AMD Ryzen AI Embedded P132 vs Intel Core 3 201TE Comparison

AMD
AMD

AMD Ryzen AI Embedded P132

CORE STATE Gorgon Point
CORE SPECS 6 Cores / 12 Threads
CLOCK SPEED 2 Base / 4.5 GHz Turbo
CACHE 4 MB
MAX TDP 28W
ARCHITECTURE Gorgon Point
nm
PROCESS 4 nm
LAUNCH DATE 2026
VS
Intel
INTEL

Core 3 201TE

CORE STATE Bartlett Lake
CORE SPECS 4 Cores / 8 Threads
CLOCK SPEED 2.9 Base / 4.6 GHz Turbo
CACHE 12 MB (shared)
MAX TDP 45W
ARCHITECTURE Bartlett Lake
nm
PROCESS 10 nm
LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

passmark_data_compression
230,437
N/A
passmark_data_encryption
11,444
N/A
passmark_extended_instructions
16,520
N/A
passmark_find_prime_numbers
57
N/A
passmark_floating_point_math
42,248
N/A
passmark_integer_math
62,249
N/A
passmark_multithread
19,262
N/A
passmark_physics
1,022
N/A
passmark_random_string_sorting
25,181
N/A
passmark_single_thread
3,713
N/A
passmark_singlethread
3,713
N/A

Analysis: AMD Ryzen AI Embedded P132 vs Intel Core 3 201TE

Head-to-Head Benchmarks

The database does not contain direct head-to-head benchmark runs for the AMD Ryzen AI Embedded P132 and the Intel Core 3 201TE. The AMD processor has a full set of recorded PassMark results, while the Intel part has no benchmark entries at all. This makes a side-by-side comparison of individual test scores impossible.

What the data does show is the AMD Ryzen AI Embedded P132 posting an average benchmark score of 37804, which places it at the 86th percentile among all CPUs in the database. The Intel Core 3 201TE sits at the 50th percentile with an average benchmark score of 0, meaning no performance data has been recorded for it yet. The absence of scores for the Intel part means every comparative statement in this analysis relies on architectural and specification differences rather than measured performance.

For context on where the AMD chip lands, its nearest rivals in the database include the Intel Core 5 211E with an average score of 37829 and a delta of -0.1%, the AMD Ryzen AI 5 PRO 435 at 37762 with a delta of 0.1%, the AMD Ryzen AI 9 HX 370 at 37904 with a delta of -0.3%, and the Intel Core i9-14901E at 37911 with a delta of -0.3%. These deltas are all within a fraction of a percent, indicating the P132 sits in a tightly packed performance cluster. The P132 is effectively indistinguishable from these four rivals in average score, trailing the strongest by 0.3% and leading the weakest by 0.1%.

Where Each One Wins

Since the Intel Core 3 201TE has no recorded benchmarks, the only wins that can be assigned come from specification advantages. The AMD Ryzen AI Embedded P132 wins on core count, offering 6 cores and 12 threads against the Intel part's 4 cores and 8 threads. It also wins on process technology, using a 4 nm node from TSMC versus Intel's 10 nm node. The AMD chip supports LPDDR5X memory in addition to DDR5, while the Intel part supports DDR4 and DDR5. Memory bandwidth favors AMD at 89.6 GB/s versus Intel's 76.8 GB/s.

The Intel Core 3 201TE wins on clock speeds. Its base clock of 2.90 GHz beats the AMD's 2.00 GHz, and its boost clock of 4.60 GHz edges out the AMD's 4.50 GHz. The Intel part also has a larger L3 cache at 12 MB shared versus AMD's 4 MB, and more L2 cache per core at 1.25 MB versus 1 MB. The Intel chip supports PCIe Gen 5 with 16 lanes, while the AMD chip uses PCIe Gen 4 with 14 lanes. The Intel part has a larger die at 163 mm², though the AMD die size is not recorded. The Intel part carries a launch MSRP of $134, while the AMD part has no recorded launch MSRP.

Architecture Differences

The AMD Ryzen AI Embedded P132 uses the Gorgon Point codename and belongs to the Ryzen AI Embedded generation built on Zen 5 and Zen 5c cores. It is fabricated by TSMC on a 4 nm process. The chip has 6 cores and 12 threads, with an L1 cache of 80 KB per core, L2 cache of 1 MB per core, and 4 MB of L3 cache. It uses AMD Socket FP8 and is classified as a mobile market segment part. The integrated graphics are Radeon 840M. The processor supports DDR5 and LPDDR5X memory over a dual-channel bus, with 89.6 GB/s of memory bandwidth. ECC memory is supported. PCIe connectivity is Gen 4 with 14 lanes from the CPU. The part was released on March 8, 2026, and remains in active production. The multiplier is locked.

The Intel Core 3 201TE uses the Bartlett Lake codename and belongs to the Core 3 generation. It is fabricated by Intel on a 10 nm process. The chip has 4 cores and 8 threads, with an L1 cache of 80 KB per core, L2 cache of 1.25 MB per core, and 12 MB of shared L3 cache. It uses Intel Socket 1700 and is classified as a desktop market segment part. The integrated graphics are UHD Graphics 730. The processor supports DDR4 and DDR5 memory over a dual-channel bus, with 76.8 GB/s of memory bandwidth. ECC memory is supported. PCIe connectivity is Gen 5 with 16 lanes from the CPU. The die size is 163 mm². The part was released on January 12, 2025, and remains in active production. The multiplier is locked. The part number is SRPKDQ5CK.

The architectural split is stark. AMD uses a newer, denser process node with more cores and higher memory bandwidth. Intel uses a larger process node but compensates with higher clocks, a substantially larger L3 cache, and newer PCIe generation support. The AMD part targets mobile platforms with a 28 W TDP, while the Intel part targets desktop platforms with a 45 W TDP.

FAQ

Q: Which processor has more cores and threads?

A: The AMD Ryzen AI Embedded P132 has 6 cores and 12 threads, while the Intel Core 3 201TE has 4 cores and 8 threads.

Q: What are the clock speed differences?

A: The Intel Core 3 201TE has a base clock of 2.90 GHz and a boost clock of 4.60 GHz. The AMD Ryzen AI Embedded P132 has a base clock of 2.00 GHz and a boost clock of 4.50 GHz.

Q: Which processor supports faster memory bandwidth?

A: The AMD Ryzen AI Embedded P132 supports 89.6 GB/s of memory bandwidth. The Intel Core 3 201TE supports 76.8 GB/s. Both use dual-channel memory buses, but AMD supports LPDDR5X in addition to DDR5, while Intel supports DDR4 and DDR5.

Q: How do the cache configurations differ?

A: The AMD Ryzen AI Embedded P132 has 80 KB of L1 per core, 1 MB of L2 per core, and 4 MB of L3. The Intel Core 3 201TE has 80 KB of L1 per core, 1.25 MB of L2 per core, and 12 MB of shared L3.

Q: Which processor uses a newer PCIe standard?

A: The Intel Core 3 201TE supports PCIe Gen 5 with 16 lanes. The AMD Ryzen AI Embedded P132 supports PCIe Gen 4 with 14 lanes.

Q: What are the process nodes and foundries?

A: The AMD Ryzen AI Embedded P132 is built on a 4 nm process by TSMC. The Intel Core 3 201TE is built on a 10 nm process by Intel.

Q: What is the Intel Core 3 201TE launch MSRP?

A: The launch MSRP is $134. The AMD Ryzen AI Embedded P132 has no recorded launch MSRP.

Specification Differences

| Specification | AMD Ryzen AI Embedded P132 | Intel Core 3 201TE |

|---|---|---|

| Cores | 6 | 4 |

| Threads | 12 | 8 |

| Base Clock | 2.00 GHz | 2.90 GHz |

| Boost Clock | 4.50 GHz | 4.60 GHz |

| TDP | 28 W | 45 W |

| Socket | AMD Socket FP8 | Intel Socket 1700 |

| Codename | Gorgon Point | Bartlett Lake |

| Generation | Ryzen AI Embedded (Zen 5 / Zen 5c) | Core 3 (Bartlett Lake) |

| Process Node | 4 nm | 10 nm |

| Foundry | TSMC | Intel |

| Die Size | Not recorded | 163 mm² |

| L2 Cache | 1 MB (per core) | 1.25 MB (per core) |

| L3 Cache | 4 MB | 12 MB (shared) |

| Memory Support | DDR5, LPDDR5X | DDR4, DDR5 |

| Memory Bandwidth | 89.6 GB/s | 76.8 GB/s |

| PCIe | Gen 4, 14 Lanes (CPU only) | Gen 5, 16 Lanes (CPU only) |

| Integrated Graphics | Radeon 840M | UHD Graphics 730 |

| Market Segment | Mobile | Desktop |

| Release Date | March 8, 2026 | January 12, 2025 |

| Launch MSRP | Not recorded | $134 |

| Part Number | Unknown | SRPKDQ5CK |

| Percentile vs All CPUs | 86 | 50 |

| Average Benchmark Score | 37804 | 0 |

The Verdict

The data supports a clear division of roles. The AMD Ryzen AI Embedded P132 delivers measured performance at the 86th percentile, with an average benchmark score of 37804. It offers 6 cores and 12 threads, a 4 nm TSMC process, 89.6 GB/s memory bandwidth, and a 28 W TDP. This makes it suitable for workloads that need multi-threaded throughput in a mobile form factor, as indicated by its market segment classification and its placement among rivals like the Intel Core 5 211E and AMD Ryzen AI 9 HX 370, all of which score within 0.3% of each other.

The Intel Core 3 201TE has no recorded benchmark scores, placing it at the 50th percentile with an average score of 0. It provides 4 cores and 8 threads, higher base and boost clocks, a 12 MB L3 cache, PCIe Gen 5 support, and DDR4 compatibility. Its 45 W TDP and desktop market segment indicate a fixed-platform design. The 10 nm process and larger die suggest an older manufacturing approach, but the higher clocks and larger cache could benefit lightly threaded tasks where per-core performance matters more than core count.

The measured performance data favors the AMD part for multi-threaded work. The specification data favors the Intel part for single-threaded clock speed, cache capacity, and PCIe bandwidth. A builder with workloads that scale across cores should look at the AMD Ryzen AI Embedded P132. A builder prioritizing DDR4 support, PCIe Gen 5 connectivity, or higher boost clocks should consider the Intel Core 3 201TE. The Intel part also has a recorded launch MSRP of $134, while the AMD part does not. No direct benchmark comparison exists in the database, so the final choice rests on whether measured multi-threaded performance or raw clock and cache specifications matter more for the intended use.

DETAILED SPECIFICATIONS

SPECIFICATION
AI Embedded P132
3 201TE
Core Specs
Cores
6
4 -33.3%
Threads
12
8 -33.3%
Base Clock (GHz)
2
2.9 +45.0%
Boost Clock (GHz)
4.5
4.6 +2.2%
Frequency (GHz)
2
2.9 +45.0%
Turbo Clock (GHz)
4.5
4.6 +2.2%
Multiplier
20
29 +45.0%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
80 KB (per core)
80 KB (per core)
L2 Cache
1 MB (per core)
1.25 MB (per core)
L3 Cache
4 MB
12 MB (shared)
Power
TDP (W)
28
45 +60.7%
PL1
45 W
PL2
106 W
Configurable TDP
15-54 W
Architecture
Codename
Gorgon Point
Bartlett Lake
Generation
Ryzen AI Embedded (Zen 5 / Zen 5c)
Core 3 (Bartlett Lake)
Process Size
4 nm
10 nm
Die Size
163 mm²
Foundry
TSMC
Intel
Memory
Memory Support
DDR5, LPDDR5X
DDR4, DDR5
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
89.6 GB/s
76.8 GB/s
ECC Memory
Yes
Yes
DDR4 Speed
3200 MT/s
Platform
Socket
AMD Socket FP8
Intel Socket 1700
Chipsets
W680, R680E, Q670e, Q670, H610E, H610
PCIe
Gen 4, 14 Lanes(CPU only)
Gen 5, 16 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
2 + 4
E-Core Frequency
2000 MHz up to 3.4 GHz
AI/NPU
NPU
Yes / 50 TOPS
Graphics
Integrated Graphics
Radeon 840M
UHD Graphics 730
Other
Market
Mobile
Desktop
Production Status
Active
Active
Launch Price
$134
Part Number
unknown
SRPKDQ5CK
Package
FP8
FC-LGA16A
Tj Max
105°C
100°C
View Ryzen AI Embedded P132 Details View Core 3 201TE Details