CPU Comparison

A

AMD

AMD

AMD Ryzen 9 3900

CORE STATE Matisse

CORE SPECS 12 Cores / 24 Threads

CLOCK SPEED 3.1 Base / 4.3 GHz Turbo

CACHE 64 MB

MAX TDP 65W

ARCHITECTURE Zen 2

nm

PROCESS 7 nm

LAUNCH DATE 2019

VS

A

AMD

AMD

Ryzen AI 9 HX 370

CORE STATE Strix Point

CORE SPECS 12 Cores / 24 Threads

CLOCK SPEED 2000 Base / 5.1 GHz Turbo

CACHE 16 MB

MAX TDP 28W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE —

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

2,619

3,010

cinebench_cinebench_r15_singlecore

369

425

cinebench_cinebench_r20_multicore

10,914

12,545

cinebench_cinebench_r20_singlecore

1,540

1,771

cinebench_cinebench_r23_multicore

25,988

29,870

cinebench_cinebench_r23_singlecore

3,669

4,217

passmark_data_compression

413,887

445,719

passmark_data_encryption

26,657

22,252

passmark_extended_instructions

26,073

31,653

passmark_find_prime_numbers

203

126

passmark_floating_point_math

56,730

76,892

passmark_integer_math

97,698

122,933

passmark_multithread

30,586

35,148

passmark_physics

1,617

1,881

passmark_random_string_sorting

44,902

48,723

passmark_single_thread

2,604

3,973

passmark_singlethread

2,604

3,973

3dmark_16_threads

N/A

9,365

3dmark_2_threads

N/A

2,179

3dmark_4_threads

N/A

3,970

3dmark_8_threads

N/A

6,992

3dmark_max_threads

N/A

9,725

3dmark_single_thread

N/A

1,153

DETAILED SPECIFICATIONS

SPECIFICATION

9 3900

AI 9 HX 370

Core Specs

Cores

12

12 0.0%

Threads

24

24 0.0%

Base Clock (GHz)

3.1

2,000 +64416.1%

Boost Clock (GHz)

4.3

5.1 +18.6%

Frequency (GHz)

3.1

2,000 +64416.1%

Turbo Clock (GHz)

4.3

5.1 +18.6%

Multiplier

31

20 -35.5%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

80 KB (per core)

L2 Cache

512 KB (per core)

1 MB (per core)

L3 Cache

64 MB

16 MB

Power

TDP (W)

65

28 -56.9%

PPT

88 W

—

Configurable TDP

—

15-54 W

Architecture

Architecture

Zen 2

Zen 5

Codename

Matisse

Strix Point

Generation

Ryzen 9 (Zen 2 (Matisse))

Ryzen AI (Zen 5)

Process Size

7 nm

4 nm

Transistors

7,600 million

—

Die Size

2x 74 mm²

233 mm²

Foundry

TSMC

TSMC

Memory

Memory Support

DDR4

DDR5, LPDDR5X

Memory Bus

Dual-channel

Dual-channel

Memory Bandwidth

51.2 GB/s

89.6 GB/s

ECC Memory

No

No

Platform

Socket

AMD Socket AM4

AMD Socket FP8

Chipsets

A300, X300, A320, B350, X370, B450, X470, A520, B550, X570

—

PCIe

Gen 4, 24 Lanes(CPU only)

Gen 4, 16 Lanes(CPU only)

Intel Hybrid

Hybrid Cores

—

4 + 8

E-Core Frequency

—

1400 MHz up to 3.3 GHz

AMD Multi-Die

IO Process Size

12 nm

—

AI/NPU

NPU

—

Yes / 50 TOPS

Graphics

Integrated Graphics

—

Radeon 890M

Other

Market

Desktop

Mobile

Production Status

Active

Active

Launch Price

$499

—

Part Number

100-000000070

100-000000994

Package

µOPGA-1331

FP8

Tj Max

95°C

100°C

View Ryzen 9 3900 Details View Ryzen AI 9 HX 370 Details