 watts, making it a more suitable choice for thermally constrained mobile devices. The 4 nm process node at TSMC gives it a manufacturing advantage, potentially enabling better performance per watt, though no benchmark data exists to confirm this. The memory bandwidth of 135.2 GB/s is significantly higher than the Intel chip's 76.8 GB/s, which could benefit memory-intensive applications. The Qualcomm part also has a newer release date of 2024-08-27 for its platform, though the Intel chip's release date of 2025-01-12 is later. The integrated Adreno X1-45 graphics and LPDDR5X memory support indicate a design focused on mobile integration rather than raw compute throughput.

Specification Differences

The specifications where the two processors differ are extensive. The Intel Core 5 211E has 10 cores and 16 threads, while the Qualcomm Snapdragon X1P-26-100 has 8 cores and 8 threads. The base clock for Intel is 2.70 GHz versus 3.00 GHz for Qualcomm. The Intel chip has a boost clock of 4.90 GHz, while the Qualcomm part has no recorded boost clock. TDP differs substantially: 65 watts for Intel versus 25 watts for Qualcomm. The sockets are different: Intel Socket 1700 versus Qualcomm BGA 2073. The codenames are Bartlett Lake for Intel and Oryon for Qualcomm. The process nodes are 10 nm for Intel and 4 nm for Qualcomm, with foundries of Intel and TSMC respectively. The die size is 257 mm² for Intel and not recorded for Qualcomm.

Cache structures differ in every level. Intel uses 80 KB of L1 per core, 2 MB of L2 per core, and 20 MB of shared L3. Qualcomm uses 288 KB of L1 per core, 12 MB of L2 per module, and 6 MB of shared L3. Memory support is DDR4 and DDR5 for Intel, while Qualcomm supports LPDDR5X only. Memory bandwidth is 76.8 GB/s for Intel and 135.2 GB/s for Qualcomm. ECC memory is supported on Intel but not on Qualcomm. PCIe is Gen 5 with 16 lanes for Intel, versus Gen 4 with 12 lanes for Qualcomm. Integrated graphics are UHD Graphics 730 for Intel and Adreno X1-45 for Qualcomm. The market segment is Desktop for Intel and Mobile for Qualcomm. The release dates are 2025-01-12 for Intel and 2024-08-27 for Qualcomm. The launch MSRP for the Intel Core 5 211E is $221; no MSRP is recorded for the Qualcomm part. The Intel part number is SRQERQ65F, while the Qualcomm part number is X1P26100. The Intel processor's generation is recorded as "Core 5 (Bartlett Lake)", while the Qualcomm processor's generation is "Snapdragon X (Plus)". Both processors have locked multipliers.

DETAILED SPECIFICATIONS

SPECIFICATION
5 211E
Snapdragon X1P-26-100
Core Specs
Cores
10
8 -20.0%
Threads
16
8 -50.0%
Base Clock (GHz)
2.7
3 +11.1%
Boost Clock (GHz)
4.9
—
Frequency (GHz)
2.7
3 +11.1%
Turbo Clock (GHz)
4.9
—
Multiplier
27
30 +11.1%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
80 KB (per core)
288 KB (per core)
L2 Cache
2 MB (per core)
12 MB (per module)
L3 Cache
20 MB (shared)
6 MB (shared)
Power
TDP (W)
65
25 -61.5%
PL1
65 W
—
PL2
148 W
35 W
Architecture
Codename
Bartlett Lake
Oryon
Generation
Core 5 (Bartlett Lake)
Snapdragon X (Plus)
Process Size
10 nm
4 nm
Die Size
257 mm²
—
Foundry
Intel
TSMC
Memory
Memory Support
DDR4, DDR5
LPDDR5X
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
76.8 GB/s
135.2 GB/s
ECC Memory
Yes
No
DDR4 Speed
3200 MT/s
—
Platform
Socket
Intel Socket 1700
Qualcomm BGA 2073
Chipsets
W680, R680E, Q670e, Q670, H610E, H610
—
PCIe
Gen 5, 16 Lanes(CPU only)
Gen 4, 12 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
P-Cores: 6 E-Cores: 4
—
E-Core Frequency
2000 MHz up to 3.7 GHz
—
AI/NPU
NPU
—
Yes / 45 TOPS
Graphics
Integrated Graphics
UHD Graphics 730
Adreno X1-45
Other
Market
Desktop
Mobile
Production Status
Active
Active
Launch Price
$221
—
Part Number
SRQERQ65F
X1P26100
Package
FC-LGA16A
FC-BGA
Tj Max
100°C
—
View Core 5 211E Details View Snapdragon X1P-26-100 Details