CPU Comparison

A

AMD

AMD

AMD Ryzen 9 3900

CORE STATE Matisse

CORE SPECS 12 Cores / 24 Threads

CLOCK SPEED 3.1 Base / 4.3 GHz Turbo

CACHE 64 MB

MAX TDP 65W

ARCHITECTURE Zen 2

nm

PROCESS 7 nm

LAUNCH DATE 2019

VS

i

Intel

INTEL

Core i7-1065G7

CORE STATE Ice Lake-U

CORE SPECS 4 Cores / 8 Threads

CLOCK SPEED 1300 Base / 3.9 GHz Turbo

CACHE 8 MB (shared)

MAX TDP 15W

ARCHITECTURE Ice Lake

nm

PROCESS 10 nm

LAUNCH DATE 2019

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

2,619

700

cinebench_cinebench_r15_singlecore

369

98

cinebench_cinebench_r20_multicore

10,914

2,920

cinebench_cinebench_r20_singlecore

1,540

412

cinebench_cinebench_r23_multicore

25,988

6,954

cinebench_cinebench_r23_singlecore

3,669

981

passmark_data_compression

413,887

88,300

passmark_data_encryption

26,657

4,552

passmark_extended_instructions

26,073

5,998

passmark_find_prime_numbers

203

29

passmark_floating_point_math

56,730

16,603

passmark_integer_math

97,698

28,660

passmark_multithread

30,586

8,185

passmark_physics

1,617

589

passmark_random_string_sorting

44,902

10,688

passmark_single_thread

2,604

2,295

passmark_singlethread

2,604

2,295

3dmark_16_threads

N/A

2,323

3dmark_2_threads

N/A

1,188

3dmark_4_threads

N/A

1,735

3dmark_8_threads

N/A

2,293

3dmark_max_threads

N/A

2,410

3dmark_single_thread

N/A

683

DETAILED SPECIFICATIONS

SPECIFICATION

9 3900

i7-1065G7

Core Specs

Cores

12

4 -66.7%

Threads

24

8 -66.7%

Base Clock (GHz)

3.1

1,300 +41835.5%

Boost Clock (GHz)

4.3

3.9 -9.3%

Frequency (GHz)

3.1

1,300 +41835.5%

Turbo Clock (GHz)

4.3

3.9 -9.3%

Multiplier

31

13 -58.1%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

80 KB (per core)

L2 Cache

512 KB (per core)

256 KB (per core)

L3 Cache

64 MB

8 MB (shared)

Power

TDP (W)

65

15 -76.9%

PPT

88 W

—

Architecture

Architecture

Zen 2

Ice Lake

Codename

Matisse

Ice Lake-U

Generation

Ryzen 9 (Zen 2 (Matisse))

Core i7 (Sunny Cove-U)

Process Size

7 nm

10 nm

Transistors

7,600 million

—

Die Size

2x 74 mm²

123 mm²

Foundry

TSMC

Intel

Memory

Memory Support

DDR4

DDR4

Memory Bus

Dual-channel

Dual-channel

Memory Bandwidth

51.2 GB/s

51.2 GB/s

ECC Memory

No

No

Platform

Socket

AMD Socket AM4

Intel BGA 1526

Chipsets

A300, X300, A320, B350, X370, B450, X470, A520, B550, X570

—

PCIe

Gen 4, 24 Lanes(CPU only)

Gen 3

AMD Multi-Die

IO Process Size

12 nm

—

Graphics

Integrated Graphics

—

Iris Plus

Other

Market

Desktop

Mobile

Production Status

Active

Active

Launch Price

$499

—

Part Number

100-000000070

SRG0N

Package

µOPGA-1331

FC-BGA16F

Tj Max

95°C

—

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